Технічний опис CYT3DLABFBQ1AESGST Infineon Technologies
Description: TRAVEO-2 CLUST.2.5DGRAPH, Packaging: Tape & Reel (TR), Package / Case: 216-LQFP Exposed Pad, Mounting Type: Surface Mount, Speed: 100MHz, 240MHz, Program Memory Size: 4.06MB (4.06M x 8), RAM Size: 384K x 8, Operating Temperature: -40°C ~ 105°C (TA), Oscillator Type: External, Internal, Program Memory Type: FLASH, EEPROM Size: 128K x 8, Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7F, Data Converters: A/D 48x12b SAR, Core Size: 32-Bit Dual-Core, Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V, Connectivity: CANbus, Ethernet, I2C, LINbus, SPI, UART/USART, Peripherals: DMA, I2S, LVD, Temp Sensor, WDT, Supplier Device Package: 216-TEQFP (24x24), Number of I/O: 108.
Інші пропозиції CYT3DLABFBQ1AESGST
| Фото | Назва | Виробник | Інформація |
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Ціна без ПДВ |
|---|---|---|---|---|---|
| CYT3DLABFBQ1AESGST | Виробник : Infineon Technologies |
Description: TRAVEO-2 CLUST.2.5DGRAPH Packaging: Tape & Reel (TR) Package / Case: 216-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 100MHz, 240MHz Program Memory Size: 4.06MB (4.06M x 8) RAM Size: 384K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 128K x 8 Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7F Data Converters: A/D 48x12b SAR Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, Ethernet, I2C, LINbus, SPI, UART/USART Peripherals: DMA, I2S, LVD, Temp Sensor, WDT Supplier Device Package: 216-TEQFP (24x24) Number of I/O: 108 |
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| CYT3DLABFBQ1AESGST | Виробник : Infineon Technologies | Y |
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