Технічний опис 1-1437542-1 TE Connectivity
Description: CONN IC DIP SOCKET 8POS GOLD, Features: Carrier, Closed Frame, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 8 (2 x 4), Termination: Solder, Housing Material: Aluminum Alloy, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 20.0µin (0.51µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 20.0µin (0.51µm), Contact Material - Post: Beryllium Copper, Part Status: Obsolete.
Інші пропозиції 1-1437542-1
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
|---|---|---|---|---|---|
| 1-1437542-1 | Виробник : TE Connectivity AMP Connectors |
 Description: CONN IC DIP SOCKET 8POS GOLDFeatures: Carrier, Closed Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 8 (2 x 4) Termination: Solder Housing Material: Aluminum Alloy Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 20.0µin (0.51µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 20.0µin (0.51µm) Contact Material - Post: Beryllium Copper Part Status: Obsolete |
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