BM28B0.6-6DS/2-0.35V(51) Hirose Electric Co Ltd
Виробник: Hirose Electric Co Ltd
Description: CONN RCPT SMD GOLD
Packaging: Tape & Reel (TR)
Features: Solder Retention
Connector Type: Receptacle, Center Strip Contacts
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 6
Pitch: 0.014" (0.35mm)
Height Above Board: 0.024" (0.61mm)
Contact Finish Thickness: 1.97µin (0.050µm)
Mated Stacking Heights: 0.6mm
Number of Rows: 2
Description: CONN RCPT SMD GOLD
Packaging: Tape & Reel (TR)
Features: Solder Retention
Connector Type: Receptacle, Center Strip Contacts
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 6
Pitch: 0.014" (0.35mm)
Height Above Board: 0.024" (0.61mm)
Contact Finish Thickness: 1.97µin (0.050µm)
Mated Stacking Heights: 0.6mm
Number of Rows: 2
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Технічний опис BM28B0.6-6DS/2-0.35V(51) Hirose Electric Co Ltd
Description: CONN RCPT SMD GOLD, Packaging: Tape & Reel (TR), Features: Solder Retention, Connector Type: Receptacle, Center Strip Contacts, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 6, Pitch: 0.014" (0.35mm), Height Above Board: 0.024" (0.61mm), Contact Finish Thickness: 1.97µin (0.050µm), Mated Stacking Heights: 0.6mm, Number of Rows: 2.
Інші пропозиції BM28B0.6-6DS/2-0.35V(51)
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
|---|---|---|---|---|---|
| BM28B0.6-6DS/2-0.35V(51) | Виробник : Hirose Electric Co Ltd |
Description: CONN RCPT SMD GOLD Features: Solder Retention Packaging: Cut Tape (CT) Connector Type: Receptacle, Center Strip Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 6 Pitch: 0.014" (0.35mm) Height Above Board: 0.024" (0.61mm) Contact Finish Thickness: 1.97µin (0.050µm) Mated Stacking Heights: 0.6mm Number of Rows: 2 |
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BM28B0.6-6DS/2-0.35V(51) | Виробник : Hirose Connector |
 Board to Board & Mezzanine Connectors |
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