Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (35277) > Сторінка 458 з 588
| Фото | Назва | Виробник | Інформація |
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TJA1128ATK/0Z | NXP USA Inc. |
 Description: IC TRANSCEIVER FULL 1/1 14HVSONPackaging: Cut Tape (CT) Package / Case: 14-VDFN Exposed Pad Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 5V ~ 28V Number of Drivers/Receivers: 1/1 Data Rate: 20kBd Protocol: LIN Supplier Device Package: 14-HVSON (3x4.5) Duplex: Full |
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PCF8579HT/1,518 | NXP USA Inc. |
Description: INTERFACE CIRCUIT, CMOS, PQFP64 Packaging: Bulk Part Status: Active |
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| MF1P4101DUD/02V | NXP USA Inc. |
Description: MIFARE PLUS EV1 Packaging: Tray Package / Case: Die Frequency: 13.56MHz Type: RFID Transponder Operating Temperature: -25°C ~ 70°C (TA) Standards: ISO 14443, MIFARE Supplier Device Package: Wafer |
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| TFA9887UK/N2AZ | NXP USA Inc. |
Description: IC AMP CLSS D MONO 2.65W 29WLCSP Features: Depop, Short-Circuit and Thermal Protection Packaging: Tape & Reel (TR) Package / Case: 29-UFBGA, WLCSP Output Type: 1-Channel (Mono) Mounting Type: Surface Mount Type: Class D Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.5V ~ 5.5V Max Output Power x Channels @ Load: 2.65W x 1 @ 4Ohm Supplier Device Package: 29-WLCSP (3.19x2.07) Part Status: Obsolete |
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| TFA9895UK/N2BZ | NXP USA Inc. |
Description: IC AMP D 1 JACK 2.5W 29WLCSP Features: Depop, Short-Circuit and Thermal Protection Packaging: Bulk Package / Case: 29-UFBGA, WLCSP Output Type: 1 Jack, Filtered Mounting Type: Surface Mount Type: Class D Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.5V ~ 5.5V Max Output Power x Channels @ Load: 2.5W x 1 @ 4Ohm Supplier Device Package: 29-WLCSP (3.19x2.07) Part Status: Active |
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| TFA9895UK/N2AZ | NXP USA Inc. |
Description: IC AMP D 1 JACK 2.5W 29WLCSP Features: Depop, Short-Circuit and Thermal Protection Packaging: Bulk Package / Case: 29-UFBGA, WLCSP Output Type: 1 Jack, Filtered Mounting Type: Surface Mount Type: Class D Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.5V ~ 5.5V Max Output Power x Channels @ Load: 2.5W x 1 @ 4Ohm Supplier Device Package: 29-WLCSP (3.19x2.07) Part Status: Active |
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| TFA9895BUK/N1Z | NXP USA Inc. |
Description: IC AMP D 1 JACK 2.5W 29WLCSP Features: Depop, Short-Circuit and Thermal Protection Packaging: Bulk Output Type: 1 Jack, Filtered Type: Class D Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.5V ~ 5.5V Max Output Power x Channels @ Load: 2.5W x 1 @ 4Ohm Part Status: Obsolete |
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| TFA9887UK/N2BZ | NXP USA Inc. |
Description: IC AMP CLSS D MONO 2.65W 29WLCSP Features: Depop, Short-Circuit and Thermal Protection Packaging: Tape & Reel (TR) Package / Case: 29-UFBGA, WLCSP Output Type: 1-Channel (Mono) Mounting Type: Surface Mount Type: Class D Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.5V ~ 5.5V Max Output Power x Channels @ Load: 2.65W x 1 @ 4Ohm Supplier Device Package: 29-WLCSP (3.19x2.07) Part Status: Obsolete |
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| BZX84-A16215 | NXP USA Inc. |
Description: NOW NEXPERIA BZX84-A13 - ZENER D |
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| MC34931SEKR2 | NXP USA Inc. |
Description: H-BRIDGE BRUSHED DC MOTOR DRIVE |
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BZV90-C75,115 | NXP USA Inc. |
Description: DIODE ZENER 75V 1.5W SOT223 Packaging: Bulk Tolerance: ±5% Package / Case: TO-261-4, TO-261AA Mounting Type: Surface Mount Operating Temperature: -65°C ~ 150°C Voltage - Zener (Nom) (Vz): 75 V Impedance (Max) (Zzt): 255 Ohms Supplier Device Package: SOT-223 Power - Max: 1.5 W Voltage - Forward (Vf) (Max) @ If: 1 V @ 50 mA Current - Reverse Leakage @ Vr: 50 nA @ 52.5 V |
на замовлення 13781 шт: термін постачання 21-31 дні (днів) |
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BZV90-C39115 | NXP USA Inc. |
Description: DIODE ZENER 36V 1.5W 5% UNI Packaging: Bulk Tolerance: ±5% Package / Case: TO-261-4, TO-261AA Mounting Type: Surface Mount Operating Temperature: -65°C ~ 150°C Voltage - Zener (Nom) (Vz): 39 V Impedance (Max) (Zzt): 130 Ohms Supplier Device Package: SOT-223 Part Status: Active Power - Max: 1.5 W Voltage - Forward (Vf) (Max) @ If: 1 V @ 50 mA Current - Reverse Leakage @ Vr: 50 nA @ 27.3 V |
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| LX2082RE82029B | NXP USA Inc. |
Description: IC MPU QORIQ LX 2GHZ 1150FBGA Packaging: Tray Package / Case: 1150-FBGA Mounting Type: Surface Mount Speed: 2GHz Operating Temperature: 5°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A72 Supplier Device Package: 1150-FBGA (23x23) USB: USB 3.0 (1) Number of Cores/Bus Width: 8 Core, 64-Bit RAM Controllers: DDR4, SDRAM Graphics Acceleration: No SATA: SATA 6Gbps (4) Additional Interfaces: CANbus, I2C, PCIe, SPI, UART |
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TJA1086HNJ | NXP USA Inc. |
Description: IC TRANSCEIVER FULL 1/1 44HVQFN Packaging: Bulk Package / Case: 44-VQFN Exposed Pad Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 125°C Voltage - Supply: 4.75V ~ 5.25V Number of Drivers/Receivers: 1/1 Protocol: FlexRay Supplier Device Package: 44-HVQFN (9x9) Duplex: Full |
на замовлення 1000 шт: термін постачання 21-31 дні (днів) |
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S9S08RN32W1MLH | NXP USA Inc. |
Description: IC MCU 8BIT 32KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 32KB (32K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 256 x 8 Core Processor: S08 Data Converters: A/D 16x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, LINbus, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 55 DigiKey Programmable: Not Verified |
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SPC5675KF0MMS2 | NXP USA Inc. |
Description: IC MCU 32BIT 2MB FLASH 473MAPBGA Packaging: Tray Package / Case: 473-LFBGA Mounting Type: Surface Mount Speed: 180MHz Program Memory Size: 2MB (2M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z7d Data Converters: A/D 34x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 473-MAPBGA (19x19) DigiKey Programmable: Not Verified |
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| MCIMX6QP4AVT8AB | NXP USA Inc. |
Description: IC MPU I.MX6QP 1.0GHZ 624FCBGA Packaging: Tray Package / Case: 624-FBGA, FCBGA Mounting Type: Surface Mount Speed: 1.0GHz Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 624-FCBGA (21x21) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) Number of Cores/Bus Width: 4 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR3L, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS SATA: SATA 3Gbps (1) |
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P1010NSN5HHB | NXP USA Inc. |
Description: IC MPU QORIQ P1 1.0GHZ 425TEPBGA Packaging: Tray Package / Case: 425-FBGA Mounting Type: Surface Mount Speed: 1.0GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e500v2 Supplier Device Package: 425-TEPBGA I (19x19) Ethernet: 10/100/1000Mbps (3) USB: USB 2.0 + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR3, DDR3L Graphics Acceleration: No SATA: SATA 3Gbps (2) |
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NVT2002TLH | NXP USA Inc. |
Description: IC TRANSLATOR BIDIR HXSON8U Packaging: Tape & Reel (TR) Package / Case: 8-XFDFN Exposed Pad Output Type: Open Drain, Push-Pull Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C (TA) Data Rate: 33MHz Supplier Device Package: HXSON8U Channel Type: Bidirectional Translator Type: Voltage Level Channels per Circuit: 2 Voltage - VCCA: 1 V ~ 3.6 V Voltage - VCCB: 1.8 V ~ 5.5 V Part Status: Active Number of Circuits: 1 |
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74AXP1G10GMH | NXP USA Inc. |
Description: IC GATE NAND 1CH 3-INP 6XSON Packaging: Bulk Package / Case: 6-XFDFN Mounting Type: Surface Mount Logic Type: NAND Gate Operating Temperature: -40°C ~ 85°C Voltage - Supply: 0.7V ~ 2.75V Current - Output High, Low: 8mA, 8mA Number of Inputs: 3 Supplier Device Package: 6-XSON (1.45x1) Max Propagation Delay @ V, Max CL: 3.2ns @ 2.5V, 5pF Part Status: Active Number of Circuits: 1 Current - Quiescent (Max): 600 nA |
на замовлення 4653 шт: термін постачання 21-31 дні (днів) |
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74AXP2G34GMH | NXP USA Inc. |
Description: IC BUFFER NON-INVERT 2.75V 6XSON Packaging: Bulk Package / Case: 6-XFDFN Output Type: Push-Pull Mounting Type: Surface Mount Number of Elements: 2 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 0.7V ~ 2.75V Number of Bits per Element: 1 Current - Output High, Low: 8mA, 8mA Supplier Device Package: 6-XSON (1.45x1) Part Status: Active |
на замовлення 4784 шт: термін постачання 21-31 дні (днів) |
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| A5G35S004N-3400 | NXP USA Inc. |
Description: A5G35S004N 3400-4300 MHZ REFEREN |
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PSMN7R8-120PS127 | NXP USA Inc. |
Description: NOW NEXPERIA PSMN7R8-120PS - POW |
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| PDZ10B/ZLX | NXP USA Inc. | Description: DIODE ZENER SOD323 |
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SPC5605BK0CLL4 | NXP USA Inc. |
Description: IC MCU 32BIT 768KB FLASH 100LQFP Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 64MHz Program Memory Size: 768KB (768K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0h Data Converters: A/D 7x10b, 5x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Part Status: Active Number of I/O: 77 DigiKey Programmable: Not Verified |
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SPC5602CACLL4 | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 100LQFP Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 256KB (256K x 8) RAM Size: 24K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0h Data Converters: A/D 28x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Part Status: Active Number of I/O: 79 DigiKey Programmable: Not Verified |
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BZX384-B16115 | NXP USA Inc. |
Description: NOW NEXPERIA BZX384-B16 - ZENER Packaging: Bulk Part Status: Active |
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| MC7448VU1400ND | NXP USA Inc. |
Description: IC MPU MPC74XX 1.4GHZ 360FCCBGA Packaging: Bulk Package / Case: 360-CBGA, FCCBGA Mounting Type: Surface Mount Speed: 1.4GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC G4 Voltage - I/O: 1.5V, 1.8V, 2.5V Supplier Device Package: 360-FCCBGA (25x25) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; SIMD Graphics Acceleration: No Part Status: Active |
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SPC5603BK0VLH4R | NXP USA Inc. |
Description: IC MCU 32BIT 384KB FLASH 64LQFP Packaging: Tape & Reel (TR) Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 384KB (384K x 8) RAM Size: 28K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0h Data Converters: A/D 12x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 45 DigiKey Programmable: Not Verified |
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LD6836TD/12P,125 | NXP USA Inc. |
Description: IC REG LINEAR 1.2V 300MA 5TSOP |
на замовлення 6670 шт: термін постачання 21-31 дні (днів) |
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| NZX11C,133 | NXP USA Inc. |
Description: DIODE ZENER 11V 500MW ALF2 |
на замовлення 19880 шт: термін постачання 21-31 дні (днів) |
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IMXRT600-AUD-EVK | NXP USA Inc. |
Description: I.MX RT685 AUDIO EVAL KIT Packaging: Box Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s), Cable(s) Core Processor: ARM® Cortex®-M33 Board Type: Evaluation Platform Utilized IC / Part: i.MX RT685 Part Status: Active |
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74ALVCH16827DGGS | NXP USA Inc. |
Description: IC BUF NON-INVERT 3.6V 56TSSOP |
на замовлення 2605 шт: термін постачання 21-31 дні (днів) |
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PCF1252-4T/F4,112 | NXP USA Inc. |
Description: IC SUPERVISOR 1 CHANNEL 8SO |
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| BGU7258115 | NXP USA Inc. |
Description: IC AMP ISM 4.9GHZ-5.925GHZ 6DFN Packaging: Bulk Package / Case: 6-XFDFN Exposed Pad Mounting Type: Surface Mount Frequency: 4.9GHz ~ 5.925GHz RF Type: ISM Voltage - Supply: 3V ~ 3.6V Gain: 15dB Current - Supply: 13mA Noise Figure: 1.6dB P1dB: -4dBm Test Frequency: 5.5GHz Supplier Device Package: DFN1616-6 |
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SPC5644BAMLU8 | NXP USA Inc. |
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP Packaging: Tray Package / Case: 176-LQFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 1.5MB (1.5M x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z4d Data Converters: A/D 27x10b, 5x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 176-LQFP (24x24) Number of I/O: 147 DigiKey Programmable: Not Verified |
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S912XEQ384BCALR | NXP USA Inc. |
Description: IC MCU 16BIT 384KB FLASH 112LQFP Packaging: Tape & Reel (TR) Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 384KB (384K x 8) RAM Size: 24K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 16x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 112-LQFP (20x20) Number of I/O: 91 DigiKey Programmable: Not Verified |
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S912XEQ384BCAL | NXP USA Inc. |
Description: IC MCU 16BIT 384KB FLASH 112LQFP Packaging: Tray Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 384KB (384K x 8) RAM Size: 24K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 16x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 112-LQFP (20x20) Number of I/O: 91 DigiKey Programmable: Not Verified |
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S912XEG384AVAL | NXP USA Inc. |
Description: IC MCU 16BIT 384KB FLASH 112LQFP Packaging: Tray Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 384KB (384K x 8) RAM Size: 24K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 16x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 112-LQFP (20x20) Number of I/O: 91 DigiKey Programmable: Not Verified |
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SPC5644BAMLU8R | NXP USA Inc. |
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP Packaging: Tape & Reel (TR) Package / Case: 176-LQFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 1.5MB (1.5M x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z4d Data Converters: A/D 27x10b, 5x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 176-LQFP (24x24) Number of I/O: 147 DigiKey Programmable: Not Verified |
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SPC5644BAMLU1R | NXP USA Inc. |
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP Packaging: Tape & Reel (TR) Package / Case: 176-LQFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 1.5MB (1.5M x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z4d Data Converters: A/D 27x10b, 5x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 176-LQFP (24x24) Number of I/O: 147 DigiKey Programmable: Not Verified |
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PRH601HL/C1,557 | NXP USA Inc. |
Description: IC RFID RDR 125KZ/13.56MZ 100QFP |
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MMDS36254HT1 | NXP USA Inc. |
Description: ADAM - ADVANCED DOHERTY ALIGNMEN |
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MMDS36254HT1 | NXP USA Inc. |
Description: ADAM - ADVANCED DOHERTY ALIGNMEN |
на замовлення 7000 шт: термін постачання 21-31 дні (днів) |
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74ALVC16245DL,112-NXP | NXP USA Inc. | Description: IC TXRX NON-INVERT 3.6V 48SSOP |
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PEMB4,115 | NXP USA Inc. |
Description: NOW NEXPERIA PEMB4 - SMALL SIGNA |
на замовлення 56821 шт: термін постачання 21-31 дні (днів) |
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PCAL6534EV-ARD | NXP USA Inc. |
Description: 34-BIT GPIO ARDUINO SHIELD Packaging: Bulk Function: I/O Expansion Type: Interface Contents: Board(s) Utilized IC / Part: PCAL6534 Platform: Arduino Part Status: Active |
на замовлення 5 шт: термін постачання 21-31 дні (днів) |
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OM-A5000ARD | NXP USA Inc. |
Description: A5000 ARDUINO DEV KIT Packaging: Bulk Function: Security Type: Interface Contents: Board(s) Utilized IC / Part: A5000 Platform: Arduino |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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S9KEAZ128ACLHR | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 64LQFP Packaging: Tape & Reel (TR) Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 128KB (128K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16x12b SAR Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 58 DigiKey Programmable: Not Verified |
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S912XEP100BMAGR | NXP USA Inc. |
Description: IC MCU 16BIT 1MB FLASH 144LQFP Packaging: Tape & Reel (TR) Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 1MB (1M x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 24x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 119 DigiKey Programmable: Not Verified |
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S9S12G96AVLHR | NXP USA Inc. | Description: IC MCU 16BIT 96KB FLASH 64LQFP |
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S912ZVC64F0VLFR | NXP USA Inc. |
Description: IC MCU 16BIT 64KB FLASH 48LQFP Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 64KB (64K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 1K x 8 Core Processor: S12Z Data Converters: A/D 10x10b; D/A 1x8b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Connectivity: CANbus, I2C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 28 DigiKey Programmable: Not Verified |
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PTVS60VP1UTP,115 | NXP USA Inc. |
Description: TVS DIODE 60VWM 96.8VC CFP5 Packaging: Bulk Package / Case: SOD-128 Mounting Type: Surface Mount Type: Zener Operating Temperature: -55°C ~ 185°C (TA) Applications: Automotive Current - Peak Pulse (10/1000µs): 6.2A Voltage - Reverse Standoff (Typ): 60V Supplier Device Package: SOD-128/CFP5 Unidirectional Channels: 1 Voltage - Breakdown (Min): 66.7V Voltage - Clamping (Max) @ Ipp: 96.8V Power - Peak Pulse: 600W Power Line Protection: No Part Status: Active |
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PTVS64VP1UTP115 | NXP USA Inc. |
Description: NOW NEXPERIA PTVS64VP1UTP TRANS |
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PTVS60VP1UTP115 | NXP USA Inc. |
Description: NOW NEXPERIA PTVS60VP1UTP - TRAN |
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PCA8553DTT/AJ | NXP USA Inc. |
Description: IC DRVR 160 SEGMENT 56TSSOP Packaging: Tape & Reel (TR) Package / Case: 56-TFSOP (0.240", 6.10mm Width) Display Type: LCD Mounting Type: Surface Mount Interface: I2C, SPI Configuration: 160 Segment Operating Temperature: -40°C ~ 105°C Voltage - Supply: 1.8V ~ 5.5V Digits or Characters: 10 Characters, 20 Characters, 160 Elements Supplier Device Package: 56-TSSOP Part Status: Obsolete Current - Supply: 1.8 µA Grade: Automotive Qualification: AEC-Q100 |
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PCA8553DTT/AJ | NXP USA Inc. |
Description: IC DRVR 160 SEGMENT 56TSSOP Packaging: Cut Tape (CT) Package / Case: 56-TFSOP (0.240", 6.10mm Width) Display Type: LCD Mounting Type: Surface Mount Interface: I2C, SPI Configuration: 160 Segment Operating Temperature: -40°C ~ 105°C Voltage - Supply: 1.8V ~ 5.5V Digits or Characters: 10 Characters, 20 Characters, 160 Elements Supplier Device Package: 56-TSSOP Part Status: Obsolete Current - Supply: 1.8 µA Grade: Automotive Qualification: AEC-Q100 |
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LPC2290FBD144/01551 | NXP USA Inc. |
Description: IC MCU 16/32BIT ROMLESS 144LQFP |
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MC34PF8100F3EPR2 | NXP USA Inc. |
Description: POWER MANAGEMENT IC I.MX8 PRE-PR Packaging: Tape & Reel (TR) Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 2.5V ~ 5.5V Applications: High Performance i.MX 8, S32x Processor Based Supplier Device Package: 56-HVQFN (8x8) |
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K32W041K | NXP USA Inc. |
Description: K32W041 BLE/ZIGBEE SOC Packaging: Tray Package / Case: 40-VFQFN Exposed Pad Sensitivity: -101.3dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 640kB Flash, 152kB SRAM Type: TxRx + MCU Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.9V ~ 3.6V Power - Output: 11.2dBm Protocol: Bluetooth v5.0, Thread, Zigbee® Current - Receiving: 4.3mA Data Rate (Max): 2Mbps Current - Transmitting: 7.4mA ~ 20.3mA Supplier Device Package: 40-HVQFN (6x6) GPIO: 22 RF Family/Standard: 802.15.4, Bluetooth Serial Interfaces: I2C, SPI, PWM, UART Part Status: Active DigiKey Programmable: Not Verified |
на замовлення 2450 шт: термін постачання 21-31 дні (днів) |
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| TJA1128ATK/0Z |
|
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER FULL 1/1 14HVSON
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 1/1
Data Rate: 20kBd
Protocol: LIN
Supplier Device Package: 14-HVSON (3x4.5)
Duplex: Full
Description: IC TRANSCEIVER FULL 1/1 14HVSON
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 1/1
Data Rate: 20kBd
Protocol: LIN
Supplier Device Package: 14-HVSON (3x4.5)
Duplex: Full
товар відсутній
| PCF8579HT/1,518 |
|
Виробник: NXP USA Inc.
Description: INTERFACE CIRCUIT, CMOS, PQFP64
Packaging: Bulk
Part Status: Active
Description: INTERFACE CIRCUIT, CMOS, PQFP64
Packaging: Bulk
Part Status: Active
товар відсутній
| MF1P4101DUD/02V |
Виробник: NXP USA Inc.
Description: MIFARE PLUS EV1
Packaging: Tray
Package / Case: Die
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Standards: ISO 14443, MIFARE
Supplier Device Package: Wafer
Description: MIFARE PLUS EV1
Packaging: Tray
Package / Case: Die
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Standards: ISO 14443, MIFARE
Supplier Device Package: Wafer
товар відсутній
| TFA9887UK/N2AZ |
|
Виробник: NXP USA Inc.
Description: IC AMP CLSS D MONO 2.65W 29WLCSP
Features: Depop, Short-Circuit and Thermal Protection
Packaging: Tape & Reel (TR)
Package / Case: 29-UFBGA, WLCSP
Output Type: 1-Channel (Mono)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Max Output Power x Channels @ Load: 2.65W x 1 @ 4Ohm
Supplier Device Package: 29-WLCSP (3.19x2.07)
Part Status: Obsolete
Description: IC AMP CLSS D MONO 2.65W 29WLCSP
Features: Depop, Short-Circuit and Thermal Protection
Packaging: Tape & Reel (TR)
Package / Case: 29-UFBGA, WLCSP
Output Type: 1-Channel (Mono)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Max Output Power x Channels @ Load: 2.65W x 1 @ 4Ohm
Supplier Device Package: 29-WLCSP (3.19x2.07)
Part Status: Obsolete
товар відсутній
| TFA9895UK/N2BZ |
Виробник: NXP USA Inc.
Description: IC AMP D 1 JACK 2.5W 29WLCSP
Features: Depop, Short-Circuit and Thermal Protection
Packaging: Bulk
Package / Case: 29-UFBGA, WLCSP
Output Type: 1 Jack, Filtered
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Max Output Power x Channels @ Load: 2.5W x 1 @ 4Ohm
Supplier Device Package: 29-WLCSP (3.19x2.07)
Part Status: Active
Description: IC AMP D 1 JACK 2.5W 29WLCSP
Features: Depop, Short-Circuit and Thermal Protection
Packaging: Bulk
Package / Case: 29-UFBGA, WLCSP
Output Type: 1 Jack, Filtered
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Max Output Power x Channels @ Load: 2.5W x 1 @ 4Ohm
Supplier Device Package: 29-WLCSP (3.19x2.07)
Part Status: Active
товар відсутній
| TFA9895UK/N2AZ |
Виробник: NXP USA Inc.
Description: IC AMP D 1 JACK 2.5W 29WLCSP
Features: Depop, Short-Circuit and Thermal Protection
Packaging: Bulk
Package / Case: 29-UFBGA, WLCSP
Output Type: 1 Jack, Filtered
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Max Output Power x Channels @ Load: 2.5W x 1 @ 4Ohm
Supplier Device Package: 29-WLCSP (3.19x2.07)
Part Status: Active
Description: IC AMP D 1 JACK 2.5W 29WLCSP
Features: Depop, Short-Circuit and Thermal Protection
Packaging: Bulk
Package / Case: 29-UFBGA, WLCSP
Output Type: 1 Jack, Filtered
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Max Output Power x Channels @ Load: 2.5W x 1 @ 4Ohm
Supplier Device Package: 29-WLCSP (3.19x2.07)
Part Status: Active
товар відсутній
| TFA9895BUK/N1Z |
Виробник: NXP USA Inc.
Description: IC AMP D 1 JACK 2.5W 29WLCSP
Features: Depop, Short-Circuit and Thermal Protection
Packaging: Bulk
Output Type: 1 Jack, Filtered
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Max Output Power x Channels @ Load: 2.5W x 1 @ 4Ohm
Part Status: Obsolete
Description: IC AMP D 1 JACK 2.5W 29WLCSP
Features: Depop, Short-Circuit and Thermal Protection
Packaging: Bulk
Output Type: 1 Jack, Filtered
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Max Output Power x Channels @ Load: 2.5W x 1 @ 4Ohm
Part Status: Obsolete
товар відсутній
| TFA9887UK/N2BZ |
|
Виробник: NXP USA Inc.
Description: IC AMP CLSS D MONO 2.65W 29WLCSP
Features: Depop, Short-Circuit and Thermal Protection
Packaging: Tape & Reel (TR)
Package / Case: 29-UFBGA, WLCSP
Output Type: 1-Channel (Mono)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Max Output Power x Channels @ Load: 2.65W x 1 @ 4Ohm
Supplier Device Package: 29-WLCSP (3.19x2.07)
Part Status: Obsolete
Description: IC AMP CLSS D MONO 2.65W 29WLCSP
Features: Depop, Short-Circuit and Thermal Protection
Packaging: Tape & Reel (TR)
Package / Case: 29-UFBGA, WLCSP
Output Type: 1-Channel (Mono)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Max Output Power x Channels @ Load: 2.65W x 1 @ 4Ohm
Supplier Device Package: 29-WLCSP (3.19x2.07)
Part Status: Obsolete
товар відсутній
| BZV90-C75,115 |
|
Виробник: NXP USA Inc.
Description: DIODE ZENER 75V 1.5W SOT223
Packaging: Bulk
Tolerance: ±5%
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 75 V
Impedance (Max) (Zzt): 255 Ohms
Supplier Device Package: SOT-223
Power - Max: 1.5 W
Voltage - Forward (Vf) (Max) @ If: 1 V @ 50 mA
Current - Reverse Leakage @ Vr: 50 nA @ 52.5 V
Description: DIODE ZENER 75V 1.5W SOT223
Packaging: Bulk
Tolerance: ±5%
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 75 V
Impedance (Max) (Zzt): 255 Ohms
Supplier Device Package: SOT-223
Power - Max: 1.5 W
Voltage - Forward (Vf) (Max) @ If: 1 V @ 50 mA
Current - Reverse Leakage @ Vr: 50 nA @ 52.5 V
на замовлення 13781 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1745+ | 11.94 грн |
| BZV90-C39115 |
|
Виробник: NXP USA Inc.
Description: DIODE ZENER 36V 1.5W 5% UNI
Packaging: Bulk
Tolerance: ±5%
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 39 V
Impedance (Max) (Zzt): 130 Ohms
Supplier Device Package: SOT-223
Part Status: Active
Power - Max: 1.5 W
Voltage - Forward (Vf) (Max) @ If: 1 V @ 50 mA
Current - Reverse Leakage @ Vr: 50 nA @ 27.3 V
Description: DIODE ZENER 36V 1.5W 5% UNI
Packaging: Bulk
Tolerance: ±5%
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 39 V
Impedance (Max) (Zzt): 130 Ohms
Supplier Device Package: SOT-223
Part Status: Active
Power - Max: 1.5 W
Voltage - Forward (Vf) (Max) @ If: 1 V @ 50 mA
Current - Reverse Leakage @ Vr: 50 nA @ 27.3 V
товар відсутній
| LX2082RE82029B |
Виробник: NXP USA Inc.
Description: IC MPU QORIQ LX 2GHZ 1150FBGA
Packaging: Tray
Package / Case: 1150-FBGA
Mounting Type: Surface Mount
Speed: 2GHz
Operating Temperature: 5°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 1150-FBGA (23x23)
USB: USB 3.0 (1)
Number of Cores/Bus Width: 8 Core, 64-Bit
RAM Controllers: DDR4, SDRAM
Graphics Acceleration: No
SATA: SATA 6Gbps (4)
Additional Interfaces: CANbus, I2C, PCIe, SPI, UART
Description: IC MPU QORIQ LX 2GHZ 1150FBGA
Packaging: Tray
Package / Case: 1150-FBGA
Mounting Type: Surface Mount
Speed: 2GHz
Operating Temperature: 5°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 1150-FBGA (23x23)
USB: USB 3.0 (1)
Number of Cores/Bus Width: 8 Core, 64-Bit
RAM Controllers: DDR4, SDRAM
Graphics Acceleration: No
SATA: SATA 6Gbps (4)
Additional Interfaces: CANbus, I2C, PCIe, SPI, UART
товар відсутній
| TJA1086HNJ |
|
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER FULL 1/1 44HVQFN
Packaging: Bulk
Package / Case: 44-VQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Protocol: FlexRay
Supplier Device Package: 44-HVQFN (9x9)
Duplex: Full
Description: IC TRANSCEIVER FULL 1/1 44HVQFN
Packaging: Bulk
Package / Case: 44-VQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Protocol: FlexRay
Supplier Device Package: 44-HVQFN (9x9)
Duplex: Full
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 30+ | 733.94 грн |
| S9S08RN32W1MLH |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 55
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 55
DigiKey Programmable: Not Verified
товар відсутній
| SPC5675KF0MMS2 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 473MAPBGA
Packaging: Tray
Package / Case: 473-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 34x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 473-MAPBGA (19x19)
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 2MB FLASH 473MAPBGA
Packaging: Tray
Package / Case: 473-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 34x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 473-MAPBGA (19x19)
DigiKey Programmable: Not Verified
товар відсутній
| MCIMX6QP4AVT8AB |
|
Виробник: NXP USA Inc.
Description: IC MPU I.MX6QP 1.0GHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3L, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
SATA: SATA 3Gbps (1)
Description: IC MPU I.MX6QP 1.0GHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3L, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
SATA: SATA 3Gbps (1)
товар відсутній
| P1010NSN5HHB |
|
Виробник: NXP USA Inc.
Description: IC MPU QORIQ P1 1.0GHZ 425TEPBGA
Packaging: Tray
Package / Case: 425-FBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 425-TEPBGA I (19x19)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Description: IC MPU QORIQ P1 1.0GHZ 425TEPBGA
Packaging: Tray
Package / Case: 425-FBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 425-TEPBGA I (19x19)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
товар відсутній
| NVT2002TLH |
|
Виробник: NXP USA Inc.
Description: IC TRANSLATOR BIDIR HXSON8U
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN Exposed Pad
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Data Rate: 33MHz
Supplier Device Package: HXSON8U
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
Description: IC TRANSLATOR BIDIR HXSON8U
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN Exposed Pad
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Data Rate: 33MHz
Supplier Device Package: HXSON8U
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
товар відсутній
| 74AXP1G10GMH |
|
Виробник: NXP USA Inc.
Description: IC GATE NAND 1CH 3-INP 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 0.7V ~ 2.75V
Current - Output High, Low: 8mA, 8mA
Number of Inputs: 3
Supplier Device Package: 6-XSON (1.45x1)
Max Propagation Delay @ V, Max CL: 3.2ns @ 2.5V, 5pF
Part Status: Active
Number of Circuits: 1
Current - Quiescent (Max): 600 nA
Description: IC GATE NAND 1CH 3-INP 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 0.7V ~ 2.75V
Current - Output High, Low: 8mA, 8mA
Number of Inputs: 3
Supplier Device Package: 6-XSON (1.45x1)
Max Propagation Delay @ V, Max CL: 3.2ns @ 2.5V, 5pF
Part Status: Active
Number of Circuits: 1
Current - Quiescent (Max): 600 nA
на замовлення 4653 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 4653+ | 5.69 грн |
| 74AXP2G34GMH |
|
Виробник: NXP USA Inc.
Description: IC BUFFER NON-INVERT 2.75V 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 0.7V ~ 2.75V
Number of Bits per Element: 1
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 6-XSON (1.45x1)
Part Status: Active
Description: IC BUFFER NON-INVERT 2.75V 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 0.7V ~ 2.75V
Number of Bits per Element: 1
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 6-XSON (1.45x1)
Part Status: Active
на замовлення 4784 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 3005+ | 7.11 грн |
| PSMN7R8-120PS127 |
|
Виробник: NXP USA Inc.
Description: NOW NEXPERIA PSMN7R8-120PS - POW
Description: NOW NEXPERIA PSMN7R8-120PS - POW
товар відсутній
| SPC5605BK0CLL4 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 768KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 7x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 77
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 768KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 7x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 77
DigiKey Programmable: Not Verified
товар відсутній
| SPC5602CACLL4 |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 28x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 79
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 28x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 79
DigiKey Programmable: Not Verified
товар відсутній
| BZX384-B16115 |
|
Виробник: NXP USA Inc.
Description: NOW NEXPERIA BZX384-B16 - ZENER
Packaging: Bulk
Part Status: Active
Description: NOW NEXPERIA BZX384-B16 - ZENER
Packaging: Bulk
Part Status: Active
товар відсутній
| MC7448VU1400ND |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC74XX 1.4GHZ 360FCCBGA
Packaging: Bulk
Package / Case: 360-CBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
Part Status: Active
Description: IC MPU MPC74XX 1.4GHZ 360FCCBGA
Packaging: Bulk
Package / Case: 360-CBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
Part Status: Active
товар відсутній
| SPC5603BK0VLH4R |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 384KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 28K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 12x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 45
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 384KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 28K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 12x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 45
DigiKey Programmable: Not Verified
товар відсутній
| LD6836TD/12P,125 |
|
Виробник: NXP USA Inc.
Description: IC REG LINEAR 1.2V 300MA 5TSOP
Description: IC REG LINEAR 1.2V 300MA 5TSOP
на замовлення 6670 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2885+ | 7.32 грн |
| NZX11C,133 |
|
Виробник: NXP USA Inc.
Description: DIODE ZENER 11V 500MW ALF2
Description: DIODE ZENER 11V 500MW ALF2
на замовлення 19880 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 19880+ | 1.46 грн |
| IMXRT600-AUD-EVK |
Виробник: NXP USA Inc.
Description: I.MX RT685 AUDIO EVAL KIT
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM® Cortex®-M33
Board Type: Evaluation Platform
Utilized IC / Part: i.MX RT685
Part Status: Active
Description: I.MX RT685 AUDIO EVAL KIT
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM® Cortex®-M33
Board Type: Evaluation Platform
Utilized IC / Part: i.MX RT685
Part Status: Active
товар відсутній
| 74ALVCH16827DGGS |
|
Виробник: NXP USA Inc.
Description: IC BUF NON-INVERT 3.6V 56TSSOP
Description: IC BUF NON-INVERT 3.6V 56TSSOP
на замовлення 2605 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 402+ | 54.87 грн |
| BGU7258115 |
|
Виробник: NXP USA Inc.
Description: IC AMP ISM 4.9GHZ-5.925GHZ 6DFN
Packaging: Bulk
Package / Case: 6-XFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 4.9GHz ~ 5.925GHz
RF Type: ISM
Voltage - Supply: 3V ~ 3.6V
Gain: 15dB
Current - Supply: 13mA
Noise Figure: 1.6dB
P1dB: -4dBm
Test Frequency: 5.5GHz
Supplier Device Package: DFN1616-6
Description: IC AMP ISM 4.9GHZ-5.925GHZ 6DFN
Packaging: Bulk
Package / Case: 6-XFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 4.9GHz ~ 5.925GHz
RF Type: ISM
Voltage - Supply: 3V ~ 3.6V
Gain: 15dB
Current - Supply: 13mA
Noise Figure: 1.6dB
P1dB: -4dBm
Test Frequency: 5.5GHz
Supplier Device Package: DFN1616-6
товар відсутній
| SPC5644BAMLU8 |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 147
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 147
DigiKey Programmable: Not Verified
товар відсутній
| S912XEQ384BCALR |
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 384KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 384KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
товар відсутній
| S912XEQ384BCAL |
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 384KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 384KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
товар відсутній
| S912XEG384AVAL |
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 384KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 384KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
товар відсутній
| SPC5644BAMLU8R |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 147
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 147
DigiKey Programmable: Not Verified
товар відсутній
| SPC5644BAMLU1R |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 147
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 147
DigiKey Programmable: Not Verified
товар відсутній
| MMDS36254HT1 |
|
Виробник: NXP USA Inc.
Description: ADAM - ADVANCED DOHERTY ALIGNMEN
Description: ADAM - ADVANCED DOHERTY ALIGNMEN
на замовлення 7000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 34+ | 1042.49 грн |
| 74ALVC16245DL,112-NXP |
Виробник: NXP USA Inc.
Description: IC TXRX NON-INVERT 3.6V 48SSOP
Description: IC TXRX NON-INVERT 3.6V 48SSOP
товар відсутній
| PEMB4,115 |
|
Виробник: NXP USA Inc.
Description: NOW NEXPERIA PEMB4 - SMALL SIGNA
Description: NOW NEXPERIA PEMB4 - SMALL SIGNA
на замовлення 56821 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 7340+ | 2.87 грн |
| PCAL6534EV-ARD |
|
Виробник: NXP USA Inc.
Description: 34-BIT GPIO ARDUINO SHIELD
Packaging: Bulk
Function: I/O Expansion
Type: Interface
Contents: Board(s)
Utilized IC / Part: PCAL6534
Platform: Arduino
Part Status: Active
Description: 34-BIT GPIO ARDUINO SHIELD
Packaging: Bulk
Function: I/O Expansion
Type: Interface
Contents: Board(s)
Utilized IC / Part: PCAL6534
Platform: Arduino
Part Status: Active
на замовлення 5 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 8686.45 грн |
| OM-A5000ARD |
Виробник: NXP USA Inc.
Description: A5000 ARDUINO DEV KIT
Packaging: Bulk
Function: Security
Type: Interface
Contents: Board(s)
Utilized IC / Part: A5000
Platform: Arduino
Description: A5000 ARDUINO DEV KIT
Packaging: Bulk
Function: Security
Type: Interface
Contents: Board(s)
Utilized IC / Part: A5000
Platform: Arduino
на замовлення 1 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 5317.55 грн |
| S9KEAZ128ACLHR |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
товар відсутній
| S912XEP100BMAGR |
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 1MB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 119
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 1MB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 119
DigiKey Programmable: Not Verified
товар відсутній
| S912ZVC64F0VLFR |
|
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12Z
Data Converters: A/D 10x10b; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 64KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12Z
Data Converters: A/D 10x10b; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
товар відсутній
| PTVS60VP1UTP,115 |
|
Виробник: NXP USA Inc.
Description: TVS DIODE 60VWM 96.8VC CFP5
Packaging: Bulk
Package / Case: SOD-128
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 185°C (TA)
Applications: Automotive
Current - Peak Pulse (10/1000µs): 6.2A
Voltage - Reverse Standoff (Typ): 60V
Supplier Device Package: SOD-128/CFP5
Unidirectional Channels: 1
Voltage - Breakdown (Min): 66.7V
Voltage - Clamping (Max) @ Ipp: 96.8V
Power - Peak Pulse: 600W
Power Line Protection: No
Part Status: Active
Description: TVS DIODE 60VWM 96.8VC CFP5
Packaging: Bulk
Package / Case: SOD-128
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 185°C (TA)
Applications: Automotive
Current - Peak Pulse (10/1000µs): 6.2A
Voltage - Reverse Standoff (Typ): 60V
Supplier Device Package: SOD-128/CFP5
Unidirectional Channels: 1
Voltage - Breakdown (Min): 66.7V
Voltage - Clamping (Max) @ Ipp: 96.8V
Power - Peak Pulse: 600W
Power Line Protection: No
Part Status: Active
товар відсутній
| PCA8553DTT/AJ |
|
Виробник: NXP USA Inc.
Description: IC DRVR 160 SEGMENT 56TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Display Type: LCD
Mounting Type: Surface Mount
Interface: I2C, SPI
Configuration: 160 Segment
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.8V ~ 5.5V
Digits or Characters: 10 Characters, 20 Characters, 160 Elements
Supplier Device Package: 56-TSSOP
Part Status: Obsolete
Current - Supply: 1.8 µA
Grade: Automotive
Qualification: AEC-Q100
Description: IC DRVR 160 SEGMENT 56TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Display Type: LCD
Mounting Type: Surface Mount
Interface: I2C, SPI
Configuration: 160 Segment
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.8V ~ 5.5V
Digits or Characters: 10 Characters, 20 Characters, 160 Elements
Supplier Device Package: 56-TSSOP
Part Status: Obsolete
Current - Supply: 1.8 µA
Grade: Automotive
Qualification: AEC-Q100
товар відсутній
| PCA8553DTT/AJ |
|
Виробник: NXP USA Inc.
Description: IC DRVR 160 SEGMENT 56TSSOP
Packaging: Cut Tape (CT)
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Display Type: LCD
Mounting Type: Surface Mount
Interface: I2C, SPI
Configuration: 160 Segment
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.8V ~ 5.5V
Digits or Characters: 10 Characters, 20 Characters, 160 Elements
Supplier Device Package: 56-TSSOP
Part Status: Obsolete
Current - Supply: 1.8 µA
Grade: Automotive
Qualification: AEC-Q100
Description: IC DRVR 160 SEGMENT 56TSSOP
Packaging: Cut Tape (CT)
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Display Type: LCD
Mounting Type: Surface Mount
Interface: I2C, SPI
Configuration: 160 Segment
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.8V ~ 5.5V
Digits or Characters: 10 Characters, 20 Characters, 160 Elements
Supplier Device Package: 56-TSSOP
Part Status: Obsolete
Current - Supply: 1.8 µA
Grade: Automotive
Qualification: AEC-Q100
товар відсутній
| LPC2290FBD144/01551 |
|
Виробник: NXP USA Inc.
Description: IC MCU 16/32BIT ROMLESS 144LQFP
Description: IC MCU 16/32BIT ROMLESS 144LQFP
товар відсутній
| MC34PF8100F3EPR2 |
|
Виробник: NXP USA Inc.
Description: POWER MANAGEMENT IC I.MX8 PRE-PR
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 56-HVQFN (8x8)
Description: POWER MANAGEMENT IC I.MX8 PRE-PR
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 56-HVQFN (8x8)
товар відсутній
| K32W041K |
|
Виробник: NXP USA Inc.
Description: K32W041 BLE/ZIGBEE SOC
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0, Thread, Zigbee®
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
Part Status: Active
DigiKey Programmable: Not Verified
Description: K32W041 BLE/ZIGBEE SOC
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0, Thread, Zigbee®
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 2450 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 542.1 грн |
| 10+ | 478.31 грн |
| 25+ | 434.83 грн |
| 80+ | 367.26 грн |
| 230+ | 336.66 грн |
| 440+ | 306.05 грн |