714-43-264-31-018000 Mill-Max Manufacturing Corp.
Виробник: Mill-Max Manufacturing Corp.Description: CONN IC DIP SOCKET 64POS GOLD
Packaging: Tube
Features: Carrier, Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.1" (2.54mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 64 (2 x 32)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 129 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1832.73 грн |
| 12+ | 1545.71 грн |
| 30+ | 1478.88 грн |
| 54+ | 1343.1 грн |
| 102+ | 1298.32 грн |
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Технічний опис 714-43-264-31-018000 Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 64POS GOLD, Packaging: Tube, Features: Carrier, Closed Frame, Mounting Type: Through Hole, Type: DIP, 0.1" (2.54mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 64 (2 x 32), Termination: Solder, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 30.0µin (0.76µm), Contact Material - Post: Brass Alloy, Part Status: Active.
Інші пропозиції 714-43-264-31-018000
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
|---|---|---|---|---|---|
| 714-43-264-31-018000 | Виробник : Mill-Max |
IC & Component Sockets 64P SGL IN LINE SKT DOUBLE ROW ULTRA LOW |
товар відсутній |