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CGB3B3X6S0G225M055AB

CGB3B3X6S0G225M055AB TDK - Teridian


cgb3b3x6s0g225m055ab.pdf Виробник: TDK - Teridian
Cap Ceramic 2.2uF 4V X6S 20% Pad SMD 0603 105C T/R
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Технічний опис CGB3B3X6S0G225M055AB TDK - Teridian

Description: CAP CER 2.2UF 4V X6S 0603, Tolerance: ±20%, Features: Low Profile, Packaging: Tape & Reel (TR), Voltage - Rated: 4V, Package / Case: 0603 (1608 Metric), Temperature Coefficient: X6S, Size / Dimension: 0.063" L x 0.031" W (1.60mm x 0.80mm), Mounting Type: Surface Mount, MLCC, Operating Temperature: -55°C ~ 105°C, Applications: General Purpose, Thickness (Max): 0.022" (0.55mm), Capacitance: 2.2 µF.

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CGB3B3X6S0G225M055AB CGB3B3X6S0G225M055AB Виробник : TDK Corporation mlccspec_commercial_lowprofile_en.pdf Description: CAP CER 2.2UF 4V X6S 0603
Tolerance: ±20%
Features: Low Profile
Packaging: Tape & Reel (TR)
Voltage - Rated: 4V
Package / Case: 0603 (1608 Metric)
Temperature Coefficient: X6S
Size / Dimension: 0.063" L x 0.031" W (1.60mm x 0.80mm)
Mounting Type: Surface Mount, MLCC
Operating Temperature: -55°C ~ 105°C
Applications: General Purpose
Thickness (Max): 0.022" (0.55mm)
Capacitance: 2.2 µF
товар відсутній
CGB3B3X6S0G225M055AB CGB3B3X6S0G225M055AB Виробник : TDK Corporation mlccspec_commercial_lowprofile_en.pdf Description: CAP CER 2.2UF 4V X6S 0603
Tolerance: ±20%
Features: Low Profile
Packaging: Cut Tape (CT)
Voltage - Rated: 4V
Package / Case: 0603 (1608 Metric)
Temperature Coefficient: X6S
Size / Dimension: 0.063" L x 0.031" W (1.60mm x 0.80mm)
Mounting Type: Surface Mount, MLCC
Operating Temperature: -55°C ~ 105°C
Applications: General Purpose
Thickness (Max): 0.022" (0.55mm)
Capacitance: 2.2 µF
товар відсутній
CGB3B3X6S0G225M055AB CGB3B3X6S0G225M055AB Виробник : TDK mlccspec_commercial_lowprofile_en.pdf Multilayer Ceramic Capacitors MLCC - SMD/SMT RECOMMENDED ALT 810-CGB3B3X6S0G225KB
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