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153208-2020-RB-WB 3M Interconnect Solutions
на замовлення 2400 шт:
термін постачання 21-31 дні (днів)
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Технічний опис 153208-2020-RB-WB 3M Interconnect Solutions
Description: CONN RCPT 8POS 0.079 GOLD SMD, Features: Board Guide, Pick and Place, Packaging: Tape & Reel (TR), Connector Type: Receptacle, Bottom or Top Entry, Voltage Rating: 500VDC, Current Rating (Amps): 1A, Mounting Type: Surface Mount, Number of Positions: 8, Style: Board to Board or Cable, Operating Temperature: -55°C ~ 105°C, Contact Type: Female Socket, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Insulation Color: Black, Pitch - Mating: 0.079" (2.00mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Post: Tin, Insulation Height: 0.129" (3.28mm), Row Spacing - Mating: 0.079" (2.00mm), Number of Rows: 2.
Інші пропозиції 153208-2020-RB-WB
Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
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153208-2020-RB-WB | Виробник : 3M Interconnect Solutions |
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на замовлення 2400 шт: термін постачання 21-31 дні (днів) |
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153208-2020-RB-WB | Виробник : 3M |
Description: CONN RCPT 8POS 0.079 GOLD SMD Features: Board Guide, Pick and Place Packaging: Tape & Reel (TR) Connector Type: Receptacle, Bottom or Top Entry Voltage Rating: 500VDC Current Rating (Amps): 1A Mounting Type: Surface Mount Number of Positions: 8 Style: Board to Board or Cable Operating Temperature: -55°C ~ 105°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.079" (2.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Tin Insulation Height: 0.129" (3.28mm) Row Spacing - Mating: 0.079" (2.00mm) Number of Rows: 2 |
товар відсутній |
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153208-2020-RB-WB | Виробник : 3M Electronic Solutions Division |
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товар відсутній |