Технічний опис APM6-100-01.5-S-04-2-A-TR Samtec
Description: 0.635 MM PITCH ACCELERATE HP HIG, Packaging: Bulk, Features: Board Guide, Connector Type: High Density Array, Male, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 400, Pitch: 0.025" (0.64mm), Height Above Board: 0.131" (3.33mm), Contact Finish Thickness: 30.0µin (0.76µm), Mated Stacking Heights: 5mm, Number of Rows: 4.
Інші пропозиції APM6-100-01.5-S-04-2-A-TR
Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
---|---|---|---|---|---|
APM6-100-01.5-S-04-2-A-TR | Виробник : Samtec | Conn Array Terminal HDR 400 POS 0.635mm Solder ST Top Entry SMD Accelerate® T/R |
товар відсутній |
||
APM6-100-01.5-S-04-2-A-TR | Виробник : Samtec Inc. |
Description: 0.635 MM PITCH ACCELERATE HP HIG Packaging: Bulk Features: Board Guide Connector Type: High Density Array, Male Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 400 Pitch: 0.025" (0.64mm) Height Above Board: 0.131" (3.33mm) Contact Finish Thickness: 30.0µin (0.76µm) Mated Stacking Heights: 5mm Number of Rows: 4 |
товар відсутній |