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28-6554-16 Aries Electronics
на замовлення 5 шт:
термін постачання 21-30 дні (днів)
Кількість | Ціна без ПДВ |
---|---|
1+ | 4240.36 грн |
5+ | 4056.66 грн |
9+ | 3420.47 грн |
27+ | 3312.71 грн |
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Технічний опис 28-6554-16 Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS, Packaging: Bulk, Features: Closed Frame, Mounting Type: Through Hole, Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 28 (2 x 14), Termination: Solder, Housing Material: Polyphenylene Sulfide (PPS), Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Nickel Boron, Contact Finish Thickness - Mating: 50.0µin (1.27µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Nickel Boron, Contact Finish Thickness - Post: 50.0µin (1.27µm), Contact Material - Post: Beryllium Copper, Part Status: Active.
Інші пропозиції 28-6554-16
Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
---|---|---|---|---|---|
28-6554-16 | Виробник : Aries Electronics |
![]() Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Nickel Boron Contact Finish Thickness - Mating: 50.0µin (1.27µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Nickel Boron Contact Finish Thickness - Post: 50.0µin (1.27µm) Contact Material - Post: Beryllium Copper Part Status: Active |
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