550-10-356M26-001152 Preci-Dip
Виробник: Preci-DipDescription: BGA SOLDER TAIL
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 356 (26 x 26)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Brass
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
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Технічний опис 550-10-356M26-001152 Preci-Dip
Description: BGA SOLDER TAIL, Packaging: Bulk, Features: Closed Frame, Mounting Type: Through Hole, Type: BGA, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 356 (26 x 26), Termination: Solder, Housing Material: FR4 Epoxy Glass, Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Brass, Pitch - Post: 0.050" (1.27mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 10.0µin (0.25µm), Contact Material - Post: Brass.
Інші пропозиції 550-10-356M26-001152
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
|---|---|---|---|---|---|
| 550-10-356M26-001152 | Виробник : Preci-dip |
IC & Component Sockets |
товару немає в наявності |