1571550-2 TE Connectivity


DDEController?Action=srchrtrv&DocNm=1571550&DocType=Customer+Drawing&DocLang=English Виробник: TE Connectivity
15715502-TEC-0 Semiconductors - accessories - Unclass.
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Технічний опис 1571550-2 TE Connectivity

Description: CONN IC DIP SOCKET 8POS TIN, Packaging: Tube, Features: Closed Frame, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 105°C, Number of Positions or Pins (Grid): 8 (2 x 4), Termination: Solder, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Material - Post: Beryllium Copper.

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1571550-2 1571550-2 Виробник : TE Connectivity 15715502.pdf Conn DIP Socket SKT 8 POS 2.54mm Solder ST Thru-Hole Tube
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1571550-2 Виробник : TE Connectivity AMP Connectors DDEController?Action=srchrtrv&DocNm=1571550&DocType=Customer+Drawing&DocLang=English Description: CONN IC DIP SOCKET 8POS TIN
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Beryllium Copper
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