0459714305 Molex
Виробник: MolexDescription: CONN HD ARRAY RCPT 400P SMD GOLD
Features: Board Guide
Packaging: Cut Tape (CT)
Connector Type: High Density Array, Female
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 400
Pitch: 0.050" (1.27mm)
Height Above Board: 0.258" (6.55mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Mated Stacking Heights: 8.5mm, 9mm, 9.5mm, 10mm, 11mm, 11.5mm, 13.5mm
Number of Rows: 10
на замовлення 80 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1577.85 грн |
| 10+ | 1313.9 грн |
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Технічний опис 0459714305 Molex
Description: CONN HD ARRAY RCPT 400P SMD GOLD, Features: Board Guide, Packaging: Tape & Reel (TR), Connector Type: High Density Array, Female, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 400, Pitch: 0.050" (1.27mm), Height Above Board: 0.258" (6.55mm), Contact Finish Thickness: 30.0µin (0.76µm), Mated Stacking Heights: 8.5mm, 9mm, 9.5mm, 10mm, 11mm, 11.5mm, 13.5mm, Number of Rows: 10.
Інші пропозиції 0459714305
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
|---|---|---|---|---|---|
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0459714305 | Виробник : Molex |
Conn Board to Board RCP 400 POS 1.27mm Solder ST SMD SEARAY T/R |
товар відсутній |
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0459714305 | Виробник : Molex |
Description: CONN HD ARRAY RCPT 400P SMD GOLD Features: Board Guide Packaging: Tape & Reel (TR) Connector Type: High Density Array, Female Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 400 Pitch: 0.050" (1.27mm) Height Above Board: 0.258" (6.55mm) Contact Finish Thickness: 30.0µin (0.76µm) Mated Stacking Heights: 8.5mm, 9mm, 9.5mm, 10mm, 11mm, 11.5mm, 13.5mm Number of Rows: 10 |
товар відсутній |