Технічний опис 503566-3300 Molex
Description: CONN FPC BOTTOM 33POS 0.3MM R/A, Features: Solder Retention, Packaging: Tape & Reel (TR), Contact Finish: Gold, Voltage Rating: 50V, Mounting Type: Surface Mount, Right Angle, Number of Positions: 33, Pitch: 0.012" (0.30mm), Operating Temperature: -40°C ~ 85°C, Termination: Solder, Height Above Board: 0.037" (0.95mm), Locking Feature: Flip Lock, Material Flammability Rating: UL94 V-0, UL94 HB, Actuator Material: Polyamide (PA), Nylon, Glass Filled, Contact Material: Phosphor Bronze, FFC, FCB Thickness: 0.20mm, Housing Material: Liquid Crystal Polymer (LCP), Glass Filled, Cable End Type: Tabbed, Flat Flex Type: FPC, Connector/Contact Type: Contacts, Bottom, Part Status: Obsolete.
Інші пропозиції 503566-3300 за ціною від 66.06 грн до 107.11 грн
| Фото | Назва | Виробник | Інформація |
Доступність |
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| 503566-3300 | Виробник : MOLEX |
 Category: Signal connectors - UnclassifiedDescription: Connector: FFC/FPC |
на замовлення 9000 шт: термін постачання 21-30 дні (днів) |
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| 503566-3300 | Виробник : MOLEX |
Category: Signal connectors - Unclassified Description: Connector: FFC/FPC кількість в упаковці: 3000 шт |
на замовлення 9000 шт: термін постачання 14-21 дні (днів) |
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| 503566-3300 | Виробник : MOLEX / PARTNER STOCK |
Description: MOLEX / PARTNER STOCK - 503566-3300 - FFC/FPC-Leiterplattensteckverbinder, 0.3 mm, 33 Kontakt(e), Buchse, Easy-On 503566 Series tariffCode: 85366930 rohsCompliant: YES FFC/FPC-Dicke: 0.2mm Kontaktüberzug: Vergoldete Kontakte hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: Phosphorbronze Ausführung: Buchse usEccn: EAR99 Anzahl der Kontakte: 33Kontakt(e) euEccn: NLR Kontaktposition: Unten Produktpalette: Easy-On 503566 Series productTraceability: No Kontaktanschluss: Oberflachenmontage Anzahl der Reihen: 2 Reihen Rastermaß: 0.3mm SVHC: No SVHC (14-Jun-2023) |
на замовлення 6000 шт: термін постачання 21-31 дні (днів) |
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5035663300 | Виробник : Molex |
Conn FPC Connector F 33 POS 0.3mm Solder RA SMD Easy-On™ T/R |
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503566-3300 | Виробник : Molex |
Description: 0.3 FPC E/O HSG ASSY 33CKT EMBST Packaging: Box Part Status: Active |
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5035663300 | Виробник : Molex |
Description: CONN FPC BOTTOM 33POS 0.3MM R/A Features: Solder Retention Packaging: Tape & Reel (TR) Contact Finish: Gold Voltage Rating: 50V Mounting Type: Surface Mount, Right Angle Number of Positions: 33 Pitch: 0.012" (0.30mm) Operating Temperature: -40°C ~ 85°C Termination: Solder Height Above Board: 0.037" (0.95mm) Locking Feature: Flip Lock Material Flammability Rating: UL94 V-0, UL94 HB Actuator Material: Polyamide (PA), Nylon, Glass Filled Contact Material: Phosphor Bronze FFC, FCB Thickness: 0.20mm Housing Material: Liquid Crystal Polymer (LCP), Glass Filled Cable End Type: Tabbed Flat Flex Type: FPC Connector/Contact Type: Contacts, Bottom Part Status: Obsolete |
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5035663300 | Виробник : Molex |
Description: CONN FPC BOTTOM 33POS 0.3MM R/A Features: Solder Retention Packaging: Cut Tape (CT) Contact Finish: Gold Voltage Rating: 50V Mounting Type: Surface Mount, Right Angle Number of Positions: 33 Pitch: 0.012" (0.30mm) Operating Temperature: -40°C ~ 85°C Termination: Solder Height Above Board: 0.037" (0.95mm) Locking Feature: Flip Lock Material Flammability Rating: UL94 V-0, UL94 HB Actuator Material: Polyamide (PA), Nylon, Glass Filled Contact Material: Phosphor Bronze FFC, FCB Thickness: 0.20mm Housing Material: Liquid Crystal Polymer (LCP), Glass Filled Cable End Type: Tabbed Flat Flex Type: FPC Connector/Contact Type: Contacts, Bottom Part Status: Obsolete |
товар відсутній |