Результат пошуку "163518" : > 61
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Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
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08025SA-24N-EA-D0 Код товару: 163518 |
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16-3518-00 | ARIES |
![]() tariffCode: 85369010 productTraceability: No Kontaktüberzug: Vergoldete Kontakte Steckverbindertyp: DIP rohsCompliant: YES Rastermaß: 2.54mm Anzahl der Kontakte: 16Kontakt(e) euEccn: NLR Kontaktmaterial: Berylliumkupfer hazardous: false Reihenabstand: 7.62mm rohsPhthalatesCompliant: YES usEccn: EAR99 Produktpalette: 518 SVHC: No SVHC (15-Jan-2018) |
на замовлення 74 шт: термін постачання 21-31 дні (днів) |
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16-3518-10 | ARIES |
![]() tariffCode: 85366930 productTraceability: No Kontaktüberzug: Vergoldete Kontakte Steckverbindertyp: DIP rohsCompliant: YES Rastermaß: 2.54mm Anzahl der Kontakte: 16Kontakt(e) euEccn: NLR Kontaktmaterial: Berylliumkupfer hazardous: false Reihenabstand: 7.62mm rohsPhthalatesCompliant: YES usEccn: EAR99 Produktpalette: 518 SVHC: No SVHC (15-Jan-2018) |
на замовлення 1814 шт: термін постачання 21-31 дні (днів) |
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16-3518-10 | Aries Electronics |
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на замовлення 216 шт: термін постачання 21-30 дні (днів) |
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16-3518-10 | Aries Electronics |
![]() Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 16 (2 x 8) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Part Status: Active |
на замовлення 1516 шт: термін постачання 21-31 дні (днів) |
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16-3518-10 | Aries Electronics |
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на замовлення 72 шт: термін постачання 21-31 дні (днів) |
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16-3518-10E | Aries Electronics |
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на замовлення 24 шт: термін постачання 21-31 дні (днів) |
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16-3518-10T | Aries Electronics |
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на замовлення 62 шт: термін постачання 21-30 дні (днів) |
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16-3518-10T | Aries Electronics |
![]() Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 16 (2 x 8) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Part Status: Active |
на замовлення 748 шт: термін постачання 21-31 дні (днів) |
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16-3518-11 | Aries Electronics |
![]() Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 16 (2 x 8) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Part Status: Active |
на замовлення 4 шт: термін постачання 21-31 дні (днів) |
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16-3518-11 | Aries Electronics |
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на замовлення 19 шт: термін постачання 21-30 дні (днів) |
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16-3518-11 | Aries Electronics |
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на замовлення 72 шт: термін постачання 21-31 дні (днів) |
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16-3518-112 | Aries Electronics |
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на замовлення 75 шт: термін постачання 21-31 дні (днів) |
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430163-518 | Laird Thermal Systems, Inc. |
![]() Packaging: Bulk Features: Lead Wires, Sealed - Silicone RTV Size / Dimension: Square - 29.70mm L x 29.70mm W Operating Temperature: 80°C Height: 3.81mm Delta Tmax @ Th: 68°C @ 25°C Qmax @ Th: 28.7W @ 25°C Current - Max: 6 A Voltage - Max: 8.1 V Resistance: 1.26 Ohms Number of Stages: 1 |
на замовлення 20 шт: термін постачання 21-31 дні (днів) |
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430163-518 | Laird Thermal Systems |
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на замовлення 18 шт: термін постачання 99-108 дні (днів) |
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90816-3518 | MOLEX |
Category: IDC picoflex connectors 1,27mm Description: Wire-board Type of connector: wire-board |
на замовлення 5400 шт: термін постачання 21-30 дні (днів) |
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PSR1635-18 | Parlex |
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на замовлення 2 шт: термін постачання 21-30 дні (днів) |
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PSR1635-18 | Parlex USA LLC |
![]() Features: Conductor 1 Tinned Packaging: Spool Jacket (Insulation) Material: Polyester Pitch: 0.100" (2.54mm) Ratings: UL Style 2643 Cable Length: 500' (152.4m) Jacket (Insulation) Thickness: 0.002" (0.05mm) Conductor Material: Copper, Bare Cable Width: 1.90" (48.26mm) Part Status: Active Number of Conductors: 18 |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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63518-1 | TE Connectivity / AMP |
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на замовлення 55155 шт: термін постачання 21-30 дні (днів) |
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BS-31-6 | 3M Electronic Specialty |
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на замовлення 12915 шт: термін постачання 21-30 дні (днів) |
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BS-31-6 | 3M |
![]() Packaging: Bulk Features: Butted Seam Contact Finish: Tin Mounting Type: Free Hanging (In-Line) Wire Gauge: 18-22 AWG Insulation: Non-Insulated Terminal Type: Standard Stud/Tab Size: 6 Stud Length - Overall: 0.650" (16.50mm) Termination: Crimp Width - Outer Edges: 0.300" (7.62mm) Contact Material: Copper, ETP Part Status: Active |
на замовлення 340 шт: термін постачання 21-31 дні (днів) |
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16-3518-00 | Aries Electronics |
![]() Packaging: Bulk Features: Open Frame Mounting Type: Surface Mount Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 16 (2 x 8) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
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16-3518-00 | Aries Electronics |
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16-3518-01 | Aries Electronics |
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16-3518-01 | Aries Electronics |
![]() Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 16 (2 x 8) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass |
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16-3518-101 | Aries Electronics |
![]() Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 16 (2 x 8) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
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16-3518-101 | Aries Electronics |
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16-3518-101H | Aries Electronics |
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16-3518-101H | Aries Electronics |
![]() Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 16 (2 x 8) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
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16-3518-102 | Aries Electronics |
![]() Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 16 (2 x 8) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
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16-3518-102 | Aries Electronics |
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16-3518-10E | Aries Electronics |
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16-3518-10E | Aries Electronics |
![]() Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 16 (2 x 8) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
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16-3518-10H | Aries Electronics |
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16-3518-10H | Aries Electronics |
![]() Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 16 (2 x 8) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
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16-3518-10M | Aries Electronics |
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16-3518-10M | Aries Electronics |
![]() Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 16 (2 x 8) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
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16-3518-111 | Aries Electronics |
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16-3518-111 | Aries Electronics |
![]() Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 16 (2 x 8) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass |
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16-3518-112 | Aries Electronics |
![]() Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 16 (2 x 8) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass |
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16-3518-112 | Aries Electronics |
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16-3518-11H | Aries Electronics |
![]() Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 16 (2 x 8) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass |
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16-3518-11H | Aries Electronics |
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0908163518 | Molex |
Description: 18CKT PICOFLEX SMT LATCHED HDR Packaging: Bulk |
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0908163518 | Molex |
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90816-3518 | MOLEX |
Category: IDC picoflex connectors 1,27mm Description: Wire-board Type of connector: wire-board кількість в упаковці: 1 шт |
на замовлення 5400 шт: термін постачання 14-21 дні (днів) |
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90816-3518 | Molex | Headers & Wire Housings 18CKT PICOFLEX SMT LATCHED HDR |
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PSR1635-18 | Parlex USA LLC |
![]() Features: Conductor 1 Tinned Packaging: Bulk Jacket (Insulation) Material: Polyester Pitch: 0.100" (2.54mm) Ratings: UL Style 2643 Cable Length: 50' (15.24m) Jacket (Insulation) Thickness: 0.002" (0.05mm) Conductor Material: Copper, Bare Cable Width: 1.90" (48.26mm) Number of Conductors: 18 |
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PSR1635-18 | Parlex USA LLC |
![]() Features: Conductor 1 Tinned Packaging: Bulk Jacket (Insulation) Material: Polyester Pitch: 0.100" (2.54mm) Ratings: UL Style 2643 Cable Length: 5' (1.52m) Jacket (Insulation) Thickness: 0.002" (0.05mm) Conductor Material: Copper, Bare Cable Width: 1.90" (48.26mm) Number of Conductors: 18 |
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PSR1635-18 | Parlex USA LLC |
![]() Features: Conductor 1 Tinned Packaging: Bulk Jacket (Insulation) Material: Polyester Pitch: 0.100" (2.54mm) Ratings: UL Style 2643 Cable Length: 100' (30.5m) Jacket (Insulation) Thickness: 0.002" (0.05mm) Conductor Material: Copper, Bare Cable Width: 1.90" (48.26mm) Number of Conductors: 18 |
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PSR1635-18 | Parlex USA LLC |
![]() Features: Conductor 1 Tinned Packaging: Bulk Jacket (Insulation) Material: Polyester Pitch: 0.100" (2.54mm) Ratings: UL Style 2643 Cable Length: 10' (3.05m) Jacket (Insulation) Thickness: 0.002" (0.05mm) Conductor Material: Copper, Bare Cable Width: 1.90" (48.26mm) Number of Conductors: 18 |
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PSR1635-18 | Parlex USA LLC |
![]() Features: Conductor 1 Tinned Packaging: Bulk Jacket (Insulation) Material: Polyester Pitch: 0.100" (2.54mm) Ratings: UL Style 2643 Cable Length: 250' (76.2m) Jacket (Insulation) Thickness: 0.002" (0.05mm) Conductor Material: Copper, Bare Cable Width: 1.90" (48.26mm) Number of Conductors: 18 |
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PSR1635-18 | Parlex USA LLC |
![]() Features: Conductor 1 Tinned Packaging: Bulk Jacket (Insulation) Material: Polyester Pitch: 0.100" (2.54mm) Ratings: UL Style 2643 Cable Length: 25' (7.62m) Jacket (Insulation) Thickness: 0.002" (0.05mm) Conductor Material: Copper, Bare Cable Width: 1.90" (48.26mm) Number of Conductors: 18 |
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ETIMAT 6 2P D25 | ETI POLAM |
Category: Circuit Breakers Description: Circuit breaker; 230/400VAC; Inom: 25A; Poles: 2; Charact: D; 6kA Mounting: for DIN rail mounting Mechanical durability: 20000 cycles Rated voltage: 230/400V AC Operating temperature: -25...55°C Current rating: 25A IP rating: IP20 Characteristics: D Cross section of connecting wires: 1...25mm2 Conform to the norm: IEC EN 60898; IEC EN 60947-2 Short circuit breaking capacity: 6kA Manufacturer series: ETIMAT 6 Type of protection: circuit breaker Number of poles: 2 Trade name: MCB |
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ETIMAT 6 2P D25 | ETI POLAM |
Category: Circuit Breakers Description: Circuit breaker; 230/400VAC; Inom: 25A; Poles: 2; Charact: D; 6kA Mounting: for DIN rail mounting Mechanical durability: 20000 cycles Rated voltage: 230/400V AC Operating temperature: -25...55°C Current rating: 25A IP rating: IP20 Characteristics: D Cross section of connecting wires: 1...25mm2 Conform to the norm: IEC EN 60898; IEC EN 60947-2 Short circuit breaking capacity: 6kA Manufacturer series: ETIMAT 6 Type of protection: circuit breaker Number of poles: 2 Trade name: MCB кількість в упаковці: 1 шт |
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HEDS-9140-B00 | Broadcom Limited |
![]() Packaging: Bulk Output Type: Quadrature with Index (Incremental) Mounting Type: Chassis Mount Orientation: Vertical Termination Style: Terminal Pins Voltage - Supply: 5V Encoder Type: Optical Detent: No Pulses per Revolution: 1000 Actuator Type: Codewheel Not Included Built in Switch: No Part Status: Active DigiKey Programmable: Not Verified |
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MCIMX353DJQ5CR2 | NXP USA Inc. |
Description: IC MPU I.MX35 532MHZ 400LFBGA Packaging: Tape & Reel (TR) Package / Case: 400-LFBGA Mounting Type: Surface Mount Speed: 532MHz Operating Temperature: -20°C ~ 70°C (TA) Core Processor: ARM1136JF-S Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V Supplier Device Package: 400-LFBGA (17x17) Ethernet: 10/100Mbps (1) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; GPU, IPU, VFP RAM Controllers: LPDDR, DDR2 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, KPP, LCD Security Features: Secure Fusebox, Secure JTAG, Tamper Detection Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SPI, SSI, UART |
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MCIMX353DJQ5CR2 | NXP Semiconductors |
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MCIMX353DJQ5CR2 | NXP Semiconductors |
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MCZ33903DD3EKR2 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Mounting Type: Surface Mount Interface: CAN, LIN Voltage - Supply: 5.5V ~ 28V Applications: System Basis Chip Supplier Device Package: 32-SSOP-EP |
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MCZ33903DD3EKR2 | NXP Semiconductors |
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08025SA-24N-EA-D0 Код товару: 163518 |
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товар відсутній
16-3518-00 |
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Виробник: ARIES
Description: ARIES - 16-3518-00 - IC- & Baustein-Sockel, 16 Kontakt(e), DIP, 2.54 mm, 518, 7.62 mm, Berylliumkupfer
tariffCode: 85369010
productTraceability: No
Kontaktüberzug: Vergoldete Kontakte
Steckverbindertyp: DIP
rohsCompliant: YES
Rastermaß: 2.54mm
Anzahl der Kontakte: 16Kontakt(e)
euEccn: NLR
Kontaktmaterial: Berylliumkupfer
hazardous: false
Reihenabstand: 7.62mm
rohsPhthalatesCompliant: YES
usEccn: EAR99
Produktpalette: 518
SVHC: No SVHC (15-Jan-2018)
Description: ARIES - 16-3518-00 - IC- & Baustein-Sockel, 16 Kontakt(e), DIP, 2.54 mm, 518, 7.62 mm, Berylliumkupfer
tariffCode: 85369010
productTraceability: No
Kontaktüberzug: Vergoldete Kontakte
Steckverbindertyp: DIP
rohsCompliant: YES
Rastermaß: 2.54mm
Anzahl der Kontakte: 16Kontakt(e)
euEccn: NLR
Kontaktmaterial: Berylliumkupfer
hazardous: false
Reihenabstand: 7.62mm
rohsPhthalatesCompliant: YES
usEccn: EAR99
Produktpalette: 518
SVHC: No SVHC (15-Jan-2018)
на замовлення 74 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
3+ | 362.75 грн |
10+ | 267.37 грн |
16-3518-10 |
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Виробник: ARIES
Description: ARIES - 16-3518-10 - IC- & Baustein-Sockel, 16 Kontakt(e), DIP, 2.54 mm, 518, 7.62 mm, Berylliumkupfer
tariffCode: 85366930
productTraceability: No
Kontaktüberzug: Vergoldete Kontakte
Steckverbindertyp: DIP
rohsCompliant: YES
Rastermaß: 2.54mm
Anzahl der Kontakte: 16Kontakt(e)
euEccn: NLR
Kontaktmaterial: Berylliumkupfer
hazardous: false
Reihenabstand: 7.62mm
rohsPhthalatesCompliant: YES
usEccn: EAR99
Produktpalette: 518
SVHC: No SVHC (15-Jan-2018)
Description: ARIES - 16-3518-10 - IC- & Baustein-Sockel, 16 Kontakt(e), DIP, 2.54 mm, 518, 7.62 mm, Berylliumkupfer
tariffCode: 85366930
productTraceability: No
Kontaktüberzug: Vergoldete Kontakte
Steckverbindertyp: DIP
rohsCompliant: YES
Rastermaß: 2.54mm
Anzahl der Kontakte: 16Kontakt(e)
euEccn: NLR
Kontaktmaterial: Berylliumkupfer
hazardous: false
Reihenabstand: 7.62mm
rohsPhthalatesCompliant: YES
usEccn: EAR99
Produktpalette: 518
SVHC: No SVHC (15-Jan-2018)
на замовлення 1814 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
5+ | 179.81 грн |
10+ | 148.54 грн |
100+ | 111.01 грн |
500+ | 84.94 грн |
1000+ | 71.7 грн |
16-3518-10 |
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Виробник: Aries Electronics
IC & Component Sockets 16P SOLDER TIN/GLD
IC & Component Sockets 16P SOLDER TIN/GLD
на замовлення 216 шт:
термін постачання 21-30 дні (днів)Кількість | Ціна без ПДВ |
---|---|
24+ | 99.19 грн |
120+ | 79.02 грн |
504+ | 65.44 грн |
1008+ | 56.73 грн |
2520+ | 54.08 грн |
16-3518-10 |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 16POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 16POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
на замовлення 1516 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
3+ | 113.08 грн |
24+ | 94.8 грн |
48+ | 88.75 грн |
120+ | 79.5 грн |
264+ | 71.93 грн |
504+ | 66.25 грн |
1008+ | 55.85 грн |
16-3518-10 |
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Виробник: Aries Electronics
Conn DIP Socket SKT 16 POS 2.54mm Solder ST Thru-Hole
Conn DIP Socket SKT 16 POS 2.54mm Solder ST Thru-Hole
на замовлення 72 шт:
термін постачання 21-31 дні (днів)16-3518-10E |
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Виробник: Aries Electronics
Conn DIP Socket SKT 16 POS 2.54mm Solder ST Thru-Hole
Conn DIP Socket SKT 16 POS 2.54mm Solder ST Thru-Hole
на замовлення 24 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
24+ | 529.9 грн |
16-3518-10T |
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Виробник: Aries Electronics
IC & Component Sockets OPEN FRAME COLLET SOLDER TAIL 16 PINS
IC & Component Sockets OPEN FRAME COLLET SOLDER TAIL 16 PINS
на замовлення 62 шт:
термін постачання 21-30 дні (днів)Кількість | Ціна без ПДВ |
---|---|
3+ | 115.46 грн |
10+ | 93.77 грн |
120+ | 69.34 грн |
504+ | 62.09 грн |
1008+ | 53.66 грн |
2520+ | 52.97 грн |
5016+ | 48.71 грн |
16-3518-10T |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 16POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 16POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
на замовлення 748 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
3+ | 107.8 грн |
24+ | 89.99 грн |
120+ | 80.4 грн |
16-3518-11 |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 16POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 16POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
на замовлення 4 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
2+ | 222.39 грн |
16-3518-11 |
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Виробник: Aries Electronics
IC & Component Sockets OPEN FRAME COLLET SOLDER TAIL 16 PINS
IC & Component Sockets OPEN FRAME COLLET SOLDER TAIL 16 PINS
на замовлення 19 шт:
термін постачання 21-30 дні (днів)Кількість | Ціна без ПДВ |
---|---|
2+ | 230.1 грн |
10+ | 201.97 грн |
120+ | 146.35 грн |
264+ | 130.32 грн |
504+ | 128.23 грн |
1008+ | 121.26 грн |
16-3518-11 |
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Виробник: Aries Electronics
Conn DIP Socket SKT 16 POS 2.54mm Solder ST Thru-Hole
Conn DIP Socket SKT 16 POS 2.54mm Solder ST Thru-Hole
на замовлення 72 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
44+ | 276.47 грн |
72+ | 227.25 грн |
16-3518-112 |
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Виробник: Aries Electronics
16-3518-112
16-3518-112
на замовлення 75 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
20+ | 621.01 грн |
50+ | 501.62 грн |
430163-518 |
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Виробник: Laird Thermal Systems, Inc.
Description: CP14-71-06-L2-RT-W4.5
Packaging: Bulk
Features: Lead Wires, Sealed - Silicone RTV
Size / Dimension: Square - 29.70mm L x 29.70mm W
Operating Temperature: 80°C
Height: 3.81mm
Delta Tmax @ Th: 68°C @ 25°C
Qmax @ Th: 28.7W @ 25°C
Current - Max: 6 A
Voltage - Max: 8.1 V
Resistance: 1.26 Ohms
Number of Stages: 1
Description: CP14-71-06-L2-RT-W4.5
Packaging: Bulk
Features: Lead Wires, Sealed - Silicone RTV
Size / Dimension: Square - 29.70mm L x 29.70mm W
Operating Temperature: 80°C
Height: 3.81mm
Delta Tmax @ Th: 68°C @ 25°C
Qmax @ Th: 28.7W @ 25°C
Current - Max: 6 A
Voltage - Max: 8.1 V
Resistance: 1.26 Ohms
Number of Stages: 1
на замовлення 20 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 2105.57 грн |
20+ | 1854.84 грн |
430163-518 |
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Виробник: Laird Thermal Systems
Thermoelectric Peltier Modules CP Series- Thermoelectric Cooler- RTV perimeter seal
Thermoelectric Peltier Modules CP Series- Thermoelectric Cooler- RTV perimeter seal
на замовлення 18 шт:
термін постачання 99-108 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 2264.39 грн |
5+ | 2155.9 грн |
10+ | 1849.61 грн |
20+ | 1738.1 грн |
60+ | 1680.95 грн |
100+ | 1588.26 грн |
260+ | 1571.54 грн |
90816-3518 |
Виробник: MOLEX
Category: IDC picoflex connectors 1,27mm
Description: Wire-board
Type of connector: wire-board
Category: IDC picoflex connectors 1,27mm
Description: Wire-board
Type of connector: wire-board
на замовлення 5400 шт:
термін постачання 21-30 дні (днів)Кількість | Ціна без ПДВ |
---|---|
15+ | 206.39 грн |
150+ | 169.87 грн |
300+ | 165.52 грн |
600+ | 162.61 грн |
1800+ | 159.71 грн |
5000+ | 144.46 грн |
PSR1635-18 |
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Виробник: Parlex
Flat Cables 2.54mm-18 500 FT Roll
Flat Cables 2.54mm-18 500 FT Roll
на замовлення 2 шт:
термін постачання 21-30 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 57846.34 грн |
5+ | 50870.44 грн |
PSR1635-18 |
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Виробник: Parlex USA LLC
Description: CABLE FFC 18COND 0.100" 500'
Features: Conductor 1 Tinned
Packaging: Spool
Jacket (Insulation) Material: Polyester
Pitch: 0.100" (2.54mm)
Ratings: UL Style 2643
Cable Length: 500' (152.4m)
Jacket (Insulation) Thickness: 0.002" (0.05mm)
Conductor Material: Copper, Bare
Cable Width: 1.90" (48.26mm)
Part Status: Active
Number of Conductors: 18
Description: CABLE FFC 18COND 0.100" 500'
Features: Conductor 1 Tinned
Packaging: Spool
Jacket (Insulation) Material: Polyester
Pitch: 0.100" (2.54mm)
Ratings: UL Style 2643
Cable Length: 500' (152.4m)
Jacket (Insulation) Thickness: 0.002" (0.05mm)
Conductor Material: Copper, Bare
Cable Width: 1.90" (48.26mm)
Part Status: Active
Number of Conductors: 18
на замовлення 1 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 55025.89 грн |
63518-1 |
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Виробник: TE Connectivity / AMP
Terminals RING 18-14 0198PTPBR
Terminals RING 18-14 0198PTPBR
на замовлення 55155 шт:
термін постачання 21-30 дні (днів)Кількість | Ціна без ПДВ |
---|---|
18+ | 18.13 грн |
21+ | 15.47 грн |
100+ | 10.24 грн |
500+ | 9.69 грн |
1000+ | 8.99 грн |
2500+ | 8.71 грн |
10000+ | 8.22 грн |
BS-31-6 |
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Виробник: 3M Electronic Specialty
Terminals BLK FORK 22-18 AWG 6
Terminals BLK FORK 22-18 AWG 6
на замовлення 12915 шт:
термін постачання 21-30 дні (днів)Кількість | Ціна без ПДВ |
---|---|
22+ | 15.12 грн |
32+ | 10.18 грн |
100+ | 7.39 грн |
1000+ | 5.99 грн |
2000+ | 5.64 грн |
25000+ | 4.81 грн |
50000+ | 4.67 грн |
BS-31-6 |
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Виробник: 3M
Description: CONN SPADE TERM 18-22AWG #6
Packaging: Bulk
Features: Butted Seam
Contact Finish: Tin
Mounting Type: Free Hanging (In-Line)
Wire Gauge: 18-22 AWG
Insulation: Non-Insulated
Terminal Type: Standard
Stud/Tab Size: 6 Stud
Length - Overall: 0.650" (16.50mm)
Termination: Crimp
Width - Outer Edges: 0.300" (7.62mm)
Contact Material: Copper, ETP
Part Status: Active
Description: CONN SPADE TERM 18-22AWG #6
Packaging: Bulk
Features: Butted Seam
Contact Finish: Tin
Mounting Type: Free Hanging (In-Line)
Wire Gauge: 18-22 AWG
Insulation: Non-Insulated
Terminal Type: Standard
Stud/Tab Size: 6 Stud
Length - Overall: 0.650" (16.50mm)
Termination: Crimp
Width - Outer Edges: 0.300" (7.62mm)
Contact Material: Copper, ETP
Part Status: Active
на замовлення 340 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
22+ | 14.32 грн |
26+ | 11.47 грн |
29+ | 10.16 грн |
50+ | 8.9 грн |
100+ | 8.26 грн |
250+ | 7.31 грн |
16-3518-00 |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
16-3518-01 |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товар відсутній
16-3518-101 |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
16-3518-101 |
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Виробник: Aries Electronics
IC & Component Sockets OPEN FRAME CAPACITOR SOLDER TAIL 16 PINS
IC & Component Sockets OPEN FRAME CAPACITOR SOLDER TAIL 16 PINS
товар відсутній
16-3518-101H |
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Виробник: Aries Electronics
IC & Component Sockets Open Frame Capacitor Collet Sckt
IC & Component Sockets Open Frame Capacitor Collet Sckt
товар відсутній
16-3518-101H |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 16POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 16POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
16-3518-102 |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 16POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 16POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
16-3518-102 |
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Виробник: Aries Electronics
IC & Component Sockets OPEN FRAME CAPACITOR SOLDER TAIL 16 PINS
IC & Component Sockets OPEN FRAME CAPACITOR SOLDER TAIL 16 PINS
товар відсутній
16-3518-10E |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
16-3518-10H |
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Виробник: Aries Electronics
IC & Component Sockets OPEN FRAME COLLET SOLDER TAIL 16 PINS
IC & Component Sockets OPEN FRAME COLLET SOLDER TAIL 16 PINS
товар відсутній
16-3518-10H |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
16-3518-10M |
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Виробник: Aries Electronics
IC & Component Sockets OPEN FRAME COLLET SOLDER TAIL 16 PINS
IC & Component Sockets OPEN FRAME COLLET SOLDER TAIL 16 PINS
товар відсутній
16-3518-10M |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
16-3518-111 |
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Виробник: Aries Electronics
IC & Component Sockets OPEN FRAME CAPACITOR SOLDER TAIL 16 PINS
IC & Component Sockets OPEN FRAME CAPACITOR SOLDER TAIL 16 PINS
товар відсутній
16-3518-111 |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 16POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 16POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товар відсутній
16-3518-112 |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 16POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 16POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товар відсутній
16-3518-112 |
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Виробник: Aries Electronics
IC & Component Sockets OPEN FRAME CAPACITOR SOLDER TAIL 16 PINS
IC & Component Sockets OPEN FRAME CAPACITOR SOLDER TAIL 16 PINS
товар відсутній
16-3518-11H |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товар відсутній
0908163518 |
товар відсутній
0908163518 |
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Виробник: Molex
Conn Picoflex HDR 18 POS 1.27mm Solder ST SMD Picoflex® T/R
Conn Picoflex HDR 18 POS 1.27mm Solder ST SMD Picoflex® T/R
товар відсутній
90816-3518 |
Виробник: MOLEX
Category: IDC picoflex connectors 1,27mm
Description: Wire-board
Type of connector: wire-board
кількість в упаковці: 1 шт
Category: IDC picoflex connectors 1,27mm
Description: Wire-board
Type of connector: wire-board
кількість в упаковці: 1 шт
на замовлення 5400 шт:
термін постачання 14-21 дні (днів)Кількість | Ціна без ПДВ |
---|---|
15+ | 247.67 грн |
150+ | 211.69 грн |
300+ | 198.62 грн |
600+ | 195.14 грн |
1800+ | 191.65 грн |
5000+ | 173.36 грн |
PSR1635-18 |
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Виробник: Parlex USA LLC
Description: CABLE FFC 18COND 0.100" 50'
Features: Conductor 1 Tinned
Packaging: Bulk
Jacket (Insulation) Material: Polyester
Pitch: 0.100" (2.54mm)
Ratings: UL Style 2643
Cable Length: 50' (15.24m)
Jacket (Insulation) Thickness: 0.002" (0.05mm)
Conductor Material: Copper, Bare
Cable Width: 1.90" (48.26mm)
Number of Conductors: 18
Description: CABLE FFC 18COND 0.100" 50'
Features: Conductor 1 Tinned
Packaging: Bulk
Jacket (Insulation) Material: Polyester
Pitch: 0.100" (2.54mm)
Ratings: UL Style 2643
Cable Length: 50' (15.24m)
Jacket (Insulation) Thickness: 0.002" (0.05mm)
Conductor Material: Copper, Bare
Cable Width: 1.90" (48.26mm)
Number of Conductors: 18
товар відсутній
PSR1635-18 |
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Виробник: Parlex USA LLC
Description: CABLE FLAT FLEX 18COND 0.100" 5'
Features: Conductor 1 Tinned
Packaging: Bulk
Jacket (Insulation) Material: Polyester
Pitch: 0.100" (2.54mm)
Ratings: UL Style 2643
Cable Length: 5' (1.52m)
Jacket (Insulation) Thickness: 0.002" (0.05mm)
Conductor Material: Copper, Bare
Cable Width: 1.90" (48.26mm)
Number of Conductors: 18
Description: CABLE FLAT FLEX 18COND 0.100" 5'
Features: Conductor 1 Tinned
Packaging: Bulk
Jacket (Insulation) Material: Polyester
Pitch: 0.100" (2.54mm)
Ratings: UL Style 2643
Cable Length: 5' (1.52m)
Jacket (Insulation) Thickness: 0.002" (0.05mm)
Conductor Material: Copper, Bare
Cable Width: 1.90" (48.26mm)
Number of Conductors: 18
товар відсутній
PSR1635-18 |
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Виробник: Parlex USA LLC
Description: CABLE FFC 18COND 0.100" 100'
Features: Conductor 1 Tinned
Packaging: Bulk
Jacket (Insulation) Material: Polyester
Pitch: 0.100" (2.54mm)
Ratings: UL Style 2643
Cable Length: 100' (30.5m)
Jacket (Insulation) Thickness: 0.002" (0.05mm)
Conductor Material: Copper, Bare
Cable Width: 1.90" (48.26mm)
Number of Conductors: 18
Description: CABLE FFC 18COND 0.100" 100'
Features: Conductor 1 Tinned
Packaging: Bulk
Jacket (Insulation) Material: Polyester
Pitch: 0.100" (2.54mm)
Ratings: UL Style 2643
Cable Length: 100' (30.5m)
Jacket (Insulation) Thickness: 0.002" (0.05mm)
Conductor Material: Copper, Bare
Cable Width: 1.90" (48.26mm)
Number of Conductors: 18
товар відсутній
PSR1635-18 |
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Виробник: Parlex USA LLC
Description: CABLE FFC 18COND 0.100" 10'
Features: Conductor 1 Tinned
Packaging: Bulk
Jacket (Insulation) Material: Polyester
Pitch: 0.100" (2.54mm)
Ratings: UL Style 2643
Cable Length: 10' (3.05m)
Jacket (Insulation) Thickness: 0.002" (0.05mm)
Conductor Material: Copper, Bare
Cable Width: 1.90" (48.26mm)
Number of Conductors: 18
Description: CABLE FFC 18COND 0.100" 10'
Features: Conductor 1 Tinned
Packaging: Bulk
Jacket (Insulation) Material: Polyester
Pitch: 0.100" (2.54mm)
Ratings: UL Style 2643
Cable Length: 10' (3.05m)
Jacket (Insulation) Thickness: 0.002" (0.05mm)
Conductor Material: Copper, Bare
Cable Width: 1.90" (48.26mm)
Number of Conductors: 18
товар відсутній
PSR1635-18 |
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Виробник: Parlex USA LLC
Description: CABLE FFC 18COND 0.100" 250'
Features: Conductor 1 Tinned
Packaging: Bulk
Jacket (Insulation) Material: Polyester
Pitch: 0.100" (2.54mm)
Ratings: UL Style 2643
Cable Length: 250' (76.2m)
Jacket (Insulation) Thickness: 0.002" (0.05mm)
Conductor Material: Copper, Bare
Cable Width: 1.90" (48.26mm)
Number of Conductors: 18
Description: CABLE FFC 18COND 0.100" 250'
Features: Conductor 1 Tinned
Packaging: Bulk
Jacket (Insulation) Material: Polyester
Pitch: 0.100" (2.54mm)
Ratings: UL Style 2643
Cable Length: 250' (76.2m)
Jacket (Insulation) Thickness: 0.002" (0.05mm)
Conductor Material: Copper, Bare
Cable Width: 1.90" (48.26mm)
Number of Conductors: 18
товар відсутній
PSR1635-18 |
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Виробник: Parlex USA LLC
Description: CABLE FFC 18COND 0.100" 25'
Features: Conductor 1 Tinned
Packaging: Bulk
Jacket (Insulation) Material: Polyester
Pitch: 0.100" (2.54mm)
Ratings: UL Style 2643
Cable Length: 25' (7.62m)
Jacket (Insulation) Thickness: 0.002" (0.05mm)
Conductor Material: Copper, Bare
Cable Width: 1.90" (48.26mm)
Number of Conductors: 18
Description: CABLE FFC 18COND 0.100" 25'
Features: Conductor 1 Tinned
Packaging: Bulk
Jacket (Insulation) Material: Polyester
Pitch: 0.100" (2.54mm)
Ratings: UL Style 2643
Cable Length: 25' (7.62m)
Jacket (Insulation) Thickness: 0.002" (0.05mm)
Conductor Material: Copper, Bare
Cable Width: 1.90" (48.26mm)
Number of Conductors: 18
товар відсутній
ETIMAT 6 2P D25 |
Виробник: ETI POLAM
Category: Circuit Breakers
Description: Circuit breaker; 230/400VAC; Inom: 25A; Poles: 2; Charact: D; 6kA
Mounting: for DIN rail mounting
Mechanical durability: 20000 cycles
Rated voltage: 230/400V AC
Operating temperature: -25...55°C
Current rating: 25A
IP rating: IP20
Characteristics: D
Cross section of connecting wires: 1...25mm2
Conform to the norm: IEC EN 60898; IEC EN 60947-2
Short circuit breaking capacity: 6kA
Manufacturer series: ETIMAT 6
Type of protection: circuit breaker
Number of poles: 2
Trade name: MCB
Category: Circuit Breakers
Description: Circuit breaker; 230/400VAC; Inom: 25A; Poles: 2; Charact: D; 6kA
Mounting: for DIN rail mounting
Mechanical durability: 20000 cycles
Rated voltage: 230/400V AC
Operating temperature: -25...55°C
Current rating: 25A
IP rating: IP20
Characteristics: D
Cross section of connecting wires: 1...25mm2
Conform to the norm: IEC EN 60898; IEC EN 60947-2
Short circuit breaking capacity: 6kA
Manufacturer series: ETIMAT 6
Type of protection: circuit breaker
Number of poles: 2
Trade name: MCB
товар відсутній
ETIMAT 6 2P D25 |
Виробник: ETI POLAM
Category: Circuit Breakers
Description: Circuit breaker; 230/400VAC; Inom: 25A; Poles: 2; Charact: D; 6kA
Mounting: for DIN rail mounting
Mechanical durability: 20000 cycles
Rated voltage: 230/400V AC
Operating temperature: -25...55°C
Current rating: 25A
IP rating: IP20
Characteristics: D
Cross section of connecting wires: 1...25mm2
Conform to the norm: IEC EN 60898; IEC EN 60947-2
Short circuit breaking capacity: 6kA
Manufacturer series: ETIMAT 6
Type of protection: circuit breaker
Number of poles: 2
Trade name: MCB
кількість в упаковці: 1 шт
Category: Circuit Breakers
Description: Circuit breaker; 230/400VAC; Inom: 25A; Poles: 2; Charact: D; 6kA
Mounting: for DIN rail mounting
Mechanical durability: 20000 cycles
Rated voltage: 230/400V AC
Operating temperature: -25...55°C
Current rating: 25A
IP rating: IP20
Characteristics: D
Cross section of connecting wires: 1...25mm2
Conform to the norm: IEC EN 60898; IEC EN 60947-2
Short circuit breaking capacity: 6kA
Manufacturer series: ETIMAT 6
Type of protection: circuit breaker
Number of poles: 2
Trade name: MCB
кількість в упаковці: 1 шт
товар відсутній
HEDS-9140-B00 |
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Виробник: Broadcom Limited
Description: ROTARY ENCODER OPTICAL 1000PPR
Packaging: Bulk
Output Type: Quadrature with Index (Incremental)
Mounting Type: Chassis Mount
Orientation: Vertical
Termination Style: Terminal Pins
Voltage - Supply: 5V
Encoder Type: Optical
Detent: No
Pulses per Revolution: 1000
Actuator Type: Codewheel Not Included
Built in Switch: No
Part Status: Active
DigiKey Programmable: Not Verified
Description: ROTARY ENCODER OPTICAL 1000PPR
Packaging: Bulk
Output Type: Quadrature with Index (Incremental)
Mounting Type: Chassis Mount
Orientation: Vertical
Termination Style: Terminal Pins
Voltage - Supply: 5V
Encoder Type: Optical
Detent: No
Pulses per Revolution: 1000
Actuator Type: Codewheel Not Included
Built in Switch: No
Part Status: Active
DigiKey Programmable: Not Verified
товар відсутній
MCIMX353DJQ5CR2 |
Виробник: NXP USA Inc.
Description: IC MPU I.MX35 532MHZ 400LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 532MHz
Operating Temperature: -20°C ~ 70°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; GPU, IPU, VFP
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, KPP, LCD
Security Features: Secure Fusebox, Secure JTAG, Tamper Detection
Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SPI, SSI, UART
Description: IC MPU I.MX35 532MHZ 400LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 532MHz
Operating Temperature: -20°C ~ 70°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; GPU, IPU, VFP
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, KPP, LCD
Security Features: Secure Fusebox, Secure JTAG, Tamper Detection
Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SPI, SSI, UART
товар відсутній
MCIMX353DJQ5CR2 |
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Виробник: NXP Semiconductors
SOC i.MX35 ARM1136JF-S 0.09um 400-Pin MAP-BGA T/R
SOC i.MX35 ARM1136JF-S 0.09um 400-Pin MAP-BGA T/R
товар відсутній
MCIMX353DJQ5CR2 |
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Виробник: NXP Semiconductors
Processors - Application Specialised RINGO MX35 TO2.1
Processors - Application Specialised RINGO MX35 TO2.1
товар відсутній
MCZ33903DD3EKR2 |
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Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 32-SSOP-EP
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 32-SSOP-EP
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