CLM-129-02-F-D-P Samtec Inc.
Виробник: Samtec Inc.
Description: CONN RCPT 58POS 0.039 GOLD SMD
Packaging: Tube
Features: Pick and Place
Connector Type: Receptacle
Current Rating (Amps): 2.8A per Contact
Mounting Type: Surface Mount
Number of Positions: 58
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 3.00µin (0.076µm)
Contact Finish - Post: Tin
Insulation Height: 0.084" (2.14mm)
Row Spacing - Mating: 0.039" (1.00mm)
Number of Rows: 2
Description: CONN RCPT 58POS 0.039 GOLD SMD
Packaging: Tube
Features: Pick and Place
Connector Type: Receptacle
Current Rating (Amps): 2.8A per Contact
Mounting Type: Surface Mount
Number of Positions: 58
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 3.00µin (0.076µm)
Contact Finish - Post: Tin
Insulation Height: 0.084" (2.14mm)
Row Spacing - Mating: 0.039" (1.00mm)
Number of Rows: 2
на замовлення 104 шт:
термін постачання 21-31 дні (днів)
Кількість | Ціна без ПДВ |
---|---|
19+ | 748.51 грн |
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Технічний опис CLM-129-02-F-D-P Samtec Inc.
Description: CONN RCPT 58POS 0.039 GOLD SMD, Packaging: Tube, Features: Pick and Place, Connector Type: Receptacle, Current Rating (Amps): 2.8A per Contact, Mounting Type: Surface Mount, Number of Positions: 58, Style: Board to Board, Operating Temperature: -55°C ~ 125°C, Contact Type: Female Socket, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Insulation Color: Black, Pitch - Mating: 0.039" (1.00mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 3.00µin (0.076µm), Contact Finish - Post: Tin, Insulation Height: 0.084" (2.14mm), Row Spacing - Mating: 0.039" (1.00mm), Number of Rows: 2.
Інші пропозиції CLM-129-02-F-D-P
Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
---|---|---|---|---|---|
CLM-129-02-F-D-P | Виробник : Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch |
товар відсутній |