110-83-422-41-530000 Mill-Max Manufacturing Corp.


2017-11%3A090.pdf Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 300.0µin (7.62µm)
Contact Material - Post: Brass Alloy
Part Status: Obsolete
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Технічний опис 110-83-422-41-530000 Mill-Max Manufacturing Corp.

Description: CONN IC SKT DBL, Packaging: Bulk, Features: Open Frame, Mounting Type: Through Hole, Type: DIP, 0.4" (10.16mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 22 (2 x 11), Termination: Solder, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin-Lead, Contact Finish Thickness - Post: 300.0µin (7.62µm), Contact Material - Post: Brass Alloy, Part Status: Obsolete.

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110-83-422-41-530000 Виробник : Mill-Max MMMCS17783_1-2552402.pdf IC & Component Sockets DIP Dual In Line Socket
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