550-10-478M26-131152 Preci-Dip
![Default.aspx?c=12&i=1366&p=318&pdf=1&dsku=550-10-NNNMXX-XXX152](/images/adobe-acrobat.png)
Description: BGA SOLDER TAIL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 478 (26 x 26)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Brass
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товар відсутній
Відгуки про товар
Написати відгук
Технічний опис 550-10-478M26-131152 Preci-Dip
Description: BGA SOLDER TAIL, Features: Open Frame, Packaging: Bulk, Mounting Type: Through Hole, Type: BGA, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 478 (26 x 26), Termination: Solder, Housing Material: FR4 Epoxy Glass, Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Brass, Pitch - Post: 0.050" (1.27mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 10.0µin (0.25µm), Contact Material - Post: Brass.
Інші пропозиції 550-10-478M26-131152
Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
---|---|---|---|---|---|
550-10-478M26-131152 | Виробник : Preci-dip |
![]() |
товар відсутній |