550-10-272M20-001152 Preci-Dip
Виробник: Preci-DipBGA INTERCONNECT SOCKETS 1.27 MM GRID, THROUGH HOLE SOLDER TAILS AND CONNECTING PIN 0.40 MM
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Технічний опис 550-10-272M20-001152 Preci-Dip
Description: BGA SOLDER TAIL, Features: Closed Frame, Packaging: Bulk, Mounting Type: Through Hole, Type: BGA, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 272 (20 x 20), Termination: Solder, Housing Material: FR4 Epoxy Glass, Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Brass, Pitch - Post: 0.050" (1.27mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 10.0µin (0.25µm), Contact Material - Post: Brass.
Інші пропозиції 550-10-272M20-001152
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
|---|---|---|---|---|---|
| 550-10-272M20-001152 | Виробник : Preci-Dip |
Description: BGA SOLDER TAIL Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: BGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 272 (20 x 20) Termination: Solder Housing Material: FR4 Epoxy Glass Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Brass Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass |
товару немає в наявності |