Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (35281) > Сторінка 556 з 589
Фото | Назва | Виробник | Інформація |
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MIMX9352XVTXMAB | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 306-LFBGA, FCBGA Mounting Type: Surface Mount Speed: 250MHz, 1.7GHz Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Voltage - I/O: 1.8V Supplier Device Package: 306-FCBGA (14x14) Ethernet: GbE (2) USB: USB 2.0 (2) Number of Cores/Bus Width: 2, 1 Core, 64-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR4 Graphics Acceleration: No Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART |
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MIMX9331AVTYMAB | NXP USA Inc. |
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MIMX9332AVTYMAB | NXP USA Inc. |
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MIMX9351AVTYMAB | NXP USA Inc. |
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TJA1103SDB | NXP USA Inc. |
![]() Packaging: Box Function: Ethernet PHY Type: Interface Utilized IC / Part: TJA1103 Supplied Contents: Board(s) Primary Attributes: 100BASE-T1 Embedded: Yes, MCU |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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MC56F81866AMLFA | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 48-LQFP Mounting Type: Surface Mount Interface: DMA, I2C, LINbus, SCI, QSPI Type: Digital Signal Controllers Operating Temperature: -40°C ~ 125°C (TA) Non-Volatile Memory: FLASH (128kB) On-Chip RAM: 20kB Voltage - I/O: 3.30V Voltage - Core: 3.30V Clock Rate: 100MHz Supplier Device Package: 48-LQFP (7x7) |
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LPC1113FBD48/303,1 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 24KB (24K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 42 DigiKey Programmable: Not Verified |
на замовлення 250 шт: термін постачання 21-31 дні (днів) |
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LPC1113FHN33/202,5 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 32-VQFN Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 24KB (24K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Supplier Device Package: 32-HVQFN (7x7) Number of I/O: 28 DigiKey Programmable: Not Verified |
на замовлення 1040 шт: термін постачання 21-31 дні (днів) |
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LPC1113FHN33/203,5 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 32-VQFN Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 24KB (24K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Supplier Device Package: 32-HVQFN (7x7) Number of I/O: 28 DigiKey Programmable: Not Verified |
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LPC1113JHN33/203E | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 32-VQFN Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 24KB (24K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Supplier Device Package: 32-HVQFN (7x7) Number of I/O: 28 DigiKey Programmable: Not Verified |
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PM823HN/A0CHP | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 24-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.7V ~ 5.5V Frequency - Switching: 3MHz Topology: Step-Down (Buck) Synchronous (2), Linear (LDO) (1) Supplier Device Package: 24-HVQFN (4x4) Voltage/Current - Output 1: 1.1V, 1.5A Voltage/Current - Output 2: 2.2V, 1.5A Voltage/Current - Output 3: 1.8V, 525mA w/LED Driver: No w/Supervisor: No w/Sequencer: No Number of Outputs: 3 |
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MC56F81868LVLH | NXP USA Inc. |
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FB32K146HAT0VLLR | NXP USA Inc. |
Description: S32K144 32-BIT MCU, ARM CORTEX-M Packaging: Tape & Reel (TR) |
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PCF85063AT/AY | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Features: Alarm, Leap Year, Square Wave Output Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Interface: I2C, 2-Wire Serial Type: Clock/Calendar Operating Temperature: -40°C ~ 85°C Voltage - Supply: 0.9V ~ 5.5V Time Format: HH:MM:SS (12/24 hr) Date Format: YY-MM-DD-dd Supplier Device Package: 8-SO Current - Timekeeping (Max): 0.6µA @ 3.3V DigiKey Programmable: Not Verified |
на замовлення 76834 шт: термін постачання 21-31 дні (днів) |
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PCF85063AT/AY | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Features: Alarm, Leap Year, Square Wave Output Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Interface: I2C, 2-Wire Serial Type: Clock/Calendar Operating Temperature: -40°C ~ 85°C Voltage - Supply: 0.9V ~ 5.5V Time Format: HH:MM:SS (12/24 hr) Date Format: YY-MM-DD-dd Supplier Device Package: 8-SO Current - Timekeeping (Max): 0.6µA @ 3.3V DigiKey Programmable: Not Verified |
на замовлення 76834 шт: термін постачання 21-31 дні (днів) |
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PSMN8R5-100ESQ | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: TO-262-3 Long Leads, I2PAK, TO-262AA Mounting Type: Through Hole Operating Temperature: -55°C ~ 175°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 100A (Tj) Rds On (Max) @ Id, Vgs: 8.5mOhm @ 25A, 10V Power Dissipation (Max): 263W (Tc) Vgs(th) (Max) @ Id: 4V @ 1mA Supplier Device Package: I2PAK Drive Voltage (Max Rds On, Min Rds On): 10V Vgs (Max): ±20V Drain to Source Voltage (Vdss): 100 V Gate Charge (Qg) (Max) @ Vgs: 111 nC @ 10 V Input Capacitance (Ciss) (Max) @ Vds: 5512 pF @ 50 V |
на замовлення 1274 шт: термін постачання 21-31 дні (днів) |
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MC9S08DZ32AMLF | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 32KB (32K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 1K x 8 Core Processor: S08 Data Converters: A/D 16x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 39 DigiKey Programmable: Not Verified |
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MC9S08DZ32ACLH | NXP USA Inc. |
Description: IC MCU 8BIT 32KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 32KB (32K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 1K x 8 Core Processor: S08 Data Converters: A/D 24x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 53 DigiKey Programmable: Not Verified |
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MC908AZ32AVFUE | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 64-QFP Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 32KB (32K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: HC08 Data Converters: A/D 15x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: CANbus, SCI, SPI Peripherals: LVD, POR, PWM Supplier Device Package: 64-QFP (14x14) Number of I/O: 40 DigiKey Programmable: Not Verified |
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74HC151DB,118 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 16-SSOP (0.209", 5.30mm Width) Mounting Type: Surface Mount Circuit: 1 x 8:1 Type: Multiplexer Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Independent Circuits: 1 Current - Output High, Low: 5.2mA, 5.2mA Voltage Supply Source: Single Supply Supplier Device Package: 16-SSOP |
на замовлення 3696 шт: термін постачання 21-31 дні (днів) |
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74HC151DB,112 | NXP USA Inc. |
![]() Packaging: Tube Package / Case: 16-SSOP (0.209", 5.30mm Width) Mounting Type: Surface Mount Circuit: 1 x 8:1 Type: Multiplexer Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Independent Circuits: 1 Current - Output High, Low: 5.2mA, 5.2mA Voltage Supply Source: Single Supply Supplier Device Package: 16-SSOP |
на замовлення 2751 шт: термін постачання 21-31 дні (днів) |
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NTB0102JKZ | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 8-XFDFN Output Type: Tri-State Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Data Rate: 100Mbps Supplier Device Package: 8-X2SON (1.35x1) Channel Type: Bidirectional Translator Type: Voltage Level Channels per Circuit: 2 Voltage - VCCA: 1.2 V ~ 3.6 V Voltage - VCCB: 1.65 V ~ 5.5 V Number of Circuits: 1 |
на замовлення 6000 шт: термін постачання 21-31 дні (днів) |
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NXH3675UK/A2Z | NXP USA Inc. |
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SPC5644BF0MLU1R | NXP USA Inc. |
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP Packaging: Tape & Reel (TR) Package / Case: 176-LQFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 1.5MB (1.5M x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z4d Data Converters: A/D 27x10b, 5x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 176-LQFP (24x24) Number of I/O: 147 DigiKey Programmable: Not Verified |
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SPC5644BCF0VLU8R | NXP USA Inc. |
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP Packaging: Tape & Reel (TR) Package / Case: 176-LQFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 1.5MB (1.5M x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z4d Data Converters: A/D 27x10b, 5x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 176-LQFP (24x24) Number of I/O: 147 DigiKey Programmable: Not Verified |
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SPC5644BF0MLU1 | NXP USA Inc. |
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP Packaging: Tray Package / Case: 176-LQFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 1.5MB (1.5M x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z4d Data Converters: A/D 27x10b, 5x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 176-LQFP (24x24) Number of I/O: 147 DigiKey Programmable: Not Verified |
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SPC5644BCF0VLU8 | NXP USA Inc. |
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP Packaging: Tray Package / Case: 176-LQFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 1.5MB (1.5M x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z4d Data Converters: A/D 27x10b, 5x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 176-LQFP (24x24) Number of I/O: 147 DigiKey Programmable: Not Verified |
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SPC5644BK0VLU1 | NXP USA Inc. |
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP Packaging: Tray Package / Case: 176-LQFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 1.5MB (1.5M x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z4d Data Converters: A/D 27x10b, 5x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 176-LQFP (24x24) Number of I/O: 147 DigiKey Programmable: Not Verified |
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BUK9520-55A,127 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: TO-220-3 Mounting Type: Through Hole Operating Temperature: -55°C ~ 175°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 54A (Tc) Rds On (Max) @ Id, Vgs: 18mOhm @ 25A, 10V Power Dissipation (Max): 118W (Tc) Vgs(th) (Max) @ Id: 2V @ 1mA Supplier Device Package: TO-220AB Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V Vgs (Max): ±10V Drain to Source Voltage (Vdss): 55 V Input Capacitance (Ciss) (Max) @ Vds: 2210 pF @ 25 V |
на замовлення 1364 шт: термін постачання 21-31 дні (днів) |
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BUK9520-100B,127 | NXP USA Inc. |
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на замовлення 8479 шт: термін постачання 21-31 дні (днів) |
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BUK9520-100A,127 | NXP USA Inc. |
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на замовлення 2996 шт: термін постачання 21-31 дні (днів) |
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PBLS2001D,115 | NXP USA Inc. |
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на замовлення 51400 шт: термін постачання 21-31 дні (днів) |
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MC33FS8530A4KSR2 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 60V Applications: System Basis Chip Current - Supply: 15mA Supplier Device Package: 56-HVQFN (8x8) Grade: Automotive Qualification: AEC-Q100 |
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MC33FS8530A4KS | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 60V Applications: System Basis Chip Current - Supply: 15mA Supplier Device Package: 56-HVQFN (8x8) Grade: Automotive Qualification: AEC-Q100 |
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S9KEAZN8ACTGR | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 16-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 8KB (8K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, LINbus, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 16-TSSOP Number of I/O: 14 |
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SPC5745CBK1AMMJ6 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 256-LBGA Mounting Type: Surface Mount Speed: 80MHz, 160MHz Program Memory Size: 2MB (2M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z2, e200z4 Data Converters: A/D 36x10b, 16x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI Peripherals: DMA, I2S, POR, WDT Supplier Device Package: 256-MAPPBGA (17x17) Number of I/O: 178 DigiKey Programmable: Not Verified |
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MC56F80738VLH | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 48KB (48K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: 56800EF Data Converters: A/D 14x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V Connectivity: I2C, LINbus, SCI, SPI Peripherals: Brown-out Detect/Reset, DMA, LVI, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 54 DigiKey Programmable: Not Verified |
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PEMI6QFN/HE,132 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 12-XFDFN Size / Dimension: 0.098" L x 0.047" W (2.50mm x 1.20mm) Mounting Type: Surface Mount Type: Low Pass Operating Temperature: -40°C ~ 85°C Values: R = 45Ohms, C = 8.5pF (Total) Height: 0.020" (0.50mm) Attenuation Value: 9dB @ 800MHz ~ 3GHz Filter Order: 2nd Applications: LAN, PCS, WAN Technology: RC (Pi) Resistance - Channel (Ohms): 45 ESD Protection: Yes Number of Channels: 6 |
на замовлення 16000 шт: термін постачання 21-31 дні (днів) |
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SAF7751HN/N207WK | NXP USA Inc. |
Description: CAR DISP Packaging: Bulk |
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TDA8766G/C1,118 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 32-LQFP Mounting Type: Surface Mount Number of Bits: 10 Configuration: ADC Data Interface: Parallel Reference Type: External Operating Temperature: 20°C ~ 75°C Voltage - Supply, Analog: 3V ~ 5.25V Voltage - Supply, Digital: 3V ~ 5.25V Sampling Rate (Per Second): 20M Input Type: Single Ended Number of Inputs: 1 Supplier Device Package: 32-LQFP (5x5) Architecture: Sigma-Delta Number of A/D Converters: 1 |
на замовлення 2000 шт: термін постачання 21-31 дні (днів) |
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S912XD256F1CAAR | NXP USA Inc. |
Description: IC MCU 16BIT 256KB FLASH 80QFP Packaging: Tape & Reel (TR) Package / Case: 80-QFP Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 256KB (256K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: HCS12X Data Converters: A/D 8x10b, 16x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V Connectivity: CANbus, I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 80-QFP (14x14) Number of I/O: 59 DigiKey Programmable: Not Verified |
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XC7SH32GV,125 | NXP USA Inc. |
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на замовлення 120000 шт: термін постачання 21-31 дні (днів) |
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XC7SET14GV,125 | NXP USA Inc. |
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на замовлення 76262 шт: термін постачання 21-31 дні (днів) |
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XC7SH125GM,115 | NXP USA Inc. |
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на замовлення 167064 шт: термін постачання 21-31 дні (днів) |
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PBSS5350SS,115 | NXP USA Inc. |
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на замовлення 1790 шт: термін постачання 21-31 дні (днів) |
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MC32PF1550A5EPR2 | NXP USA Inc. |
Description: PF1550 Packaging: Tape & Reel (TR) Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C Voltage - Supply: 3.8V ~ 7V Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices Supplier Device Package: 40-HVQFN (5x5) |
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MC32PF1550A7EPR2 | NXP USA Inc. |
Description: PF1550 Packaging: Tape & Reel (TR) Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C Voltage - Supply: 3.8V ~ 7V Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices Supplier Device Package: 40-HVQFN (5x5) |
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MC32PF1550A6EP | NXP USA Inc. |
Description: PF1550 Packaging: Tray Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C Voltage - Supply: 3.8V ~ 7V Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices Supplier Device Package: 40-HVQFN (5x5) |
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74LVC157ADB,112 | NXP USA Inc. |
![]() Packaging: Tube |
на замовлення 4591 шт: термін постачання 21-31 дні (днів) |
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NAFE11388B40BSMP | NXP USA Inc. |
Description: IC 8-IN LOW-POWER 25V AFE Packaging: Tape & Reel (TR) Package / Case: 64-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Number of Bits: 24 Voltage - Supply, Analog: 2.97V ~ 3.6V Voltage - Supply, Digital: 2.97V ~ 3.6V Supplier Device Package: 64-HVQFN (9x9) Number of Channels: 8 Power (Watts): 125 mW |
на замовлення 1000 шт: термін постачання 21-31 дні (днів) |
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NAFE11388B40BSMP | NXP USA Inc. |
Description: IC 8-IN LOW-POWER 25V AFE Packaging: Cut Tape (CT) Package / Case: 64-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Number of Bits: 24 Voltage - Supply, Analog: 2.97V ~ 3.6V Voltage - Supply, Digital: 2.97V ~ 3.6V Supplier Device Package: 64-HVQFN (9x9) Number of Channels: 8 Power (Watts): 125 mW |
на замовлення 1000 шт: термін постачання 21-31 дні (днів) |
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NAFE11388B40BSE | NXP USA Inc. |
Description: IC 8-IN LOW-POWER 25V AFE Packaging: Tray Package / Case: 64-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Number of Bits: 24 Voltage - Supply, Analog: 2.97V ~ 3.6V Voltage - Supply, Digital: 2.97V ~ 3.6V Supplier Device Package: 64-HVQFN (9x9) Number of Channels: 8 Power (Watts): 125 mW |
на замовлення 260 шт: термін постачання 21-31 дні (днів) |
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S912XDP512J1CAGR | NXP USA Inc. |
Description: IC MCU 16BIT 512KB FLASH 144LQFP Packaging: Tape & Reel (TR) Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 512KB (512K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 8x10b, 16x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V Connectivity: CANbus, I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 119 DigiKey Programmable: Not Verified |
на замовлення 1000 шт: термін постачання 21-31 дні (днів) |
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SAF775DHV/N208W/GY | NXP USA Inc. |
Description: CAR DISP Packaging: Tape & Reel (TR) |
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SAF775DHV/N208W/GK | NXP USA Inc. |
Description: CAR DISP Packaging: Tray |
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SAF775DHV/N208W/EY | NXP USA Inc. |
Description: CAR DISP Packaging: Tape & Reel (TR) |
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SAF775DHV/N208W/EK | NXP USA Inc. |
Description: CAR DISP Packaging: Tray |
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SAF775CHV/N208W/KY | NXP USA Inc. |
Description: CAR RADIO TUNER & AUDIO DSP Packaging: Bulk |
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SAF775CHV/N208W/KK | NXP USA Inc. |
Description: CAR RADIO TUNER & AUDIO DSP Packaging: Tray |
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SAF775CHV/N208W/AY | NXP USA Inc. |
Description: CAR RADIO TUNER & AUDIO DSP Packaging: Tape & Reel (TR) |
товар відсутній |
MIMX9352XVTXMAB |
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Виробник: NXP USA Inc.
Description: IC
Packaging: Bulk
Package / Case: 306-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 306-FCBGA (14x14)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 2, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Description: IC
Packaging: Bulk
Package / Case: 306-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 306-FCBGA (14x14)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 2, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
товар відсутній
TJA1103SDB |
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Виробник: NXP USA Inc.
Description: TJA1103 SABRE DEV BOARD
Packaging: Box
Function: Ethernet PHY
Type: Interface
Utilized IC / Part: TJA1103
Supplied Contents: Board(s)
Primary Attributes: 100BASE-T1
Embedded: Yes, MCU
Description: TJA1103 SABRE DEV BOARD
Packaging: Box
Function: Ethernet PHY
Type: Interface
Utilized IC / Part: TJA1103
Supplied Contents: Board(s)
Primary Attributes: 100BASE-T1
Embedded: Yes, MCU
на замовлення 2 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
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1+ | 14070.91 грн |
MC56F81866AMLFA |
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Виробник: NXP USA Inc.
Description: IC
Packaging: Bulk
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Interface: DMA, I2C, LINbus, SCI, QSPI
Type: Digital Signal Controllers
Operating Temperature: -40°C ~ 125°C (TA)
Non-Volatile Memory: FLASH (128kB)
On-Chip RAM: 20kB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 100MHz
Supplier Device Package: 48-LQFP (7x7)
Description: IC
Packaging: Bulk
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Interface: DMA, I2C, LINbus, SCI, QSPI
Type: Digital Signal Controllers
Operating Temperature: -40°C ~ 125°C (TA)
Non-Volatile Memory: FLASH (128kB)
On-Chip RAM: 20kB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 100MHz
Supplier Device Package: 48-LQFP (7x7)
товар відсутній
LPC1113FBD48/303,1 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 24KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 24KB (24K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 42
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 24KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 24KB (24K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 42
DigiKey Programmable: Not Verified
на замовлення 250 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 314.77 грн |
10+ | 236.56 грн |
80+ | 193.83 грн |
LPC1113FHN33/202,5 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 24KB FLASH 32HVQFN
Packaging: Bulk
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 24KB (24K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 24KB FLASH 32HVQFN
Packaging: Bulk
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 24KB (24K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
на замовлення 1040 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
129+ | 165.86 грн |
LPC1113FHN33/203,5 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 24KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 24KB (24K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 24KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 24KB (24K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
товар відсутній
LPC1113JHN33/203E |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 24KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 24KB (24K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 24KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 24KB (24K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
товар відсутній
PM823HN/A0CHP |
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Виробник: NXP USA Inc.
Description: POWER MANAGEMENT IC, DUAL SYNCHR
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Frequency - Switching: 3MHz
Topology: Step-Down (Buck) Synchronous (2), Linear (LDO) (1)
Supplier Device Package: 24-HVQFN (4x4)
Voltage/Current - Output 1: 1.1V, 1.5A
Voltage/Current - Output 2: 2.2V, 1.5A
Voltage/Current - Output 3: 1.8V, 525mA
w/LED Driver: No
w/Supervisor: No
w/Sequencer: No
Number of Outputs: 3
Description: POWER MANAGEMENT IC, DUAL SYNCHR
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Frequency - Switching: 3MHz
Topology: Step-Down (Buck) Synchronous (2), Linear (LDO) (1)
Supplier Device Package: 24-HVQFN (4x4)
Voltage/Current - Output 1: 1.1V, 1.5A
Voltage/Current - Output 2: 2.2V, 1.5A
Voltage/Current - Output 3: 1.8V, 525mA
w/LED Driver: No
w/Supervisor: No
w/Sequencer: No
Number of Outputs: 3
товар відсутній
FB32K146HAT0VLLR |
товар відсутній
PCF85063AT/AY |
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Виробник: NXP USA Inc.
Description: IC RTC CLOCK/CALENDAR I2C 8SO
Packaging: Tape & Reel (TR)
Features: Alarm, Leap Year, Square Wave Output
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Interface: I2C, 2-Wire Serial
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 0.9V ~ 5.5V
Time Format: HH:MM:SS (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 8-SO
Current - Timekeeping (Max): 0.6µA @ 3.3V
DigiKey Programmable: Not Verified
Description: IC RTC CLOCK/CALENDAR I2C 8SO
Packaging: Tape & Reel (TR)
Features: Alarm, Leap Year, Square Wave Output
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Interface: I2C, 2-Wire Serial
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 0.9V ~ 5.5V
Time Format: HH:MM:SS (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 8-SO
Current - Timekeeping (Max): 0.6µA @ 3.3V
DigiKey Programmable: Not Verified
на замовлення 76834 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
2500+ | 29.96 грн |
5000+ | 27.41 грн |
12500+ | 26.38 грн |
25000+ | 23.98 грн |
PCF85063AT/AY |
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Виробник: NXP USA Inc.
Description: IC RTC CLOCK/CALENDAR I2C 8SO
Packaging: Cut Tape (CT)
Features: Alarm, Leap Year, Square Wave Output
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Interface: I2C, 2-Wire Serial
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 0.9V ~ 5.5V
Time Format: HH:MM:SS (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 8-SO
Current - Timekeeping (Max): 0.6µA @ 3.3V
DigiKey Programmable: Not Verified
Description: IC RTC CLOCK/CALENDAR I2C 8SO
Packaging: Cut Tape (CT)
Features: Alarm, Leap Year, Square Wave Output
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Interface: I2C, 2-Wire Serial
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 0.9V ~ 5.5V
Time Format: HH:MM:SS (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 8-SO
Current - Timekeeping (Max): 0.6µA @ 3.3V
DigiKey Programmable: Not Verified
на замовлення 76834 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
5+ | 70.71 грн |
10+ | 60.77 грн |
25+ | 57.72 грн |
100+ | 44.48 грн |
250+ | 41.58 грн |
500+ | 36.74 грн |
1000+ | 28.53 грн |
PSMN8R5-100ESQ |
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Виробник: NXP USA Inc.
Description: POWER FIELD-EFFECT TRANSISTOR, 1
Packaging: Bulk
Package / Case: TO-262-3 Long Leads, I2PAK, TO-262AA
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 100A (Tj)
Rds On (Max) @ Id, Vgs: 8.5mOhm @ 25A, 10V
Power Dissipation (Max): 263W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: I2PAK
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 100 V
Gate Charge (Qg) (Max) @ Vgs: 111 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 5512 pF @ 50 V
Description: POWER FIELD-EFFECT TRANSISTOR, 1
Packaging: Bulk
Package / Case: TO-262-3 Long Leads, I2PAK, TO-262AA
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 100A (Tj)
Rds On (Max) @ Id, Vgs: 8.5mOhm @ 25A, 10V
Power Dissipation (Max): 263W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: I2PAK
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 100 V
Gate Charge (Qg) (Max) @ Vgs: 111 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 5512 pF @ 50 V
на замовлення 1274 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
486+ | 43.53 грн |
MC9S08DZ32AMLF |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
товар відсутній
MC9S08DZ32ACLH |
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S08
Data Converters: A/D 24x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 53
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S08
Data Converters: A/D 24x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 53
DigiKey Programmable: Not Verified
товар відсутній
MC908AZ32AVFUE |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HC08
Data Converters: A/D 15x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 40
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 32KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HC08
Data Converters: A/D 15x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 40
DigiKey Programmable: Not Verified
товар відсутній
74HC151DB,118 |
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Виробник: NXP USA Inc.
Description: MULTIPLEXER, HC/UH SERIES, 1-FUN
Packaging: Bulk
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 8:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SSOP
Description: MULTIPLEXER, HC/UH SERIES, 1-FUN
Packaging: Bulk
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 8:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SSOP
на замовлення 3696 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1051+ | 20.28 грн |
74HC151DB,112 |
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Виробник: NXP USA Inc.
Description: IC 8-INPUT MUX 16-SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 8:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SSOP
Description: IC 8-INPUT MUX 16-SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 8:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SSOP
на замовлення 2751 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
912+ | 23.08 грн |
NTB0102JKZ |
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Виробник: NXP USA Inc.
Description: IC TRANSLTR BIDIRECTIONAL 8XSON
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN
Output Type: Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 8-X2SON (1.35x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Number of Circuits: 1
Description: IC TRANSLTR BIDIRECTIONAL 8XSON
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN
Output Type: Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 8-X2SON (1.35x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Number of Circuits: 1
на замовлення 6000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
6000+ | 17.7 грн |
SPC5644BF0MLU1R |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 147
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 147
DigiKey Programmable: Not Verified
товар відсутній
SPC5644BCF0VLU8R |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 147
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 147
DigiKey Programmable: Not Verified
товар відсутній
SPC5644BF0MLU1 |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 147
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 147
DigiKey Programmable: Not Verified
товар відсутній
SPC5644BCF0VLU8 |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 147
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 147
DigiKey Programmable: Not Verified
товар відсутній
SPC5644BK0VLU1 |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 147
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 147
DigiKey Programmable: Not Verified
товар відсутній
BUK9520-55A,127 |
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Виробник: NXP USA Inc.
Description: MOSFET N-CH 55V 54A TO220AB
Packaging: Bulk
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 54A (Tc)
Rds On (Max) @ Id, Vgs: 18mOhm @ 25A, 10V
Power Dissipation (Max): 118W (Tc)
Vgs(th) (Max) @ Id: 2V @ 1mA
Supplier Device Package: TO-220AB
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±10V
Drain to Source Voltage (Vdss): 55 V
Input Capacitance (Ciss) (Max) @ Vds: 2210 pF @ 25 V
Description: MOSFET N-CH 55V 54A TO220AB
Packaging: Bulk
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 54A (Tc)
Rds On (Max) @ Id, Vgs: 18mOhm @ 25A, 10V
Power Dissipation (Max): 118W (Tc)
Vgs(th) (Max) @ Id: 2V @ 1mA
Supplier Device Package: TO-220AB
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±10V
Drain to Source Voltage (Vdss): 55 V
Input Capacitance (Ciss) (Max) @ Vds: 2210 pF @ 25 V
на замовлення 1364 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
666+ | 31.59 грн |
BUK9520-100B,127 |
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на замовлення 8479 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
567+ | 37.21 грн |
BUK9520-100A,127 |
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на замовлення 2996 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
494+ | 42.83 грн |
PBLS2001D,115 |
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на замовлення 51400 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
4230+ | 4.9 грн |
MC33FS8530A4KSR2 |
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Виробник: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
товар відсутній
MC33FS8530A4KS |
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Виробник: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
товар відсутній
S9KEAZN8ACTGR |
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Виробник: NXP USA Inc.
Description: KINETIS E 32-BIT MCU, ARM CORTEX
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Number of I/O: 14
Description: KINETIS E 32-BIT MCU, ARM CORTEX
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Number of I/O: 14
товар відсутній
SPC5745CBK1AMMJ6 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLSH 256MAPPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z2, e200z4
Data Converters: A/D 36x10b, 16x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, I2S, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Number of I/O: 178
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 2MB FLSH 256MAPPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z2, e200z4
Data Converters: A/D 36x10b, 16x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, I2S, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Number of I/O: 178
DigiKey Programmable: Not Verified
товар відсутній
MC56F80738VLH |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 48KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: 56800EF
Data Converters: A/D 14x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: Brown-out Detect/Reset, DMA, LVI, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 48KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: 56800EF
Data Converters: A/D 14x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: Brown-out Detect/Reset, DMA, LVI, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
товар відсутній
PEMI6QFN/HE,132 |
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Виробник: NXP USA Inc.
Description: FILTER RC(PI) 45 OHM/8.5PF SMD
Packaging: Bulk
Package / Case: 12-XFDFN
Size / Dimension: 0.098" L x 0.047" W (2.50mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 45Ohms, C = 8.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 9dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 45
ESD Protection: Yes
Number of Channels: 6
Description: FILTER RC(PI) 45 OHM/8.5PF SMD
Packaging: Bulk
Package / Case: 12-XFDFN
Size / Dimension: 0.098" L x 0.047" W (2.50mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 45Ohms, C = 8.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 9dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 45
ESD Protection: Yes
Number of Channels: 6
на замовлення 16000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1902+ | 11.19 грн |
TDA8766G/C1,118 |
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Виробник: NXP USA Inc.
Description: IC ADC 10BIT SIGMA-DELTA 32LQFP
Packaging: Bulk
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Number of Bits: 10
Configuration: ADC
Data Interface: Parallel
Reference Type: External
Operating Temperature: 20°C ~ 75°C
Voltage - Supply, Analog: 3V ~ 5.25V
Voltage - Supply, Digital: 3V ~ 5.25V
Sampling Rate (Per Second): 20M
Input Type: Single Ended
Number of Inputs: 1
Supplier Device Package: 32-LQFP (5x5)
Architecture: Sigma-Delta
Number of A/D Converters: 1
Description: IC ADC 10BIT SIGMA-DELTA 32LQFP
Packaging: Bulk
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Number of Bits: 10
Configuration: ADC
Data Interface: Parallel
Reference Type: External
Operating Temperature: 20°C ~ 75°C
Voltage - Supply, Analog: 3V ~ 5.25V
Voltage - Supply, Digital: 3V ~ 5.25V
Sampling Rate (Per Second): 20M
Input Type: Single Ended
Number of Inputs: 1
Supplier Device Package: 32-LQFP (5x5)
Architecture: Sigma-Delta
Number of A/D Converters: 1
на замовлення 2000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
20+ | 1102.48 грн |
S912XD256F1CAAR |
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b, 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 256KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b, 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
товар відсутній
XC7SH32GV,125 |
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на замовлення 120000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1679+ | 12.64 грн |
XC7SET14GV,125 |
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на замовлення 76262 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1679+ | 12.64 грн |
XC7SH125GM,115 |
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на замовлення 167064 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1397+ | 14.74 грн |
PBSS5350SS,115 |
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на замовлення 1790 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1790+ | 11.89 грн |
MC32PF1550A5EPR2 |
Виробник: NXP USA Inc.
Description: PF1550
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Description: PF1550
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
товар відсутній
MC32PF1550A7EPR2 |
Виробник: NXP USA Inc.
Description: PF1550
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Description: PF1550
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
товар відсутній
MC32PF1550A6EP |
Виробник: NXP USA Inc.
Description: PF1550
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Description: PF1550
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
товар відсутній
74LVC157ADB,112 |
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на замовлення 4591 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1967+ | 10.53 грн |
NAFE11388B40BSMP |
Виробник: NXP USA Inc.
Description: IC 8-IN LOW-POWER 25V AFE
Packaging: Tape & Reel (TR)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Number of Bits: 24
Voltage - Supply, Analog: 2.97V ~ 3.6V
Voltage - Supply, Digital: 2.97V ~ 3.6V
Supplier Device Package: 64-HVQFN (9x9)
Number of Channels: 8
Power (Watts): 125 mW
Description: IC 8-IN LOW-POWER 25V AFE
Packaging: Tape & Reel (TR)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Number of Bits: 24
Voltage - Supply, Analog: 2.97V ~ 3.6V
Voltage - Supply, Digital: 2.97V ~ 3.6V
Supplier Device Package: 64-HVQFN (9x9)
Number of Channels: 8
Power (Watts): 125 mW
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1000+ | 881.04 грн |
NAFE11388B40BSMP |
Виробник: NXP USA Inc.
Description: IC 8-IN LOW-POWER 25V AFE
Packaging: Cut Tape (CT)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Number of Bits: 24
Voltage - Supply, Analog: 2.97V ~ 3.6V
Voltage - Supply, Digital: 2.97V ~ 3.6V
Supplier Device Package: 64-HVQFN (9x9)
Number of Channels: 8
Power (Watts): 125 mW
Description: IC 8-IN LOW-POWER 25V AFE
Packaging: Cut Tape (CT)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Number of Bits: 24
Voltage - Supply, Analog: 2.97V ~ 3.6V
Voltage - Supply, Digital: 2.97V ~ 3.6V
Supplier Device Package: 64-HVQFN (9x9)
Number of Channels: 8
Power (Watts): 125 mW
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 1391.35 грн |
10+ | 1231.17 грн |
25+ | 1180.13 грн |
100+ | 975.8 грн |
250+ | 927.91 грн |
500+ | 868.04 грн |
NAFE11388B40BSE |
Виробник: NXP USA Inc.
Description: IC 8-IN LOW-POWER 25V AFE
Packaging: Tray
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Number of Bits: 24
Voltage - Supply, Analog: 2.97V ~ 3.6V
Voltage - Supply, Digital: 2.97V ~ 3.6V
Supplier Device Package: 64-HVQFN (9x9)
Number of Channels: 8
Power (Watts): 125 mW
Description: IC 8-IN LOW-POWER 25V AFE
Packaging: Tray
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Number of Bits: 24
Voltage - Supply, Analog: 2.97V ~ 3.6V
Voltage - Supply, Digital: 2.97V ~ 3.6V
Supplier Device Package: 64-HVQFN (9x9)
Number of Channels: 8
Power (Watts): 125 mW
на замовлення 260 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 1391.35 грн |
10+ | 1231.17 грн |
25+ | 1180.13 грн |
80+ | 975.79 грн |
260+ | 927.9 грн |
S912XDP512J1CAGR |
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b, 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 119
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 512KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b, 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 119
DigiKey Programmable: Not Verified
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
500+ | 1914.53 грн |
SAF775DHV/N208W/GY |
товар відсутній
SAF775DHV/N208W/EY |
товар відсутній
SAF775CHV/N208W/KY |
товар відсутній
SAF775CHV/N208W/KK |
товар відсутній
SAF775CHV/N208W/AY |
товар відсутній