232-1297-00-3303 3M
![OEM%20ZIF%20DIP%20Sockets.pdf](/images/adobe-acrobat.png)
Description: CONN IC DIP SOCKET ZIF 32POS GLD
Features: Closed Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polyether Imide (PEI), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 250.0µin (6.35µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 250.0µin (6.35µm)
Contact Material - Post: Beryllium Copper
Part Status: Obsolete
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Технічний опис 232-1297-00-3303 3M
Description: CONN IC DIP SOCKET ZIF 32POS GLD, Features: Closed Frame, Packaging: Tube, Mounting Type: Through Hole, Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing, Operating Temperature: -55°C ~ 105°C, Number of Positions or Pins (Grid): 32 (2 x 16), Termination: Solder, Housing Material: Polyether Imide (PEI), Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 250.0µin (6.35µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 250.0µin (6.35µm), Contact Material - Post: Beryllium Copper, Part Status: Obsolete.
Інші пропозиції 232-1297-00-3303
Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
---|---|---|---|---|---|
232-1297-00-3303 | Виробник : 3M Electronic Solutions Division |
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