![ERM8-013-05.0-S-DV-DS-L-K-TR ERM8-013-05.0-S-DV-DS-L-K-TR](https://mm.digikey.com/Volume0/opasdata/d220001/medias/images/4208/ERM8-013-05.0-L-DV-DS-L-TR.jpg)
ERM8-013-05.0-S-DV-DS-L-K-TR Samtec Inc.
Виробник: Samtec Inc.
Description: CONN DIFF ARRAY PLG 26P SMD GOLD
Packaging: Tape & Reel (TR)
Features: Board Guide, Latches, Pick and Place
Connector Type: Differential Pair Array, Male
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 26
Pitch: 0.031" (0.80mm)
Height Above Board: 0.351" (8.91mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Mated Stacking Heights: 10mm, 12mm, 15mm
Part Status: Active
Number of Rows: 2
Description: CONN DIFF ARRAY PLG 26P SMD GOLD
Packaging: Tape & Reel (TR)
Features: Board Guide, Latches, Pick and Place
Connector Type: Differential Pair Array, Male
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 26
Pitch: 0.031" (0.80mm)
Height Above Board: 0.351" (8.91mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Mated Stacking Heights: 10mm, 12mm, 15mm
Part Status: Active
Number of Rows: 2
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Технічний опис ERM8-013-05.0-S-DV-DS-L-K-TR Samtec Inc.
Description: CONN DIFF ARRAY PLG 26P SMD GOLD, Packaging: Tape & Reel (TR), Features: Board Guide, Latches, Pick and Place, Connector Type: Differential Pair Array, Male, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 26, Pitch: 0.031" (0.80mm), Height Above Board: 0.351" (8.91mm), Contact Finish Thickness: 30.0µin (0.76µm), Mated Stacking Heights: 10mm, 12mm, 15mm, Part Status: Active, Number of Rows: 2.
Інші пропозиції ERM8-013-05.0-S-DV-DS-L-K-TR
Фото | Назва | Виробник | Інформація |
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ERM8-013-05.0-S-DV-DS-L-K-TR | Виробник : Samtec |
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