Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (35275) > Сторінка 502 з 588
| Фото | Назва | Виробник | Інформація |
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| EV-INVERTERHD | NXP USA Inc. |
 Description: EV-INVERTERHDPackaging: Bulk Function: Gate Driver Type: Power Management Utilized IC / Part: FS6500, GD3160, MPC5775E, TJA1051, TJA1100HN Supplied Contents: Board(s) Primary Attributes: Motors (DC) Embedded: Yes, MCU Part Status: Active |
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MPC8321ECVRADDCA | NXP USA Inc. |
Description: IC MPU MPC83XX 266MHZ PBGA516 Packaging: Tray Package / Case: 516-BBGA Mounting Type: Surface Mount Speed: 266MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e300c2 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 516-PBGA (27x27) Ethernet: 10/100Mbps (3) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 2.2 RAM Controllers: DDR, DDR2 Graphics Acceleration: No Security Features: Cryptography Part Status: Active |
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JN5161/001,515 | NXP USA Inc. |
Description: IC RF TXRX+MCU 802.15.4 40HVQFN Packaging: Tape & Reel (TR) Package / Case: 40-VFQFN Exposed Pad Sensitivity: -96dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 64kB Flash, 4kB EEPROM, 8kB RAM Type: TxRx + MCU Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 3.6V Power - Output: 2.5dBm Protocol: ZigbeePRO® Current - Receiving: 17mA Data Rate (Max): 1Mbps Current - Transmitting: 15.3mA Supplier Device Package: 40-HVQFN (6x6) GPIO: 20 Modulation: O-QPSK RF Family/Standard: 802.15.4 Serial Interfaces: I2C, JTAG, SPI, UART Part Status: Active DigiKey Programmable: Not Verified |
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JN5161/001,515 | NXP USA Inc. |
Description: IC RF TXRX+MCU 802.15.4 40HVQFN Packaging: Cut Tape (CT) Package / Case: 40-VFQFN Exposed Pad Sensitivity: -96dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 64kB Flash, 4kB EEPROM, 8kB RAM Type: TxRx + MCU Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 3.6V Power - Output: 2.5dBm Protocol: ZigbeePRO® Current - Receiving: 17mA Data Rate (Max): 1Mbps Current - Transmitting: 15.3mA Supplier Device Package: 40-HVQFN (6x6) GPIO: 20 Modulation: O-QPSK RF Family/Standard: 802.15.4 Serial Interfaces: I2C, JTAG, SPI, UART Part Status: Active DigiKey Programmable: Not Verified |
на замовлення 784 шт: термін постачання 21-31 дні (днів) |
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MPC561CZP40 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 388PBGA Packaging: Bulk Package / Case: 388-BBGA Mounting Type: Surface Mount Speed: 40MHz RAM Size: 32K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: ROMless Core Processor: PowerPC Data Converters: A/D 32x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 388-PBGA (27x27) Part Status: Not For New Designs Number of I/O: 64 DigiKey Programmable: Not Verified |
на замовлення 51 шт: термін постачання 21-31 дні (днів) |
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| MF3D2301DUD/00Z | NXP USA Inc. |
Description: MF3D2301DUD Packaging: Tray Package / Case: Die Mounting Type: Surface Mount Frequency: 13.56MHz Type: RFID Reader Operating Temperature: -25°C ~ 85°C Standards: ISO 14443A Supplier Device Package: Wafer Part Status: Active |
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| ASL5008FHNZ | NXP USA Inc. |
Description: IC LED DRVR CTRLR PWM 36HVQFN Packaging: Tape & Reel (TR) Package / Case: 36-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Number of Outputs: 12 Frequency: 200MHz Type: DC DC Controller Operating Temperature: -40°C ~ 125°C (TA) Applications: Automotive Current - Output / Channel: 800mA Internal Switch(s): Yes Topology: Switched Capacitor (Charge Pump) Supplier Device Package: 36-HVQFN (6x6) Dimming: PWM Voltage - Supply (Min): 4.5V Voltage - Supply (Max): 5.5V Part Status: Active |
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74AUP3G04GM,125 | NXP USA Inc. |
Description: IC INVERTER 3CH 3-INP 8XQFN Packaging: Bulk Package / Case: 8-XFQFN Exposed Pad Mounting Type: Surface Mount Logic Type: Inverter Operating Temperature: -40°C ~ 125°C Voltage - Supply: 0.8V ~ 3.6V Current - Output High, Low: 4mA, 4mA Number of Inputs: 3 Supplier Device Package: 8-XQFN (1.6x1.6) Input Logic Level - High: 1.6V ~ 2V Input Logic Level - Low: 0.7V ~ 0.9V Max Propagation Delay @ V, Max CL: 5.4ns @ 3.3V, 30pF Part Status: Active Number of Circuits: 3 Current - Quiescent (Max): 500 nA |
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74LVC2G240GM,125 | NXP USA Inc. |
Description: IC BUFFER INVERT 5.5V 8XQFN Packaging: Bulk Package / Case: 8-XFQFN Exposed Pad Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 2 Logic Type: Buffer, Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1.65V ~ 5.5V Number of Bits per Element: 1 Current - Output High, Low: 32mA, 32mA Supplier Device Package: 8-XQFN (1.6x1.6) Part Status: Active |
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74LVCH2T45GM125 | NXP USA Inc. |
Description: NOW NEXPERIA 74LVCH2T45GM - BUS Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
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| NX3L2G384GM125 | NXP USA Inc. |
Description: IC ANALOG SWITCH SPST Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
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NCX2222GM125 | NXP USA Inc. |
Description: DUAL COMPARATOR Packaging: Bulk Part Status: Active |
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74AXP2G14GM125 | NXP USA Inc. |
Description: INVERTER, AXP SERIES Packaging: Bulk Part Status: Active |
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74AUP2G08GM,125 | NXP USA Inc. |
Description: IC GATE AND 2CH 2-INP 8-XQFN Packaging: Bulk Package / Case: 8-XFQFN Exposed Pad Mounting Type: Surface Mount Logic Type: AND Gate Operating Temperature: -40°C ~ 125°C Voltage - Supply: 0.8V ~ 3.6V Current - Output High, Low: 4mA, 4mA Number of Inputs: 2 Supplier Device Package: 8-XQFN (1.6x1.6) Input Logic Level - High: 1.6V ~ 2V Input Logic Level - Low: 0.7V ~ 0.9V Max Propagation Delay @ V, Max CL: 6.2ns @ 3.3V, 30pF Part Status: Active Number of Circuits: 2 Current - Quiescent (Max): 500 nA |
на замовлення 8053 шт: термін постачання 21-31 дні (днів) |
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74AUP2G00GM,125 | NXP USA Inc. |
Description: IC GATE NAND 2CH 2-INP 8-XQFN Packaging: Bulk Package / Case: 8-XFQFN Exposed Pad Mounting Type: Surface Mount Logic Type: NAND Gate Operating Temperature: -40°C ~ 125°C Voltage - Supply: 0.8V ~ 3.6V Current - Output High, Low: 4mA, 4mA Number of Inputs: 2 Supplier Device Package: 8-XQFN (1.6x1.6) Input Logic Level - High: 1.6V ~ 2V Input Logic Level - Low: 0.7V ~ 0.9V Max Propagation Delay @ V, Max CL: 6.5ns @ 3.3V, 30pF Part Status: Active Number of Circuits: 2 Current - Quiescent (Max): 500 nA |
на замовлення 3773 шт: термін постачання 21-31 дні (днів) |
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SPC5645CF0VLT1 | NXP USA Inc. |
Description: IC MCU 32BIT 2MB FLASH 208TQFP Packaging: Tray Package / Case: 208-LQFP Mounting Type: Surface Mount Speed: 80MHz/120MHz Program Memory Size: 2MB (2M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z4d, e200z0h Data Converters: A/D 33x10b, 10x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 208-TQFP (28x28) Part Status: Active Number of I/O: 177 DigiKey Programmable: Not Verified |
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SPC5644BK0MLU1 | NXP USA Inc. |
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP Packaging: Tray Package / Case: 176-LQFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 1.5MB (1.5M x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z4d Data Converters: A/D 27x10b, 5x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 176-LQFP (24x24) Part Status: Active Number of I/O: 147 DigiKey Programmable: Not Verified |
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S9S12ZVL32F0MLCR | NXP USA Inc. |
Description: IC MCU 16BIT 32KB FLASH 32LQFP Packaging: Tape & Reel (TR) Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 32KB (32K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 128 x 8 Core Processor: S12Z Data Converters: A/D 6x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 32-LQFP (7x7) Part Status: Active Number of I/O: 19 DigiKey Programmable: Not Verified |
на замовлення 2000 шт: термін постачання 21-31 дні (днів) |
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S9S12ZVL32F0MLCR | NXP USA Inc. |
Description: IC MCU 16BIT 32KB FLASH 32LQFP Packaging: Cut Tape (CT) Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 32KB (32K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 128 x 8 Core Processor: S12Z Data Converters: A/D 6x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 32-LQFP (7x7) Part Status: Active Number of I/O: 19 DigiKey Programmable: Not Verified |
на замовлення 2000 шт: термін постачання 21-31 дні (днів) |
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S9KEAZN32AMLCR | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 32LQFP Packaging: Tape & Reel (TR) Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 32KB (32K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 256 x 8 Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, LINbus, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 32-LQFP (7x7) Part Status: Active Number of I/O: 28 DigiKey Programmable: Not Verified |
на замовлення 2000 шт: термін постачання 21-31 дні (днів) |
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S9KEAZN32AMLCR | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 32LQFP Packaging: Cut Tape (CT) Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 32KB (32K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 256 x 8 Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, LINbus, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 32-LQFP (7x7) Part Status: Active Number of I/O: 28 DigiKey Programmable: Not Verified |
на замовлення 2000 шт: термін постачання 21-31 дні (днів) |
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| S9S12GN48J1VLCR | NXP USA Inc. |
Description: IC MCU 16BIT 48KB FLASH 32LQFP Packaging: Tape & Reel (TR) Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 48KB (48K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 1.5K x 8 Core Processor: S12 Data Converters: A/D 12x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Connectivity: IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 32-LQFP (7x7) Part Status: Active Number of I/O: 26 |
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TEA2016DB1519 | NXP USA Inc. |
Description: TEA2016 240W DEMO BOARD Packaging: Box Voltage - Output: 12V Current - Output: 20A Regulator Topology: Flyback Board Type: Fully Populated Utilized IC / Part: TEA1995T, TEA2016AAT Supplied Contents: Board(s) Main Purpose: AC/DC, Primary and Secondary Side with PFC Outputs and Type: 1, Non-Isolated Part Status: Active Power - Output: 240 W |
на замовлення 7 шт: термін постачання 21-31 дні (днів) |
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| TEA2016AAT/1/S30Y | NXP USA Inc. |
Description: DCM/QR PFC + RESONANT POWER SUPP Packaging: Cut Tape (CT) Package / Case: 16-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 0.5V ~ 2.65V, 2.35V ~ 4.5V Applications: Digital Power Controller Supplier Device Package: 16-SO Part Status: Active Current - Supply: 4.8 mA |
на замовлення 2314 шт: термін постачання 21-31 дні (днів) |
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TEA2095T/1J | NXP USA Inc. |
Description: DUAL SYNCHRONOUS RECTIFICATION C Packaging: Cut Tape (CT) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TJ) Voltage - Supply: 4.75V ~ 38V Applications: Secondary-Side Controller, Synchronous Rectifier Supplier Device Package: 8-SO Part Status: Active Current - Supply: 90 µA |
на замовлення 2480 шт: термін постачання 21-31 дні (днів) |
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TEA2017DB1580 | NXP USA Inc. |
Description: TEA2017 240W DEMO BOARD Packaging: Bulk Function: Power Factor Correction Type: Power Management Utilized IC / Part: TEA2017 Supplied Contents: Board(s) Primary Attributes: 90 ~ 264VAC Input Voltage Embedded: No Part Status: Active |
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RDK01DB1563 | NXP USA Inc. |
Description: TEA2016 USB-I2C INTERFACE Packaging: Bulk For Use With/Related Products: TEA2016 Type: Programmer Contents: Board(s), Cable(s) Part Status: Active |
на замовлення 9 шт: термін постачання 21-31 дні (днів) |
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BUK764R0-75C,118 | NXP USA Inc. |
Description: PFET, 100A I(D), 75V, 0.004OHM, Packaging: Bulk Package / Case: TO-263-3, D²Pak (2 Leads + Tab), TO-263AB Mounting Type: Surface Mount Operating Temperature: -55°C ~ 175°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 100A (Tc) Rds On (Max) @ Id, Vgs: 4mOhm @ 25A, 10V Power Dissipation (Max): 333W (Tc) Vgs(th) (Max) @ Id: 4V @ 1mA Supplier Device Package: D2PAK Part Status: Active Drive Voltage (Max Rds On, Min Rds On): 10V Vgs (Max): ±20V Drain to Source Voltage (Vdss): 75 V Gate Charge (Qg) (Max) @ Vgs: 142 nC @ 10 V Input Capacitance (Ciss) (Max) @ Vds: 11659 pF @ 25 V |
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| MRF6VP121KHR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS 50V NI1230 Packaging: Tape & Reel (TR) Package / Case: NI-1230 Frequency: 1.03GHz Configuration: Dual Power - Output: 1000W Gain: 20dB Technology: LDMOS Supplier Device Package: NI-1230 Part Status: Not For New Designs Voltage - Rated: 110 V Voltage - Test: 50 V Current - Test: 150 mA |
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| 74HCT377D118 | NXP USA Inc. |
Description: IC FF D-TYPE SNGL 8BIT 20SO Packaging: Bulk Package / Case: 20-SOIC (0.295", 7.50mm Width) Output Type: Non-Inverted Mounting Type: Surface Mount Number of Elements: 1 Function: Standard Type: D-Type Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 4.5V ~ 5.5V Current - Quiescent (Iq): 8 µA Current - Output High, Low: 4mA, 5.2mA Trigger Type: Positive Edge Clock Frequency: 53 MHz Input Capacitance: 3.5 pF Supplier Device Package: 20-SO Max Propagation Delay @ V, Max CL: 32ns @ 4.5V, 50pF Part Status: Active Number of Bits per Element: 8 |
на замовлення 1500 шт: термін постачання 21-31 дні (днів) |
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PJF7992ATW/C1C/DJ | NXP USA Inc. |
Description: IMMOBIL BASESTATION IC 20HTSSOP Packaging: Cut Tape (CT) Mounting Type: Surface Mount Part Status: Obsolete |
на замовлення 940 шт: термін постачання 21-31 дні (днів) |
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| MIMX8SL1AVNFZAB | NXP USA Inc. |
Description: I.MX8 DXL 15SQ Packaging: Tray Package / Case: 388-LFBGA Mounting Type: Surface Mount Speed: 1.2GHz Operating Temperature: -40°C ~ 125°C (TJ) Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 388-LBGA (15x15) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 64-Bit Co-Processors/DSP: ARM® Cortex®-M4F RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: No Display & Interface Controllers: LCD Part Status: Active Core Processor: ARM® Cortex®-A35 Ethernet: 1Gbps (2) Security Features: AES, Boot Security, Crypto Accelerator, Secure Debug, Secure JTAG, TRNG Additional Interfaces: CANbus, DMA, GPIO, I2C, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART |
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| MIMX8DL1CVNFZAB | NXP USA Inc. |
Description: I.MX 8DUALXLITE 15SQ Packaging: Tray Package / Case: 388-LFBGA Mounting Type: Surface Mount Speed: 1.2GHz Operating Temperature: -40°C ~ 105°C (TJ) Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 388-LBGA (15x15) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 2 Core, 64-Bit Co-Processors/DSP: ARM® Cortex®-M4F RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: No Display & Interface Controllers: LCD Part Status: Active Core Processor: ARM® Cortex®-A35 Ethernet: 1Gbps (2) Security Features: AES, Boot Security, Crypto Accelerator, Secure Debug, Secure JTAG, TRNG |
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| MIMX8SL1CVNFZAB | NXP USA Inc. |
Description: I.MX 8DUALXLITE 15SQ Packaging: Tray Package / Case: 388-LFBGA Mounting Type: Surface Mount Speed: 1.2GHz Operating Temperature: -40°C ~ 105°C (TJ) Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 388-LBGA (15x15) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 64-Bit Co-Processors/DSP: ARM® Cortex®-M4F RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: No Display & Interface Controllers: LCD Part Status: Active Core Processor: ARM® Cortex®-A35 Ethernet: 1Gbps (2) Security Features: AES, Boot Security, Crypto Accelerator, Secure Debug, Secure JTAG, TRNG |
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| MIMX8DL1AVNFZABR | NXP USA Inc. |
Description: I.MX8 DXL 15SQ Packaging: Tape & Reel (TR) Package / Case: 388-LFBGA Mounting Type: Surface Mount Supplier Device Package: 388-LBGA (15x15) Part Status: Active |
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| MIMX8DL1AVNFZAB | NXP USA Inc. |
Description: I.MX8 DXL 15SQ Packaging: Tray Package / Case: 388-LFBGA Mounting Type: Surface Mount Supplier Device Package: 388-LBGA (15x15) Part Status: Active |
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MC9S08AW48CFGER | NXP USA Inc. |
Description: IC MCU 8BIT 48KB FLASH 44LQFP Packaging: Tape & Reel (TR) Package / Case: 44-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 48KB (48K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 44-LQFP (10x10) Part Status: Active Number of I/O: 34 DigiKey Programmable: Not Verified |
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MC9S08AW48CFGE | NXP USA Inc. |
Description: IC MCU 8BIT 48KB FLASH 44LQFP Packaging: Tray Package / Case: 44-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 48KB (48K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I²C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 44-LQFP (10x10) Part Status: Active Number of I/O: 34 DigiKey Programmable: Not Verified |
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MC9S08AW48CPUE | NXP USA Inc. |
Description: IC MCU 8BIT 48KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 48KB (48K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 16x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I²C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 54 DigiKey Programmable: Not Verified |
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P3041NSN7MMC | NXP USA Inc. |
Description: IC MPU QORIQ P3 1.2GHZ 1295BGA Packaging: Tray Package / Case: 1295-BBGA, FCBGA Mounting Type: Surface Mount Speed: 1.2GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e500mc Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V Supplier Device Package: 1295-FCPBGA (37.5x37.5) Ethernet: 10/100/1000Mbps (5), 10Gbps (1) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 4 Core, 32-Bit RAM Controllers: DDR3, DDR3L Graphics Acceleration: No SATA: SATA 3Gbps (2) Part Status: Obsolete Additional Interfaces: DUART, I2C, MMC/SD, RapidIO, SPI |
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| S9S12G48J1VLCR | NXP USA Inc. |
Description: IC MCU 16BIT 48KB FLASH 32LQFP Packaging: Tape & Reel (TR) Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 48KB (48K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 1.5K x 8 Core Processor: S12 Data Converters: A/D 12x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 32-LQFP (7x7) Part Status: Active Number of I/O: 26 |
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| JN5148/Z01515 | NXP USA Inc. |
Description: IC RF TXRX+MCU 802.15.4 56-VFQFN Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
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JN5142N/001,515 | NXP USA Inc. |
Description: IC RF TXRX+MCU 802.15.4 40HVQFN Packaging: Cut Tape (CT) Package / Case: 40-VFQFN Exposed Pad Sensitivity: -95dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 128kB ROM, 32kB RAM Type: TxRx + MCU Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 3.6V Power - Output: 2.5dBm Protocol: Zigbee® Current - Receiving: 16.5mA Current - Transmitting: 15mA Supplier Device Package: 40-HVQFN (6x6) RF Family/Standard: 802.15.4 Part Status: Obsolete DigiKey Programmable: Not Verified |
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74LVC240APW/AU118 | NXP USA Inc. |
Description: BUS DRIVER, LVC/LCX/Z SERIES Packaging: Bulk Part Status: Active |
на замовлення 37195 шт: термін постачання 21-31 дні (днів) |
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74LVC240ADB,118 | NXP USA Inc. |
Description: IC INVERTER DUAL 4-INPUT 20SSOP Packaging: Bulk Part Status: Active |
на замовлення 15948 шт: термін постачання 21-31 дні (днів) |
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| P2010NXN2KFC | NXP USA Inc. |
Description: IC MPU QORIQ P2 1.2GHZ PBGA689 Packaging: Bulk Package / Case: 689-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 1.2GHz Operating Temperature: -40°C ~ 125°C (TA) Core Processor: PowerPC e500v2 Supplier Device Package: 689-TEPBGA II (31x31) Ethernet: 10/100/1000Mbps (3) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Part Status: Active |
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| P2010NSE2HFC | NXP USA Inc. |
Description: IC MPU QORIQ P2 1.2GHZ PBGA689 Packaging: Bulk Package / Case: 689-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 1.2GHz Operating Temperature: 0°C ~ 125°C (TA) Core Processor: PowerPC e500v2 Supplier Device Package: 689-TEPBGA II (31x31) Ethernet: 10/100/1000Mbps (3) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Security; SEC 3.3 RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Security Features: Cryptography, Random Number Generator Part Status: Active |
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P2010NXE2KFC | NXP USA Inc. |
Description: IC MPU QORIQ P2 1.2GHZ PBGA689 Packaging: Box Package / Case: 689-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 1.2GHz Operating Temperature: -40°C ~ 125°C (TA) Core Processor: PowerPC e500v2 Supplier Device Package: 689-TEPBGA II (31x31) Ethernet: 10/100/1000Mbps (3) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Security; SEC 3.3 RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Security Features: Cryptography, Random Number Generator Part Status: Obsolete |
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P2010NXN2KFC | NXP USA Inc. |
Description: IC MPU QORIQ P2 1.2GHZ PBGA689 Packaging: Tray Package / Case: 689-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 1.2GHz Operating Temperature: -40°C ~ 125°C (TA) Core Processor: PowerPC e500v2 Supplier Device Package: 689-TEPBGA II (31x31) Ethernet: 10/100/1000Mbps (3) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Part Status: Obsolete |
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MPXAZ4115A6T1 | NXP USA Inc. |
Description: SENSOR 16.68PSIA 4.8V Features: Temperature Compensated Packaging: Tape & Reel (TR) Package / Case: 8-SMD Module Output Type: Analog Voltage Mounting Type: Surface Mount Output: 0.2 V ~ 4.8 V Operating Pressure: 2.18PSI ~ 16.68PSI (15kPa ~ 115kPa) Pressure Type: Absolute Accuracy: ±1.5% Operating Temperature: -40°C ~ 125°C Termination Style: SMD (SMT) Tab Voltage - Supply: 4.85V ~ 5.35V Applications: Board Mount Port Style: No Port Maximum Pressure: 58.02PSI (400kPa) Part Status: Obsolete |
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MPXAZ4115A6T1 | NXP USA Inc. |
Description: SENSOR 16.68PSIA 4.8V Features: Temperature Compensated Packaging: Cut Tape (CT) Package / Case: 8-SMD Module Output Type: Analog Voltage Mounting Type: Surface Mount Output: 0.2 V ~ 4.8 V Operating Pressure: 2.18PSI ~ 16.68PSI (15kPa ~ 115kPa) Pressure Type: Absolute Accuracy: ±1.5% Operating Temperature: -40°C ~ 125°C Termination Style: SMD (SMT) Tab Voltage - Supply: 4.85V ~ 5.35V Applications: Board Mount Port Style: No Port Maximum Pressure: 58.02PSI (400kPa) Part Status: Obsolete |
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PCU9661B,118 | NXP USA Inc. |
Description: IC CONTROLLER 48LQFP Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Function: Controller Interface: I²C Operating Temperature: -40°C ~ 85°C Voltage - Supply: 3V ~ 3.6V Current - Supply: 15mA Protocol: I²C Standards: IEEE 1149.1 Supplier Device Package: 48-LQFP (7x7) Part Status: Obsolete DigiKey Programmable: Not Verified |
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PCU9661B,118 | NXP USA Inc. |
Description: IC CONTROLLER 48LQFP Packaging: Cut Tape (CT) Package / Case: 48-LQFP Function: Controller Interface: I²C Operating Temperature: -40°C ~ 85°C Voltage - Supply: 3V ~ 3.6V Current - Supply: 15mA Protocol: I²C Standards: IEEE 1149.1 Supplier Device Package: 48-LQFP (7x7) Part Status: Obsolete DigiKey Programmable: Not Verified |
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| PRF13750HR9697 | NXP USA Inc. |
Description: PRF13750HR - RF MOSFET LDMOS (DU Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
на замовлення 17 шт: термін постачання 21-31 дні (днів) |
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| MF3MOD4101DA4/05,1 | NXP USA Inc. |
Description: IC RFID TRANSP 13.56MHZ MOA4 Packaging: Tape & Reel (TR) Package / Case: MOA4, Smart Card Module Mounting Type: Surface Mount Frequency: 13.56MHz Interface: UART Type: RFID Transponder Operating Temperature: -25°C ~ 70°C Standards: ISO 14443, MIFARE Part Status: Active |
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| MF3MOD4101DA4/05,1 | NXP USA Inc. |
Description: IC RFID TRANSP 13.56MHZ MOA4 Packaging: Cut Tape (CT) Package / Case: MOA4, Smart Card Module Mounting Type: Surface Mount Frequency: 13.56MHz Interface: UART Type: RFID Transponder Operating Temperature: -25°C ~ 70°C Standards: ISO 14443, MIFARE Part Status: Active |
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MPC8569ECVJANKGB | NXP USA Inc. |
Description: IC MPU MPC85XX 800MHZ 783FCPBGA Packaging: Tray Package / Case: 783-BBGA, FCBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e500v2 Voltage - I/O: 1.0V, 1.5V, 1.8V, 2.5V, 3.3V Supplier Device Package: 783-FCPBGA (29x29) Ethernet: 10/100Mbps (8), 1Gbps (4) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine, Security; SEC RAM Controllers: DDR2, DDR3, SDRAM Graphics Acceleration: No Security Features: Cryptography, Random Number Generator Part Status: Obsolete |
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MKM14Z64CHH5 | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 44MAPLGA Packaging: Tray Package / Case: 44-VFLGA Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 64KB (64K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 5x16b, 4x24b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: DMA, WDT Supplier Device Package: 44-MAPLGA (5x5) Part Status: Not For New Designs Number of I/O: 20 DigiKey Programmable: Not Verified |
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| A5G35S004NT6 | NXP USA Inc. |
Description: AIRFAST RF POWER GAN TRANSISTOR, Packaging: Tape & Reel (TR) Package / Case: 6-LDFN Exposed Pad Mounting Type: Surface Mount Frequency: 3.3GHz ~ 4.3GHz Power - Output: 24.5dBm Gain: 16.9dB Supplier Device Package: 6-PDFN (4x4.5) Part Status: Active Voltage - Rated: 125 V Voltage - Test: 48 V Current - Test: 12 mA |
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| LPC55S69JBD64Y | NXP USA Inc. |
Description: IC MCU 32BIT 640KB FLASH 64HTQFP Packaging: Tape & Reel (TR) Package / Case: 64-TQFP Exposed Pad Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 640KB (640K x 8) RAM Size: 320K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 10x16b SAR Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Supplier Device Package: 64-HTQFP (10x10) Part Status: Active Number of I/O: 36 |
на замовлення 1500 шт: термін постачання 21-31 дні (днів) |
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| EV-INVERTERHD |
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Виробник: NXP USA Inc.
Description: EV-INVERTERHD
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Utilized IC / Part: FS6500, GD3160, MPC5775E, TJA1051, TJA1100HN
Supplied Contents: Board(s)
Primary Attributes: Motors (DC)
Embedded: Yes, MCU
Part Status: Active
Description: EV-INVERTERHD
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Utilized IC / Part: FS6500, GD3160, MPC5775E, TJA1051, TJA1100HN
Supplied Contents: Board(s)
Primary Attributes: Motors (DC)
Embedded: Yes, MCU
Part Status: Active
товар відсутній
| MPC8321ECVRADDCA |
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Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c2
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Part Status: Active
Description: IC MPU MPC83XX 266MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c2
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Part Status: Active
товар відсутній
| JN5161/001,515 |
|
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -96dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 64kB Flash, 4kB EEPROM, 8kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 3.6V
Power - Output: 2.5dBm
Protocol: ZigbeePRO®
Current - Receiving: 17mA
Data Rate (Max): 1Mbps
Current - Transmitting: 15.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 20
Modulation: O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, JTAG, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -96dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 64kB Flash, 4kB EEPROM, 8kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 3.6V
Power - Output: 2.5dBm
Protocol: ZigbeePRO®
Current - Receiving: 17mA
Data Rate (Max): 1Mbps
Current - Transmitting: 15.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 20
Modulation: O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, JTAG, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
товар відсутній
| JN5161/001,515 |
|
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -96dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 64kB Flash, 4kB EEPROM, 8kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 3.6V
Power - Output: 2.5dBm
Protocol: ZigbeePRO®
Current - Receiving: 17mA
Data Rate (Max): 1Mbps
Current - Transmitting: 15.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 20
Modulation: O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, JTAG, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -96dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 64kB Flash, 4kB EEPROM, 8kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 3.6V
Power - Output: 2.5dBm
Protocol: ZigbeePRO®
Current - Receiving: 17mA
Data Rate (Max): 1Mbps
Current - Transmitting: 15.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 20
Modulation: O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, JTAG, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 784 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 375.59 грн |
| 10+ | 323.17 грн |
| 25+ | 290.87 грн |
| 100+ | 248.7 грн |
| 250+ | 224.43 грн |
| 500+ | 201.38 грн |
| MPC561CZP40 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 388PBGA
Packaging: Bulk
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 40MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: PowerPC
Data Converters: A/D 32x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Part Status: Not For New Designs
Number of I/O: 64
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 388PBGA
Packaging: Bulk
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 40MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: PowerPC
Data Converters: A/D 32x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Part Status: Not For New Designs
Number of I/O: 64
DigiKey Programmable: Not Verified
на замовлення 51 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 5+ | 4593.44 грн |
| MF3D2301DUD/00Z |
Виробник: NXP USA Inc.
Description: MF3D2301DUD
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Standards: ISO 14443A
Supplier Device Package: Wafer
Part Status: Active
Description: MF3D2301DUD
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Standards: ISO 14443A
Supplier Device Package: Wafer
Part Status: Active
товар відсутній
| ASL5008FHNZ |
|
Виробник: NXP USA Inc.
Description: IC LED DRVR CTRLR PWM 36HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 36-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 12
Frequency: 200MHz
Type: DC DC Controller
Operating Temperature: -40°C ~ 125°C (TA)
Applications: Automotive
Current - Output / Channel: 800mA
Internal Switch(s): Yes
Topology: Switched Capacitor (Charge Pump)
Supplier Device Package: 36-HVQFN (6x6)
Dimming: PWM
Voltage - Supply (Min): 4.5V
Voltage - Supply (Max): 5.5V
Part Status: Active
Description: IC LED DRVR CTRLR PWM 36HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 36-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 12
Frequency: 200MHz
Type: DC DC Controller
Operating Temperature: -40°C ~ 125°C (TA)
Applications: Automotive
Current - Output / Channel: 800mA
Internal Switch(s): Yes
Topology: Switched Capacitor (Charge Pump)
Supplier Device Package: 36-HVQFN (6x6)
Dimming: PWM
Voltage - Supply (Min): 4.5V
Voltage - Supply (Max): 5.5V
Part Status: Active
товар відсутній
| 74AUP3G04GM,125 |
|
Виробник: NXP USA Inc.
Description: IC INVERTER 3CH 3-INP 8XQFN
Packaging: Bulk
Package / Case: 8-XFQFN Exposed Pad
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 3
Supplier Device Package: 8-XQFN (1.6x1.6)
Input Logic Level - High: 1.6V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.9V
Max Propagation Delay @ V, Max CL: 5.4ns @ 3.3V, 30pF
Part Status: Active
Number of Circuits: 3
Current - Quiescent (Max): 500 nA
Description: IC INVERTER 3CH 3-INP 8XQFN
Packaging: Bulk
Package / Case: 8-XFQFN Exposed Pad
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 3
Supplier Device Package: 8-XQFN (1.6x1.6)
Input Logic Level - High: 1.6V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.9V
Max Propagation Delay @ V, Max CL: 5.4ns @ 3.3V, 30pF
Part Status: Active
Number of Circuits: 3
Current - Quiescent (Max): 500 nA
товар відсутній
| 74LVC2G240GM,125 |
|
Виробник: NXP USA Inc.
Description: IC BUFFER INVERT 5.5V 8XQFN
Packaging: Bulk
Package / Case: 8-XFQFN Exposed Pad
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 32mA, 32mA
Supplier Device Package: 8-XQFN (1.6x1.6)
Part Status: Active
Description: IC BUFFER INVERT 5.5V 8XQFN
Packaging: Bulk
Package / Case: 8-XFQFN Exposed Pad
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 32mA, 32mA
Supplier Device Package: 8-XQFN (1.6x1.6)
Part Status: Active
товар відсутній
| 74LVCH2T45GM125 |
|
Виробник: NXP USA Inc.
Description: NOW NEXPERIA 74LVCH2T45GM - BUS
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: NOW NEXPERIA 74LVCH2T45GM - BUS
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
товар відсутній
| NX3L2G384GM125 |
|
Виробник: NXP USA Inc.
Description: IC ANALOG SWITCH SPST
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC ANALOG SWITCH SPST
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
товар відсутній
| 74AUP2G08GM,125 |
|
Виробник: NXP USA Inc.
Description: IC GATE AND 2CH 2-INP 8-XQFN
Packaging: Bulk
Package / Case: 8-XFQFN Exposed Pad
Mounting Type: Surface Mount
Logic Type: AND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 2
Supplier Device Package: 8-XQFN (1.6x1.6)
Input Logic Level - High: 1.6V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.9V
Max Propagation Delay @ V, Max CL: 6.2ns @ 3.3V, 30pF
Part Status: Active
Number of Circuits: 2
Current - Quiescent (Max): 500 nA
Description: IC GATE AND 2CH 2-INP 8-XQFN
Packaging: Bulk
Package / Case: 8-XFQFN Exposed Pad
Mounting Type: Surface Mount
Logic Type: AND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 2
Supplier Device Package: 8-XQFN (1.6x1.6)
Input Logic Level - High: 1.6V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.9V
Max Propagation Delay @ V, Max CL: 6.2ns @ 3.3V, 30pF
Part Status: Active
Number of Circuits: 2
Current - Quiescent (Max): 500 nA
на замовлення 8053 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 3634+ | 6.08 грн |
| 74AUP2G00GM,125 |
|
Виробник: NXP USA Inc.
Description: IC GATE NAND 2CH 2-INP 8-XQFN
Packaging: Bulk
Package / Case: 8-XFQFN Exposed Pad
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 2
Supplier Device Package: 8-XQFN (1.6x1.6)
Input Logic Level - High: 1.6V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.9V
Max Propagation Delay @ V, Max CL: 6.5ns @ 3.3V, 30pF
Part Status: Active
Number of Circuits: 2
Current - Quiescent (Max): 500 nA
Description: IC GATE NAND 2CH 2-INP 8-XQFN
Packaging: Bulk
Package / Case: 8-XFQFN Exposed Pad
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 2
Supplier Device Package: 8-XQFN (1.6x1.6)
Input Logic Level - High: 1.6V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.9V
Max Propagation Delay @ V, Max CL: 6.5ns @ 3.3V, 30pF
Part Status: Active
Number of Circuits: 2
Current - Quiescent (Max): 500 nA
на замовлення 3773 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 3773+ | 5.62 грн |
| SPC5645CF0VLT1 |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 208TQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 80MHz/120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d, e200z0h
Data Converters: A/D 33x10b, 10x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-TQFP (28x28)
Part Status: Active
Number of I/O: 177
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 2MB FLASH 208TQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 80MHz/120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d, e200z0h
Data Converters: A/D 33x10b, 10x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-TQFP (28x28)
Part Status: Active
Number of I/O: 177
DigiKey Programmable: Not Verified
товар відсутній
| SPC5644BK0MLU1 |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 147
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 147
DigiKey Programmable: Not Verified
товар відсутній
| S9S12ZVL32F0MLCR |
|
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S12Z
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 19
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 32KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S12Z
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 19
DigiKey Programmable: Not Verified
на замовлення 2000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2000+ | 233.62 грн |
| S9S12ZVL32F0MLCR |
|
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 32LQFP
Packaging: Cut Tape (CT)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S12Z
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 19
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 32KB FLASH 32LQFP
Packaging: Cut Tape (CT)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S12Z
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 19
DigiKey Programmable: Not Verified
на замовлення 2000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 465.3 грн |
| 10+ | 350.04 грн |
| 100+ | 286.82 грн |
| 500+ | 263.5 грн |
| 1000+ | 222.23 грн |
| S9KEAZN32AMLCR |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
на замовлення 2000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2000+ | 138.41 грн |
| S9KEAZN32AMLCR |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32LQFP
Packaging: Cut Tape (CT)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 32LQFP
Packaging: Cut Tape (CT)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
на замовлення 2000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 275.99 грн |
| 10+ | 207.34 грн |
| 100+ | 169.93 грн |
| 500+ | 156.12 грн |
| 1000+ | 131.67 грн |
| S9S12GN48J1VLCR |
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 26
Description: IC MCU 16BIT 48KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 26
товар відсутній
| TEA2016DB1519 |
|
Виробник: NXP USA Inc.
Description: TEA2016 240W DEMO BOARD
Packaging: Box
Voltage - Output: 12V
Current - Output: 20A
Regulator Topology: Flyback
Board Type: Fully Populated
Utilized IC / Part: TEA1995T, TEA2016AAT
Supplied Contents: Board(s)
Main Purpose: AC/DC, Primary and Secondary Side with PFC
Outputs and Type: 1, Non-Isolated
Part Status: Active
Power - Output: 240 W
Description: TEA2016 240W DEMO BOARD
Packaging: Box
Voltage - Output: 12V
Current - Output: 20A
Regulator Topology: Flyback
Board Type: Fully Populated
Utilized IC / Part: TEA1995T, TEA2016AAT
Supplied Contents: Board(s)
Main Purpose: AC/DC, Primary and Secondary Side with PFC
Outputs and Type: 1, Non-Isolated
Part Status: Active
Power - Output: 240 W
на замовлення 7 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 26440.27 грн |
| TEA2016AAT/1/S30Y |
|
Виробник: NXP USA Inc.
Description: DCM/QR PFC + RESONANT POWER SUPP
Packaging: Cut Tape (CT)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 0.5V ~ 2.65V, 2.35V ~ 4.5V
Applications: Digital Power Controller
Supplier Device Package: 16-SO
Part Status: Active
Current - Supply: 4.8 mA
Description: DCM/QR PFC + RESONANT POWER SUPP
Packaging: Cut Tape (CT)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 0.5V ~ 2.65V, 2.35V ~ 4.5V
Applications: Digital Power Controller
Supplier Device Package: 16-SO
Part Status: Active
Current - Supply: 4.8 mA
на замовлення 2314 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 198.44 грн |
| 10+ | 171.76 грн |
| 25+ | 169.07 грн |
| 50+ | 158.26 грн |
| 100+ | 141.41 грн |
| 250+ | 136.77 грн |
| 500+ | 134.03 грн |
| 1000+ | 124.81 грн |
| TEA2095T/1J |
|
Виробник: NXP USA Inc.
Description: DUAL SYNCHRONOUS RECTIFICATION C
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 4.75V ~ 38V
Applications: Secondary-Side Controller, Synchronous Rectifier
Supplier Device Package: 8-SO
Part Status: Active
Current - Supply: 90 µA
Description: DUAL SYNCHRONOUS RECTIFICATION C
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 4.75V ~ 38V
Applications: Secondary-Side Controller, Synchronous Rectifier
Supplier Device Package: 8-SO
Part Status: Active
Current - Supply: 90 µA
на замовлення 2480 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 4+ | 82.87 грн |
| 10+ | 72.85 грн |
| 25+ | 70.9 грн |
| 50+ | 66.19 грн |
| 100+ | 59.17 грн |
| 250+ | 59 грн |
| 500+ | 57.15 грн |
| 1000+ | 54.73 грн |
| TEA2017DB1580 |
|
Виробник: NXP USA Inc.
Description: TEA2017 240W DEMO BOARD
Packaging: Bulk
Function: Power Factor Correction
Type: Power Management
Utilized IC / Part: TEA2017
Supplied Contents: Board(s)
Primary Attributes: 90 ~ 264VAC Input Voltage
Embedded: No
Part Status: Active
Description: TEA2017 240W DEMO BOARD
Packaging: Bulk
Function: Power Factor Correction
Type: Power Management
Utilized IC / Part: TEA2017
Supplied Contents: Board(s)
Primary Attributes: 90 ~ 264VAC Input Voltage
Embedded: No
Part Status: Active
товар відсутній
| RDK01DB1563 |
|
Виробник: NXP USA Inc.
Description: TEA2016 USB-I2C INTERFACE
Packaging: Bulk
For Use With/Related Products: TEA2016
Type: Programmer
Contents: Board(s), Cable(s)
Part Status: Active
Description: TEA2016 USB-I2C INTERFACE
Packaging: Bulk
For Use With/Related Products: TEA2016
Type: Programmer
Contents: Board(s), Cable(s)
Part Status: Active
на замовлення 9 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 15301.08 грн |
| BUK764R0-75C,118 |
|
Виробник: NXP USA Inc.
Description: PFET, 100A I(D), 75V, 0.004OHM,
Packaging: Bulk
Package / Case: TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
Rds On (Max) @ Id, Vgs: 4mOhm @ 25A, 10V
Power Dissipation (Max): 333W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: D2PAK
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 75 V
Gate Charge (Qg) (Max) @ Vgs: 142 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 11659 pF @ 25 V
Description: PFET, 100A I(D), 75V, 0.004OHM,
Packaging: Bulk
Package / Case: TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
Rds On (Max) @ Id, Vgs: 4mOhm @ 25A, 10V
Power Dissipation (Max): 333W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: D2PAK
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 75 V
Gate Charge (Qg) (Max) @ Vgs: 142 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 11659 pF @ 25 V
товар відсутній
| MRF6VP121KHR5 |
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230
Frequency: 1.03GHz
Configuration: Dual
Power - Output: 1000W
Gain: 20dB
Technology: LDMOS
Supplier Device Package: NI-1230
Part Status: Not For New Designs
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 150 mA
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230
Frequency: 1.03GHz
Configuration: Dual
Power - Output: 1000W
Gain: 20dB
Technology: LDMOS
Supplier Device Package: NI-1230
Part Status: Not For New Designs
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 150 mA
товар відсутній
| 74HCT377D118 |
|
Виробник: NXP USA Inc.
Description: IC FF D-TYPE SNGL 8BIT 20SO
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 4mA, 5.2mA
Trigger Type: Positive Edge
Clock Frequency: 53 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 20-SO
Max Propagation Delay @ V, Max CL: 32ns @ 4.5V, 50pF
Part Status: Active
Number of Bits per Element: 8
Description: IC FF D-TYPE SNGL 8BIT 20SO
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 4mA, 5.2mA
Trigger Type: Positive Edge
Clock Frequency: 53 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 20-SO
Max Propagation Delay @ V, Max CL: 32ns @ 4.5V, 50pF
Part Status: Active
Number of Bits per Element: 8
на замовлення 1500 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1500+ | 19.01 грн |
| PJF7992ATW/C1C/DJ |
Виробник: NXP USA Inc.
Description: IMMOBIL BASESTATION IC 20HTSSOP
Packaging: Cut Tape (CT)
Mounting Type: Surface Mount
Part Status: Obsolete
Description: IMMOBIL BASESTATION IC 20HTSSOP
Packaging: Cut Tape (CT)
Mounting Type: Surface Mount
Part Status: Obsolete
на замовлення 940 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 295 грн |
| 10+ | 253.69 грн |
| 25+ | 228.31 грн |
| 100+ | 195.21 грн |
| 250+ | 176.16 грн |
| 500+ | 158.07 грн |
| MIMX8SL1AVNFZAB |
|
Виробник: NXP USA Inc.
Description: I.MX8 DXL 15SQ
Packaging: Tray
Package / Case: 388-LFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 388-LBGA (15x15)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4F
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD
Part Status: Active
Core Processor: ARM® Cortex®-A35
Ethernet: 1Gbps (2)
Security Features: AES, Boot Security, Crypto Accelerator, Secure Debug, Secure JTAG, TRNG
Additional Interfaces: CANbus, DMA, GPIO, I2C, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Description: I.MX8 DXL 15SQ
Packaging: Tray
Package / Case: 388-LFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 388-LBGA (15x15)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4F
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD
Part Status: Active
Core Processor: ARM® Cortex®-A35
Ethernet: 1Gbps (2)
Security Features: AES, Boot Security, Crypto Accelerator, Secure Debug, Secure JTAG, TRNG
Additional Interfaces: CANbus, DMA, GPIO, I2C, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
товар відсутній
| MIMX8DL1CVNFZAB |
Виробник: NXP USA Inc.
Description: I.MX 8DUALXLITE 15SQ
Packaging: Tray
Package / Case: 388-LFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 388-LBGA (15x15)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4F
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD
Part Status: Active
Core Processor: ARM® Cortex®-A35
Ethernet: 1Gbps (2)
Security Features: AES, Boot Security, Crypto Accelerator, Secure Debug, Secure JTAG, TRNG
Description: I.MX 8DUALXLITE 15SQ
Packaging: Tray
Package / Case: 388-LFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 388-LBGA (15x15)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4F
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD
Part Status: Active
Core Processor: ARM® Cortex®-A35
Ethernet: 1Gbps (2)
Security Features: AES, Boot Security, Crypto Accelerator, Secure Debug, Secure JTAG, TRNG
товар відсутній
| MIMX8SL1CVNFZAB |
Виробник: NXP USA Inc.
Description: I.MX 8DUALXLITE 15SQ
Packaging: Tray
Package / Case: 388-LFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 388-LBGA (15x15)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4F
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD
Part Status: Active
Core Processor: ARM® Cortex®-A35
Ethernet: 1Gbps (2)
Security Features: AES, Boot Security, Crypto Accelerator, Secure Debug, Secure JTAG, TRNG
Description: I.MX 8DUALXLITE 15SQ
Packaging: Tray
Package / Case: 388-LFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 388-LBGA (15x15)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4F
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD
Part Status: Active
Core Processor: ARM® Cortex®-A35
Ethernet: 1Gbps (2)
Security Features: AES, Boot Security, Crypto Accelerator, Secure Debug, Secure JTAG, TRNG
товар відсутній
| MIMX8DL1AVNFZABR |
|
Виробник: NXP USA Inc.
Description: I.MX8 DXL 15SQ
Packaging: Tape & Reel (TR)
Package / Case: 388-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 388-LBGA (15x15)
Part Status: Active
Description: I.MX8 DXL 15SQ
Packaging: Tape & Reel (TR)
Package / Case: 388-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 388-LBGA (15x15)
Part Status: Active
товар відсутній
| MIMX8DL1AVNFZAB |
|
Виробник: NXP USA Inc.
Description: I.MX8 DXL 15SQ
Packaging: Tray
Package / Case: 388-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 388-LBGA (15x15)
Part Status: Active
Description: I.MX8 DXL 15SQ
Packaging: Tray
Package / Case: 388-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 388-LBGA (15x15)
Part Status: Active
товар відсутній
| MC9S08AW48CFGER |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 48KB FLASH 44LQFP
Packaging: Tape & Reel (TR)
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 34
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 48KB FLASH 44LQFP
Packaging: Tape & Reel (TR)
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 34
DigiKey Programmable: Not Verified
товар відсутній
| MC9S08AW48CFGE |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 48KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 34
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 48KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 34
DigiKey Programmable: Not Verified
товар відсутній
| MC9S08AW48CPUE |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 48KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 48KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
товар відсутній
| P3041NSN7MMC |
|
Виробник: NXP USA Inc.
Description: IC MPU QORIQ P3 1.2GHZ 1295BGA
Packaging: Tray
Package / Case: 1295-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500mc
Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 1295-FCPBGA (37.5x37.5)
Ethernet: 10/100/1000Mbps (5), 10Gbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 32-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Part Status: Obsolete
Additional Interfaces: DUART, I2C, MMC/SD, RapidIO, SPI
Description: IC MPU QORIQ P3 1.2GHZ 1295BGA
Packaging: Tray
Package / Case: 1295-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500mc
Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 1295-FCPBGA (37.5x37.5)
Ethernet: 10/100/1000Mbps (5), 10Gbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 32-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Part Status: Obsolete
Additional Interfaces: DUART, I2C, MMC/SD, RapidIO, SPI
товар відсутній
| S9S12G48J1VLCR |
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 26
Description: IC MCU 16BIT 48KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 26
товар відсутній
| JN5148/Z01515 |
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 56-VFQFN
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC RF TXRX+MCU 802.15.4 56-VFQFN
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
товар відсутній
| JN5142N/001,515 |
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -95dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 128kB ROM, 32kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 3.6V
Power - Output: 2.5dBm
Protocol: Zigbee®
Current - Receiving: 16.5mA
Current - Transmitting: 15mA
Supplier Device Package: 40-HVQFN (6x6)
RF Family/Standard: 802.15.4
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -95dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 128kB ROM, 32kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 3.6V
Power - Output: 2.5dBm
Protocol: Zigbee®
Current - Receiving: 16.5mA
Current - Transmitting: 15mA
Supplier Device Package: 40-HVQFN (6x6)
RF Family/Standard: 802.15.4
Part Status: Obsolete
DigiKey Programmable: Not Verified
товар відсутній
| 74LVC240APW/AU118 |
|
на замовлення 37195 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1902+ | 11.09 грн |
| 74LVC240ADB,118 |
|
Виробник: NXP USA Inc.
Description: IC INVERTER DUAL 4-INPUT 20SSOP
Packaging: Bulk
Part Status: Active
Description: IC INVERTER DUAL 4-INPUT 20SSOP
Packaging: Bulk
Part Status: Active
на замовлення 15948 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1832+ | 11.23 грн |
| P2010NXN2KFC |
|
Виробник: NXP USA Inc.
Description: IC MPU QORIQ P2 1.2GHZ PBGA689
Packaging: Bulk
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Part Status: Active
Description: IC MPU QORIQ P2 1.2GHZ PBGA689
Packaging: Bulk
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Part Status: Active
товар відсутній
| P2010NSE2HFC |
|
Виробник: NXP USA Inc.
Description: IC MPU QORIQ P2 1.2GHZ PBGA689
Packaging: Bulk
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.3
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Part Status: Active
Description: IC MPU QORIQ P2 1.2GHZ PBGA689
Packaging: Bulk
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.3
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Part Status: Active
товар відсутній
| P2010NXE2KFC |
|
Виробник: NXP USA Inc.
Description: IC MPU QORIQ P2 1.2GHZ PBGA689
Packaging: Box
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.3
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Part Status: Obsolete
Description: IC MPU QORIQ P2 1.2GHZ PBGA689
Packaging: Box
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.3
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Part Status: Obsolete
товар відсутній
| P2010NXN2KFC |
|
Виробник: NXP USA Inc.
Description: IC MPU QORIQ P2 1.2GHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Part Status: Obsolete
Description: IC MPU QORIQ P2 1.2GHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Part Status: Obsolete
товар відсутній
| MPXAZ4115A6T1 |
|
Виробник: NXP USA Inc.
Description: SENSOR 16.68PSIA 4.8V
Features: Temperature Compensated
Packaging: Tape & Reel (TR)
Package / Case: 8-SMD Module
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.2 V ~ 4.8 V
Operating Pressure: 2.18PSI ~ 16.68PSI (15kPa ~ 115kPa)
Pressure Type: Absolute
Accuracy: ±1.5%
Operating Temperature: -40°C ~ 125°C
Termination Style: SMD (SMT) Tab
Voltage - Supply: 4.85V ~ 5.35V
Applications: Board Mount
Port Style: No Port
Maximum Pressure: 58.02PSI (400kPa)
Part Status: Obsolete
Description: SENSOR 16.68PSIA 4.8V
Features: Temperature Compensated
Packaging: Tape & Reel (TR)
Package / Case: 8-SMD Module
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.2 V ~ 4.8 V
Operating Pressure: 2.18PSI ~ 16.68PSI (15kPa ~ 115kPa)
Pressure Type: Absolute
Accuracy: ±1.5%
Operating Temperature: -40°C ~ 125°C
Termination Style: SMD (SMT) Tab
Voltage - Supply: 4.85V ~ 5.35V
Applications: Board Mount
Port Style: No Port
Maximum Pressure: 58.02PSI (400kPa)
Part Status: Obsolete
товар відсутній
| MPXAZ4115A6T1 |
|
Виробник: NXP USA Inc.
Description: SENSOR 16.68PSIA 4.8V
Features: Temperature Compensated
Packaging: Cut Tape (CT)
Package / Case: 8-SMD Module
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.2 V ~ 4.8 V
Operating Pressure: 2.18PSI ~ 16.68PSI (15kPa ~ 115kPa)
Pressure Type: Absolute
Accuracy: ±1.5%
Operating Temperature: -40°C ~ 125°C
Termination Style: SMD (SMT) Tab
Voltage - Supply: 4.85V ~ 5.35V
Applications: Board Mount
Port Style: No Port
Maximum Pressure: 58.02PSI (400kPa)
Part Status: Obsolete
Description: SENSOR 16.68PSIA 4.8V
Features: Temperature Compensated
Packaging: Cut Tape (CT)
Package / Case: 8-SMD Module
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.2 V ~ 4.8 V
Operating Pressure: 2.18PSI ~ 16.68PSI (15kPa ~ 115kPa)
Pressure Type: Absolute
Accuracy: ±1.5%
Operating Temperature: -40°C ~ 125°C
Termination Style: SMD (SMT) Tab
Voltage - Supply: 4.85V ~ 5.35V
Applications: Board Mount
Port Style: No Port
Maximum Pressure: 58.02PSI (400kPa)
Part Status: Obsolete
товар відсутній
| PCU9661B,118 |
|
Виробник: NXP USA Inc.
Description: IC CONTROLLER 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Function: Controller
Interface: I²C
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 3.6V
Current - Supply: 15mA
Protocol: I²C
Standards: IEEE 1149.1
Supplier Device Package: 48-LQFP (7x7)
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: IC CONTROLLER 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Function: Controller
Interface: I²C
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 3.6V
Current - Supply: 15mA
Protocol: I²C
Standards: IEEE 1149.1
Supplier Device Package: 48-LQFP (7x7)
Part Status: Obsolete
DigiKey Programmable: Not Verified
товар відсутній
| PCU9661B,118 |
|
Виробник: NXP USA Inc.
Description: IC CONTROLLER 48LQFP
Packaging: Cut Tape (CT)
Package / Case: 48-LQFP
Function: Controller
Interface: I²C
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 3.6V
Current - Supply: 15mA
Protocol: I²C
Standards: IEEE 1149.1
Supplier Device Package: 48-LQFP (7x7)
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: IC CONTROLLER 48LQFP
Packaging: Cut Tape (CT)
Package / Case: 48-LQFP
Function: Controller
Interface: I²C
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 3.6V
Current - Supply: 15mA
Protocol: I²C
Standards: IEEE 1149.1
Supplier Device Package: 48-LQFP (7x7)
Part Status: Obsolete
DigiKey Programmable: Not Verified
товар відсутній
| PRF13750HR9697 |
|
Виробник: NXP USA Inc.
Description: PRF13750HR - RF MOSFET LDMOS (DU
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: PRF13750HR - RF MOSFET LDMOS (DU
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 17 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 15999.04 грн |
| MF3MOD4101DA4/05,1 |
Виробник: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ MOA4
Packaging: Tape & Reel (TR)
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: UART
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C
Standards: ISO 14443, MIFARE
Part Status: Active
Description: IC RFID TRANSP 13.56MHZ MOA4
Packaging: Tape & Reel (TR)
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: UART
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C
Standards: ISO 14443, MIFARE
Part Status: Active
товар відсутній
| MF3MOD4101DA4/05,1 |
Виробник: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ MOA4
Packaging: Cut Tape (CT)
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: UART
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C
Standards: ISO 14443, MIFARE
Part Status: Active
Description: IC RFID TRANSP 13.56MHZ MOA4
Packaging: Cut Tape (CT)
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: UART
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C
Standards: ISO 14443, MIFARE
Part Status: Active
товар відсутній
| MPC8569ECVJANKGB |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC85XX 800MHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e500v2
Voltage - I/O: 1.0V, 1.5V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100Mbps (8), 1Gbps (4)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC
RAM Controllers: DDR2, DDR3, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Part Status: Obsolete
Description: IC MPU MPC85XX 800MHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e500v2
Voltage - I/O: 1.0V, 1.5V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100Mbps (8), 1Gbps (4)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC
RAM Controllers: DDR2, DDR3, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Part Status: Obsolete
товар відсутній
| MKM14Z64CHH5 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 44MAPLGA
Packaging: Tray
Package / Case: 44-VFLGA Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 5x16b, 4x24b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, WDT
Supplier Device Package: 44-MAPLGA (5x5)
Part Status: Not For New Designs
Number of I/O: 20
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 44MAPLGA
Packaging: Tray
Package / Case: 44-VFLGA Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 5x16b, 4x24b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, WDT
Supplier Device Package: 44-MAPLGA (5x5)
Part Status: Not For New Designs
Number of I/O: 20
DigiKey Programmable: Not Verified
товар відсутній
| A5G35S004NT6 |
|
Виробник: NXP USA Inc.
Description: AIRFAST RF POWER GAN TRANSISTOR,
Packaging: Tape & Reel (TR)
Package / Case: 6-LDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.3GHz ~ 4.3GHz
Power - Output: 24.5dBm
Gain: 16.9dB
Supplier Device Package: 6-PDFN (4x4.5)
Part Status: Active
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 12 mA
Description: AIRFAST RF POWER GAN TRANSISTOR,
Packaging: Tape & Reel (TR)
Package / Case: 6-LDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.3GHz ~ 4.3GHz
Power - Output: 24.5dBm
Gain: 16.9dB
Supplier Device Package: 6-PDFN (4x4.5)
Part Status: Active
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 12 mA
товар відсутній
| LPC55S69JBD64Y |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 640KB FLASH 64HTQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 640KB (640K x 8)
RAM Size: 320K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Part Status: Active
Number of I/O: 36
Description: IC MCU 32BIT 640KB FLASH 64HTQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 640KB (640K x 8)
RAM Size: 320K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Part Status: Active
Number of I/O: 36
на замовлення 1500 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1500+ | 365.51 грн |