10150098-3200RLF AMPHENOL COMMUNICATIONS SOLUTIONS
Виробник: AMPHENOL COMMUNICATIONS SOLUTIONSDescription: AMPHENOL COMMUNICATIONS SOLUTIONS - 10150098-3200RLF - Stiftleiste, Board-to-Board, 1 mm, 2 Reihe(n), 32 Kontakt(e), Oberflächenmontage, gerade
tariffCode: 85366930
rohsCompliant: YES
Kontaktüberzug: Kontakte mit einer Beschichtung aus Gold über Palladium-Nickel
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Bronze
usEccn: EAR99
Steckverbinderkragen: Mit Kragen
Anzahl der Kontakte: 32Kontakt(e)
euEccn: NLR
Steckverbindersysteme: Board-to-Board
Produktpalette: FCI Minitek MicroSpeed
productTraceability: No
Kontaktanschluss: Oberflächenmontage, gerade
Anzahl der Reihen: 2Reihe(n)
Rastermaß: 1mm
SVHC: No SVHC (17-Jan-2023)
на замовлення 2400 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1200+ | 180.59 грн |
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Технічний опис 10150098-3200RLF AMPHENOL COMMUNICATIONS SOLUTIONS
Description: CONN MICROSPEED 1.00MM BOARD-, Features: Board Guide, Pick and Place, Solder Retention, Packaging: Tape & Reel (TR), Connector Type: Header, Voltage Rating: 100VAC, Current Rating (Amps): 1A per Contact, Mounting Type: Surface Mount, Number of Positions: 32, Number of Rows: 2, Style: Board to Cable/Wire, Operating Temperature: -55°C ~ 125°C, Contact Type: Male Pin, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Contact Material: Copper Alloy, Insulation Color: Black, Pitch - Mating: 0.039" (1.00mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 3.94µin (0.100µm), Contact Finish - Post: Tin, Part Status: Active, Contact Shape: Square, Insulation Height: 0.226" (5.74mm), Shrouding: Shrouded - 4 Wall, Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled, Row Spacing - Mating: 0.059" (1.50mm), Contact Length - Mating: 0.114" (2.90mm).
Інші пропозиції 10150098-3200RLF за ціною від 239.81 грн до 456.85 грн
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ | ||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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10150098-3200RLF | Виробник : Amphenol FCI |
Board to Board & Mezzanine Connectors 1.00MM MINITEK BTB RA |
на замовлення 1186 шт: термін постачання 21-30 дні (днів) |
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10150098-3200RLF | Виробник : Amphenol ICC (FCI) |
Description: CONN MICROSPEED 1.00MM BOARD- Features: Board Guide, Pick and Place, Solder Retention Packaging: Tape & Reel (TR) Connector Type: Header Voltage Rating: 100VAC Current Rating (Amps): 1A per Contact Mounting Type: Surface Mount Number of Positions: 32 Number of Rows: 2 Style: Board to Cable/Wire Operating Temperature: -55°C ~ 125°C Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Copper Alloy Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.94µin (0.100µm) Contact Finish - Post: Tin Part Status: Active Contact Shape: Square Insulation Height: 0.226" (5.74mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled Row Spacing - Mating: 0.059" (1.50mm) Contact Length - Mating: 0.114" (2.90mm) |
на замовлення 2388 шт: термін постачання 21-31 дні (днів) |
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10150098-3200RLF | Виробник : AMPHENOL COMMUNICATIONS SOLUTIONS |
Description: AMPHENOL COMMUNICATIONS SOLUTIONS - 10150098-3200RLF - Stiftleiste, Board-to-Board, 1 mm, 2 Reihe(n), 32 Kontakt(e), Oberflächenmontage, gerade tariffCode: 85366930 rohsCompliant: YES Kontaktüberzug: Kontakte mit einer Beschichtung aus Gold über Palladium-Nickel hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: Bronze usEccn: EAR99 Steckverbinderkragen: Mit Kragen Anzahl der Kontakte: 32Contacts euEccn: NLR Steckverbindersysteme: Board-to-Board Produktpalette: FCI Minitek MicroSpeed productTraceability: No Kontaktanschluss: Oberflächenmontage, gerade Anzahl der Reihen: 2Reihe(n) Rastermaß: 1mm SVHC: No SVHC (17-Jan-2023) |
на замовлення 1170 шт: термін постачання 21-31 дні (днів) |
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10150098-3200RLF | Виробник : Amphenol ICC (FCI) |
Description: CONN MICROSPEED 1.00MM BOARD- Features: Board Guide, Pick and Place, Solder Retention Packaging: Cut Tape (CT) Connector Type: Header Voltage Rating: 100VAC Current Rating (Amps): 1A per Contact Mounting Type: Surface Mount Number of Positions: 32 Number of Rows: 2 Style: Board to Cable/Wire Operating Temperature: -55°C ~ 125°C Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Copper Alloy Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.94µin (0.100µm) Contact Finish - Post: Tin Part Status: Active Contact Shape: Square Insulation Height: 0.226" (5.74mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled Row Spacing - Mating: 0.059" (1.50mm) Contact Length - Mating: 0.114" (2.90mm) |
на замовлення 2388 шт: термін постачання 21-31 дні (днів) |
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| 10150098-3200RLF | Виробник : FCI |
Conn Wire to Board M 32 POS 1mm Solder ST SMD T/R |
товар відсутній |
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| 10150098-3200RLF | Виробник : AMPHENOL |
101500983200RL-0 Signal connectors - Unclassified |
товар відсутній |
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10150098-3200RLF | Виробник : Amphenol ICC (FCI) |
Description: CONN MICROSPEED 1.00MM BOARD- Features: Board Guide, Pick and Place, Solder Retention Packaging: Tape & Reel (TR) Connector Type: Header Voltage Rating: 100VAC Current Rating (Amps): 1A per Contact Mounting Type: Surface Mount Number of Positions: 32 Number of Rows: 2 Style: Board to Cable/Wire Operating Temperature: -55°C ~ 125°C Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Copper Alloy Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.94µin (0.100µm) Contact Finish - Post: Tin Part Status: Active Contact Shape: Square Insulation Height: 0.226" (5.74mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled Row Spacing - Mating: 0.059" (1.50mm) Contact Length - Mating: 0.114" (2.90mm) |
товар відсутній |