828-AG11D-ESL TE Connectivity AMP Connectors
![DDEController?Action=srchrtrv&DocNm=1-1773906-9_DIP_Socket_QRG&DocType=DS&DocLang=English](/images/adobe-acrobat.png)
Description: CONN IC DIP SOCKET 28POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 5.00µin (0.127µm)
Contact Material - Mating: Copper Alloy
Pitch - Post: 0.100" (2.54mm)
Part Status: Obsolete
товар відсутній
Відгуки про товар
Написати відгук
Технічний опис 828-AG11D-ESL TE Connectivity AMP Connectors
Description: CONN IC DIP SOCKET 28POS GOLD, Features: Open Frame, Packaging: Tube, Mounting Type: Through Hole, Type: DIP, 0.6" (15.24mm) Row Spacing, Operating Temperature: -55°C ~ 105°C, Number of Positions or Pins (Grid): 28 (2 x 14), Termination: Solder, Housing Material: Polyester, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 5.00µin (0.127µm), Contact Material - Mating: Copper Alloy, Pitch - Post: 0.100" (2.54mm), Part Status: Obsolete.
Інші пропозиції 828-AG11D-ESL
Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
---|---|---|---|---|---|
![]() |
828-AG11D-ESL | Виробник : TE Connectivity |
![]() |
товар відсутній |