Технічний опис 268-5401-52-1102JH 3M Interconnect Solutions
Description: CONN SOCKET CLCC 68POS GOLD, Packaging: Bulk, Features: Closed Frame, Mounting Type: Through Hole, Type: CLCC, Operating Temperature: -55°C ~ 105°C, Number of Positions or Pins (Grid): 68 (4 x 17), Termination: Solder, Housing Material: Polyphenylene Sulfide (PPS), Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 30.0µin (0.76µm), Contact Material - Post: Beryllium Copper, Part Status: Obsolete.
Інші пропозиції 268-5401-52-1102JH
Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
---|---|---|---|---|---|
![]() |
268-5401-52-1102JH | Виробник : 3M |
![]() Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: CLCC Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 68 (4 x 17) Termination: Solder Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Beryllium Copper Part Status: Obsolete |
товар відсутній |
|
![]() |
268-5401-52-1102JH | Виробник : 3M Electronic Solutions Division |
![]() |
товар відсутній |