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D6417709SF133BV Renesas Electronics America Inc
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Description: IC MCU 32BIT ROMLESS 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 133MHz
RAM Size: 16K x 8
Operating Temperature: -20°C ~ 75°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: SH-3
Data Converters: A/D 8x10b; D/A 2x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.65V ~ 2.05V
Connectivity: EBI/EMI, FIFO, IrDA, SCI, SmartCard
Peripherals: DMA, POR, WDT
Supplier Device Package: 208-LQFP (28x28)
Number of I/O: 96
DigiKey Programmable: Not Verified
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Технічний опис D6417709SF133BV Renesas Electronics America Inc
Description: IC MCU 32BIT ROMLESS 208LQFP, Packaging: Tray, Package / Case: 208-LQFP, Mounting Type: Surface Mount, Speed: 133MHz, RAM Size: 16K x 8, Operating Temperature: -20°C ~ 75°C (TA), Oscillator Type: Internal, Program Memory Type: ROMless, Core Processor: SH-3, Data Converters: A/D 8x10b; D/A 2x8b, Core Size: 32-Bit Single-Core, Voltage - Supply (Vcc/Vdd): 1.65V ~ 2.05V, Connectivity: EBI/EMI, FIFO, IrDA, SCI, SmartCard, Peripherals: DMA, POR, WDT, Supplier Device Package: 208-LQFP (28x28), Number of I/O: 96, DigiKey Programmable: Not Verified.
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D6417709SF133BV | Виробник : Renesas Electronics |
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