Продукція > TDK CORPORATION > C2012JB0J685M085AB
C2012JB0J685M085AB

C2012JB0J685M085AB TDK Corporation


Multilayer Ceramic Chip Cap(up to 50V).pdf Виробник: TDK Corporation
Description: CAP CER 6.8UF 6.3V JB 0805
Tolerance: ±20%
Features: Low ESL
Packaging: Tape & Reel (TR)
Voltage - Rated: 6.3V
Package / Case: 0805 (2012 Metric)
Temperature Coefficient: JB
Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
Mounting Type: Surface Mount, MLCC
Operating Temperature: -25°C ~ 85°C
Applications: General Purpose
Thickness (Max): 0.037" (0.95mm)
Part Status: Obsolete
Capacitance: 6.8 µF
товар відсутній

Відгуки про товар
Написати відгук

Технічний опис C2012JB0J685M085AB TDK Corporation

Description: CAP CER 6.8UF 6.3V JB 0805, Tolerance: ±20%, Features: Low ESL, Packaging: Tape & Reel (TR), Voltage - Rated: 6.3V, Package / Case: 0805 (2012 Metric), Temperature Coefficient: JB, Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm), Mounting Type: Surface Mount, MLCC, Operating Temperature: -25°C ~ 85°C, Applications: General Purpose, Thickness (Max): 0.037" (0.95mm), Part Status: Obsolete, Capacitance: 6.8 µF.

Інші пропозиції C2012JB0J685M085AB

Фото Назва Виробник Інформація Доступність
Ціна без ПДВ
C2012JB0J685M085AB C2012JB0J685M085AB Виробник : TDK Corporation Multilayer Ceramic Chip Cap(up to 50V).pdf Description: CAP CER 6.8UF 6.3V JB 0805
Tolerance: ±20%
Features: Low ESL
Packaging: Cut Tape (CT)
Voltage - Rated: 6.3V
Package / Case: 0805 (2012 Metric)
Temperature Coefficient: JB
Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
Mounting Type: Surface Mount, MLCC
Operating Temperature: -25°C ~ 85°C
Applications: General Purpose
Thickness (Max): 0.037" (0.95mm)
Part Status: Obsolete
Capacitance: 6.8 µF
товар відсутній