CLP-105-02-L-DH-TR Samtec Inc.
Виробник: Samtec Inc.Description: CONN RCPT 10P 0.05 GOLD SMD R/A
Packaging: Tape & Reel (TR)
Connector Type: Receptacle
Voltage Rating: 240VAC, 330VDC
Current Rating (Amps): 3.3A per Contact
Mounting Type: Surface Mount, Right Angle
Number of Positions: 10
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Tin
Part Status: Active
Insulation Height: 0.135" (3.43mm)
Row Spacing - Mating: 0.050" (1.27mm)
Number of Rows: 2
на замовлення 5100 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1275+ | 122.67 грн |
| 2550+ | 109.98 грн |
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Технічний опис CLP-105-02-L-DH-TR Samtec Inc.
Description: CONN RCPT 10P 0.05 GOLD SMD R/A, Packaging: Tape & Reel (TR), Connector Type: Receptacle, Voltage Rating: 240VAC, 330VDC, Current Rating (Amps): 3.3A per Contact, Mounting Type: Surface Mount, Right Angle, Number of Positions: 10, Style: Board to Board, Operating Temperature: -55°C ~ 125°C, Contact Type: Female Socket, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Insulation Color: Black, Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Post: Tin, Part Status: Active, Insulation Height: 0.135" (3.43mm), Row Spacing - Mating: 0.050" (1.27mm), Number of Rows: 2.
Інші пропозиції CLP-105-02-L-DH-TR за ціною від 94.52 грн до 302.28 грн
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ | ||||||||||||||
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CLP-105-02-L-DH-TR | Виробник : Samtec Inc. |
Description: CONN RCPT 10P 0.05 GOLD SMD R/A Packaging: Cut Tape (CT) Connector Type: Receptacle Voltage Rating: 240VAC, 330VDC Current Rating (Amps): 3.3A per Contact Mounting Type: Surface Mount, Right Angle Number of Positions: 10 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Tin Part Status: Active Insulation Height: 0.135" (3.43mm) Row Spacing - Mating: 0.050" (1.27mm) Number of Rows: 2 |
на замовлення 5715 шт: термін постачання 21-31 дні (днів) |
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CLP-105-02-L-DH-TR | Виробник : Samtec |
Headers & Wire Housings Low Profile Dual-Wipe Socket, .050" Pitch |
на замовлення 965 шт: термін постачання 21-30 дні (днів) |
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CLP-105-02-L-DH-TR | Виробник : SAMTEC |
Description: SAMTEC - CLP-105-02-L-DH-TR - Printbuchse, Board-to-Board, 1.27 mm, 2 Reihe(n), 10 Kontakt(e), Oberflächenmontage, abgewinkelt tariffCode: 85366930 rohsCompliant: YES Kontaktüberzug: Vergoldete Kontakte hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: Phosphorbronze Steckverbindermontage: Oberflächenmontage, abgewinkelt usEccn: EAR99 Anzahl der Kontakte: 10Contacts euEccn: NLR Steckverbindersysteme: Board-to-Board Produktpalette: CLP productTraceability: No Anzahl der Reihen: 2Reihe(n) Rastermaß: 1.27mm SVHC: No SVHC (23-Jan-2024) |
на замовлення 95 шт: термін постачання 21-31 дні (днів) |
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