![A-TB381-OQ08CV A-TB381-OQ08CV](https://download.siliconexpert.com/pdfs2/2019/8/19/15/55/51/614529/ann_/manual/list-a-tbxxx-oqxxcx.jpg)
A-TB381-OQ08CV Assmann WSW Components GMBH
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Conn Wire to Board HDR 8 POS 3.81mm Solder ST Top Entry Thru-Hole Box
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Технічний опис A-TB381-OQ08CV Assmann WSW Components GMBH
Description: TERM BLOCK HDR 8POS VERT 3.81MM, Packaging: Bulk, Color: Green, Mounting Type: Through Hole, Number of Positions: 8, Pitch: 0.150" (3.81mm), Type: Header, Male Pins, Shrouded (4 Side), Operating Temperature: -40°C ~ 115°C, Termination Style: Solder, Number of Levels: 1, Positions Per Level: 8, Header Orientation: Vertical, Contact Mating Finish: Tin, Current - UL: 10 A, Voltage - UL: 300 V.
Інші пропозиції A-TB381-OQ08CV
Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
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A-TB381-OQ08CV | Виробник : Assmann WSW Components |
![]() Packaging: Bulk Color: Green Mounting Type: Through Hole Number of Positions: 8 Pitch: 0.150" (3.81mm) Type: Header, Male Pins, Shrouded (4 Side) Operating Temperature: -40°C ~ 115°C Termination Style: Solder Number of Levels: 1 Positions Per Level: 8 Header Orientation: Vertical Contact Mating Finish: Tin Current - UL: 10 A Voltage - UL: 300 V |
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