77709-332LF Amphenol Communications Solutions
Виробник: Amphenol Communications Solutions
BergStik, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single row, Double Body, Polarization, 1 Positions, 2.54mm (0.100in) Pitch
BergStik, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single row, Double Body, Polarization, 1 Positions, 2.54mm (0.100in) Pitch
товар відсутній
Відгуки про товар
Написати відгук
Технічний опис 77709-332LF Amphenol Communications Solutions
Description: CONN HDR STACK, Packaging: Bag, Color: Black, Mounting Type: Through Hole, Pitch: 0.100" (2.54mm), Termination: Solder, Contact Finish - Post (Mating): Gold, GXT™, Contact Finish Thickness - Post (Mating): 30.0µin (0.76µm), Number of Rows: 1, Number of Positions: 1, Length - Overall Pin: 0.496" (12.600mm), Length - Post (Mating): 0.120" (3.050mm), Length - Stack Height: 0.256" (6.500mm), Length - Tail: 0.120" (3.050mm).
Інші пропозиції 77709-332LF
Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
---|---|---|---|---|---|
77709-332LF | Виробник : Amphenol ICC (FCI) |
Description: CONN HDR STACK Packaging: Bag Color: Black Mounting Type: Through Hole Pitch: 0.100" (2.54mm) Termination: Solder Contact Finish - Post (Mating): Gold, GXT™ Contact Finish Thickness - Post (Mating): 30.0µin (0.76µm) Number of Rows: 1 Number of Positions: 1 Length - Overall Pin: 0.496" (12.600mm) Length - Post (Mating): 0.120" (3.050mm) Length - Stack Height: 0.256" (6.500mm) Length - Tail: 0.120" (3.050mm) |
товар відсутній |
||
77709-332LF | Виробник : Amphenol FCI | Headers & Wire Housings BERGSTIK |
товар відсутній |