Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (35276) > Сторінка 375 з 588
Фото | Назва | Виробник | Інформація |
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OM11077598 | NXP USA Inc. |
Description: SOMDIMM-LPC2478 - MODULAR LPC247 Packaging: Bulk |
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LPC804UKAZ | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 20-UFBGA, WLCSP Mounting Type: Surface Mount Speed: 15MHz Program Memory Size: 32KB (32K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 12x12b; D/A 1x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Supplier Device Package: 20-WLCSP (2.5x1.84) Part Status: Active Number of I/O: 17 DigiKey Programmable: Not Verified |
на замовлення 3930 шт: термін постачання 21-31 дні (днів) |
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74HC4002D/C118 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Logic Type: NOR Gate Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Current - Output High, Low: 5.2mA, 5.2mA Number of Inputs: 4 Supplier Device Package: 14-SO Input Logic Level - High: 1.5V ~ 4.2V Input Logic Level - Low: 0.5V ~ 1.8V Max Propagation Delay @ V, Max CL: 17ns @ 6V, 50pF Part Status: Active Number of Circuits: 2 Current - Quiescent (Max): 2 µA |
на замовлення 55000 шт: термін постачання 21-31 дні (днів) |
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74HC4002PW/C118 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 14-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Logic Type: NOR Gate Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Current - Output High, Low: 5.2mA, 5.2mA Number of Inputs: 4 Supplier Device Package: 14-TSSOP Input Logic Level - High: 1.5V ~ 4.2V Input Logic Level - Low: 0.5V ~ 1.8V Max Propagation Delay @ V, Max CL: 17ns @ 6V, 50pF Part Status: Active Number of Circuits: 2 Current - Quiescent (Max): 2 µA |
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LPC2103FHN48H/6518 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 70MHz Program Memory Size: 32KB (32K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM7® Data Converters: A/D 8x10b Core Size: 16/32-Bit Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 48-HVQFN (6x6) Part Status: Active Number of I/O: 32 DigiKey Programmable: Not Verified |
на замовлення 11824 шт: термін постачання 21-31 дні (днів) |
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PDZ24B/ZLX | NXP USA Inc. |
Description: DIODE ZENER SOD323 Packaging: Tape & Reel (TR) Part Status: Active |
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UJA1076ATW/5V0WD,1 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad Mounting Type: Surface Mount Interface: SPI Serial Voltage - Supply: 4.5V ~ 28V Applications: Automotive Supplier Device Package: 32-HTSSOP Part Status: Active |
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UJA1076ATW/5V0WD,1 | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad Mounting Type: Surface Mount Interface: SPI Serial Voltage - Supply: 4.5V ~ 28V Applications: Automotive Supplier Device Package: 32-HTSSOP Part Status: Active |
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BGY68112 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: SOT-115J Mounting Type: Chassis Mount Applications: CATV Supplier Device Package: 7-SFM Module Number of Circuits: 1 Current - Supply: 135 mA |
на замовлення 93067 шт: термін постачання 21-31 дні (днів) |
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PMV250EPEA215 | NXP USA Inc. |
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74LVC1G34GW/AU125 | NXP USA Inc. |
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74LVC1G34GV-Q100125 | NXP USA Inc. |
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на замовлення 180000 шт: термін постачання 21-31 дні (днів) |
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74LVC1G34GX/S500125 | NXP USA Inc. |
Description: BUFFER, LVC/LCX/Z SERIES Packaging: Bulk |
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74LVC1G34GX/S505125 | NXP USA Inc. |
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на замовлення 9398 шт: термін постачання 21-31 дні (днів) |
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74LVC1G34GF000 | NXP USA Inc. |
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на замовлення 15000 шт: термін постачання 21-31 дні (днів) |
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MMRF1312HR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS 50V NI1230 Packaging: Cut Tape (CT) Package / Case: SOT-979A Mounting Type: Chassis Mount Frequency: 1.03GHz Configuration: Dual Power - Output: 1000W Gain: 19.6dB Technology: LDMOS Supplier Device Package: NI-1230-4H Part Status: Active Voltage - Rated: 112 V Voltage - Test: 50 V Current - Test: 100 mA |
на замовлення 38 шт: термін постачання 21-31 дні (днів) |
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MMRF1312HSR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS 50V NI1230 Packaging: Tape & Reel (TR) Package / Case: NI-1230-4S Mounting Type: Chassis Mount Frequency: 1.034GHz Configuration: Dual Power - Output: 1000W Gain: 19.6dB Technology: LDMOS Supplier Device Package: NI-1230-4S Part Status: Active Voltage - Rated: 112 V Voltage - Test: 50 V Current - Test: 100 mA |
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MMRF1312HSR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS 50V NI1230 Packaging: Cut Tape (CT) Package / Case: NI-1230-4S Mounting Type: Chassis Mount Frequency: 1.034GHz Configuration: Dual Power - Output: 1000W Gain: 19.6dB Technology: LDMOS Supplier Device Package: NI-1230-4S Part Status: Active Voltage - Rated: 112 V Voltage - Test: 50 V Current - Test: 100 mA |
на замовлення 23 шт: термін постачання 21-31 дні (днів) |
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OM13503UL | NXP USA Inc. |
![]() Packaging: Bulk Function: LCD Controller Type: Display Utilized IC / Part: PCA8539 Supplied Contents: Board(s) Embedded: Yes, MCU, 32-Bit Part Status: Obsolete |
на замовлення 14 шт: термін постачання 21-31 дні (днів) |
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MRFE6VS25GN-960 | NXP USA Inc. |
![]() Packaging: Bulk For Use With/Related Products: MRFE6VS25N Frequency: 960MHz ~ 1.215GHz Type: Transistor Supplied Contents: Board(s) |
на замовлення 4 шт: термін постачання 21-31 дні (днів) |
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BGU8051X | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 8-WFDFN Exposed Pad Mounting Type: Surface Mount Frequency: 300MHz ~ 1.5GHz RF Type: GSM, LTE, W-CDMA Voltage - Supply: 4.75V ~ 5.25V Gain: 18.3dB Current - Supply: 48mA Noise Figure: 0.43dB P1dB: 19dBm Test Frequency: 900MHz Supplier Device Package: 8-HWSON (2x2) Part Status: Active |
на замовлення 6000 шт: термін постачання 21-31 дні (днів) |
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BGU8051X | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 8-WFDFN Exposed Pad Mounting Type: Surface Mount Frequency: 300MHz ~ 1.5GHz RF Type: GSM, LTE, W-CDMA Voltage - Supply: 4.75V ~ 5.25V Gain: 18.3dB Current - Supply: 48mA Noise Figure: 0.43dB P1dB: 19dBm Test Frequency: 900MHz Supplier Device Package: 8-HWSON (2x2) Part Status: Active |
на замовлення 7403 шт: термін постачання 21-31 дні (днів) |
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MC56F83000-EVK | NXP USA Inc. |
![]() Packaging: Bulk Mounting Type: Fixed Type: DSP Contents: Board(s) Core Processor: 56800EX Board Type: Evaluation Platform Utilized IC / Part: MC56F83789 Part Status: Active |
на замовлення 3 шт: термін постачання 21-31 дні (днів) |
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MC34PF8101A0EP | NXP USA Inc. |
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на замовлення 260 шт: термін постачання 21-31 дні (днів) |
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SPC5777CDK3MMO4 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 516-BGA Mounting Type: Surface Mount Speed: 264MHz Program Memory Size: 8MB (8M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z7 Data Converters: A/D 16b Sigma-Delta, eQADC Core Size: 32-Bit Tri-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI Peripherals: DMA, LVD, POR, Zipwire Supplier Device Package: 516-MAPBGA (27x27) Part Status: Active DigiKey Programmable: Not Verified |
на замовлення 350 шт: термін постачання 21-31 дні (днів) |
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J3D081MXS/T1DM1E6D | NXP USA Inc. | Description: IC RF MODULE PLLCC8 |
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P60D016MX1C/9B070J | NXP USA Inc. | Description: IC SMART CARD CTLR PLLCC8 |
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P60D016MX1C/9B07AJ | NXP USA Inc. | Description: IC SMART CARD CTLR PLLCC8 |
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P60D016MX30/9B070J | NXP USA Inc. | Description: IC SMART CARD CTLR PLLCC8 |
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P60D016MX30/9B07AJ | NXP USA Inc. | Description: IC SMART CARD CTLR PLLCC8 |
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P60D016PX1C/9B060J | NXP USA Inc. | Description: IC SMART CARD CTLR PLLCC8 |
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P60D016PX1D/9B060J | NXP USA Inc. | Description: IC SMART CARD CTLR PLLCC8 |
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P60D016PX36/9B139J | NXP USA Inc. | Description: IC SMART CARD CTLR PLLCC8 |
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P60D024MX1C/9B071J | NXP USA Inc. | Description: IC SMART CARD CTLR PLLCC8 |
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P60D024MX1C/9B07AJ | NXP USA Inc. | Description: IC SMART CARD CTLR PLLCC8 |
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P60D024MX1C/9B950J | NXP USA Inc. | Description: IC SMART CARD CTLR PLLCC8 |
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P60D024MX1G/9B051J | NXP USA Inc. | Description: IC SMART CARD CTLR PLLCC8 |
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P60D024MX30/9B071J | NXP USA Inc. | Description: IC SMART CARD CTLR PLLCC8 |
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P60D024MX30/9B07AJ | NXP USA Inc. | Description: IC SMART CARD CTLR PLLCC8 |
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P60D024MX30/9B950J | NXP USA Inc. | Description: IC SMART CARD CTLR PLLCC8 |
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P60D024MX34/9B051J | NXP USA Inc. | Description: IC SMART CARD CTLR PLLCC8 |
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P60D024MX34/9B950J | NXP USA Inc. | Description: IC SMART CARD CTLR PLLCC8 |
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P60D024MX55/9B081J | NXP USA Inc. | Description: IC SMART CARD CTLR PLLCC8 |
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P60D024PX34/9B0204 | NXP USA Inc. | Description: IC SMART CARD CTLR PLLCC8 |
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P60D024PX34/9B9803 | NXP USA Inc. | Description: IC SMART CARD CTLR PLLCC8 |
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P60D040MX1C/9C100J | NXP USA Inc. | Description: IC SMART CARD CTLR PLLCC8 |
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P60D041PX30/9E38CJ | NXP USA Inc. | Description: IC SMART CARD CTLR PLLCC8 |
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P60D052MX54/9C080J | NXP USA Inc. | Description: IC SMART CARD CTLR PLLCC8 |
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N74F786D,602 | NXP USA Inc. |
![]() Packaging: Tube Package / Case: 16-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Number of Bits: 4 Logic Type: Bus Arbiter Operating Temperature: 0°C ~ 70°C Supply Voltage: 4.5V ~ 5.5V Supplier Device Package: 16-SO |
на замовлення 1495 шт: термін постачання 21-31 дні (днів) |
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MPC8548ECVJAQGD | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 783-BBGA, FCBGA Mounting Type: Surface Mount Speed: 1.0GHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e500 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 783-FCPBGA (29x29) Ethernet: 10/100/1000Mbps (4) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Signal Processing; SPE, Security; SEC RAM Controllers: DDR, DDR2, SDRAM Graphics Acceleration: No Security Features: Cryptography, Random Number Generator Part Status: Obsolete |
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PCA9673D,118 | NXP USA Inc. |
![]() Features: POR Packaging: Bulk Package / Case: 24-SOIC (0.295", 7.50mm Width) Output Type: Push-Pull Mounting Type: Surface Mount Interface: I²C Number of I/O: 16 Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.3V ~ 5.5V Clock Frequency: 1 MHz Interrupt Output: Yes Supplier Device Package: 24-SO Current - Output Source/Sink: 100µA, 25mA Part Status: Obsolete DigiKey Programmable: Not Verified |
на замовлення 1581 шт: термін постачання 21-31 дні (днів) |
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PCA9670PW112 | NXP USA Inc. |
![]() Packaging: Bulk Features: POR Package / Case: 16-TSSOP (0.173", 4.40mm Width) Output Type: Push-Pull Mounting Type: Surface Mount Interface: I²C Number of I/O: 8 Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.3V ~ 5.5V Clock Frequency: 1 MHz Interrupt Output: No Supplier Device Package: 16-TSSOP Current - Output Source/Sink: 100µA, 25mA Part Status: Active DigiKey Programmable: Not Verified |
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74HC240DB,118-NXP | NXP USA Inc. |
Description: IC BUFFER INVERT 6V 20SSOP Packaging: Bulk Package / Case: 20-SSOP (0.209", 5.30mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 2 Logic Type: Buffer, Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2V ~ 6V Number of Bits per Element: 4 Current - Output High, Low: 7.8mA, 7.8mA Supplier Device Package: 20-SSOP Part Status: Active |
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LPC4330FET180/3D551 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 180-TFBGA Mounting Type: Surface Mount Speed: 204MHz RAM Size: 264K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: ARM® Cortex®-M4/M0 Data Converters: A/D 8x10b; D/A 1x10b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT Supplier Device Package: 180-TFBGA (12x12) Part Status: Active Number of I/O: 118 DigiKey Programmable: Not Verified |
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P87C52SBBB,557 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 44-QFP Mounting Type: Surface Mount Speed: 16MHz Program Memory Size: 8KB (8K x 8) RAM Size: 256 x 8 Operating Temperature: 0°C ~ 70°C (TA) Oscillator Type: Internal Program Memory Type: OTP Core Processor: 8051 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: EBI/EMI, UART/USART Peripherals: POR Supplier Device Package: 44-PQFP (10x10) Number of I/O: 32 DigiKey Programmable: Not Verified |
на замовлення 280 шт: термін постачання 21-31 дні (днів) |
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J111,126 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: TO-226-3, TO-92-3 (TO-226AA) Formed Leads Mounting Type: Through Hole Operating Temperature: 150°C (TJ) FET Type: N-Channel Input Capacitance (Ciss) (Max) @ Vds: 6pF @ 10V (VGS) Voltage - Breakdown (V(BR)GSS): 40 V Supplier Device Package: TO-92-3 Part Status: Obsolete Drain to Source Voltage (Vdss): 40 V Power - Max: 400 mW Resistance - RDS(On): 30 Ohms Voltage - Cutoff (VGS off) @ Id: 10 V @ 1 µA Current - Drain (Idss) @ Vds (Vgs=0): 20 mA @ 15 V |
на замовлення 6000 шт: термін постачання 21-31 дні (днів) |
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74HC7541D/S400118 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 20-SOIC (0.295", 7.50mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 1 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2V ~ 6V Input Type: Schmitt Trigger Number of Bits per Element: 8 Current - Output High, Low: 7.8mA, 7.8mA Supplier Device Package: 20-SO |
на замовлення 1880 шт: термін постачання 21-31 дні (днів) |
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74HC7540D/C4118 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 20-SOIC (0.295", 7.50mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 1 Logic Type: Buffer, Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2V ~ 6V Number of Bits per Element: 8 Current - Output High, Low: 7.8mA, 7.8mA Supplier Device Package: 20-SO |
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S912XDP512J1CAL | NXP USA Inc. |
Description: IC MCU 16BIT 512KB FLASH 112LQFP Packaging: Tray Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 512KB (512K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 8x10b, 16x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V Connectivity: CANbus, I²C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 112-LQFP (20x20) Number of I/O: 91 DigiKey Programmable: Not Verified |
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MM912I637AV1EP-NXP | NXP USA Inc. |
![]() Packaging: Bulk DigiKey Programmable: Not Verified Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Interface: LIN, PWM, SCI, SPI RAM Size: 6K x 8 Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 2.25V ~ 5.25V Controller Series: HCS12 Program Memory Type: FLASH (48kB) Core Processor: HCS12 Supplier Device Package: 48-QFN-EP (7x7) Grade: Automotive Number of I/O: 14 |
на замовлення 438 шт: термін постачання 21-31 дні (днів) |
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OM11077598 |
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LPC804UKAZ |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 20WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 20-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-WLCSP (2.5x1.84)
Part Status: Active
Number of I/O: 17
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 20WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 20-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-WLCSP (2.5x1.84)
Part Status: Active
Number of I/O: 17
DigiKey Programmable: Not Verified
на замовлення 3930 шт:
термін постачання 21-31 дні (днів)74HC4002D/C118 |
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Виробник: NXP USA Inc.
Description: IC GATE NOR 2CH 4-INP 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: NOR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 4
Supplier Device Package: 14-SO
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 17ns @ 6V, 50pF
Part Status: Active
Number of Circuits: 2
Current - Quiescent (Max): 2 µA
Description: IC GATE NOR 2CH 4-INP 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: NOR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 4
Supplier Device Package: 14-SO
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 17ns @ 6V, 50pF
Part Status: Active
Number of Circuits: 2
Current - Quiescent (Max): 2 µA
на замовлення 55000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1480+ | 14.39 грн |
74HC4002PW/C118 |
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Виробник: NXP USA Inc.
Description: IC GATE NOR 2CH 4-INP 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: NOR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 4
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 17ns @ 6V, 50pF
Part Status: Active
Number of Circuits: 2
Current - Quiescent (Max): 2 µA
Description: IC GATE NOR 2CH 4-INP 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: NOR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 4
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 17ns @ 6V, 50pF
Part Status: Active
Number of Circuits: 2
Current - Quiescent (Max): 2 µA
товар відсутній
LPC2103FHN48H/6518 |
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Виробник: NXP USA Inc.
Description: IC MCU 16/32B 32KB FLASH 48HVQFN
Packaging: Bulk
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 70MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-HVQFN (6x6)
Part Status: Active
Number of I/O: 32
DigiKey Programmable: Not Verified
Description: IC MCU 16/32B 32KB FLASH 48HVQFN
Packaging: Bulk
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 70MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-HVQFN (6x6)
Part Status: Active
Number of I/O: 32
DigiKey Programmable: Not Verified
на замовлення 11824 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
6+ | 4402.91 грн |
PDZ24B/ZLX |
товар відсутній
UJA1076ATW/5V0WD,1 |
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Виробник: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 32HTSSOP
Packaging: Tape & Reel (TR)
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 4.5V ~ 28V
Applications: Automotive
Supplier Device Package: 32-HTSSOP
Part Status: Active
Description: IC INTFACE SPECIALIZED 32HTSSOP
Packaging: Tape & Reel (TR)
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 4.5V ~ 28V
Applications: Automotive
Supplier Device Package: 32-HTSSOP
Part Status: Active
товар відсутній
UJA1076ATW/5V0WD,1 |
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Виробник: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 32HTSSOP
Packaging: Cut Tape (CT)
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 4.5V ~ 28V
Applications: Automotive
Supplier Device Package: 32-HTSSOP
Part Status: Active
Description: IC INTFACE SPECIALIZED 32HTSSOP
Packaging: Cut Tape (CT)
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 4.5V ~ 28V
Applications: Automotive
Supplier Device Package: 32-HTSSOP
Part Status: Active
товар відсутній
BGY68112 |
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Виробник: NXP USA Inc.
Description: 75 MHZ, 30 DB GAIN REVERSE AMPLI
Packaging: Bulk
Package / Case: SOT-115J
Mounting Type: Chassis Mount
Applications: CATV
Supplier Device Package: 7-SFM Module
Number of Circuits: 1
Current - Supply: 135 mA
Description: 75 MHZ, 30 DB GAIN REVERSE AMPLI
Packaging: Bulk
Package / Case: SOT-115J
Mounting Type: Chassis Mount
Applications: CATV
Supplier Device Package: 7-SFM Module
Number of Circuits: 1
Current - Supply: 135 mA
на замовлення 93067 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
17+ | 1328.43 грн |
74LVC1G34GW/AU125 |
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товар відсутній
74LVC1G34GV-Q100125 |
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на замовлення 180000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
3297+ | 6.3 грн |
74LVC1G34GX/S500125 |
товар відсутній
74LVC1G34GX/S505125 |
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на замовлення 9398 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
3806+ | 5.6 грн |
74LVC1G34GF000 |
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на замовлення 15000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
701+ | 30.11 грн |
MMRF1312HR5 |
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Cut Tape (CT)
Package / Case: SOT-979A
Mounting Type: Chassis Mount
Frequency: 1.03GHz
Configuration: Dual
Power - Output: 1000W
Gain: 19.6dB
Technology: LDMOS
Supplier Device Package: NI-1230-4H
Part Status: Active
Voltage - Rated: 112 V
Voltage - Test: 50 V
Current - Test: 100 mA
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Cut Tape (CT)
Package / Case: SOT-979A
Mounting Type: Chassis Mount
Frequency: 1.03GHz
Configuration: Dual
Power - Output: 1000W
Gain: 19.6dB
Technology: LDMOS
Supplier Device Package: NI-1230-4H
Part Status: Active
Voltage - Rated: 112 V
Voltage - Test: 50 V
Current - Test: 100 mA
на замовлення 38 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 41011.46 грн |
10+ | 38304.91 грн |
MMRF1312HSR5 |
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230-4S
Mounting Type: Chassis Mount
Frequency: 1.034GHz
Configuration: Dual
Power - Output: 1000W
Gain: 19.6dB
Technology: LDMOS
Supplier Device Package: NI-1230-4S
Part Status: Active
Voltage - Rated: 112 V
Voltage - Test: 50 V
Current - Test: 100 mA
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230-4S
Mounting Type: Chassis Mount
Frequency: 1.034GHz
Configuration: Dual
Power - Output: 1000W
Gain: 19.6dB
Technology: LDMOS
Supplier Device Package: NI-1230-4S
Part Status: Active
Voltage - Rated: 112 V
Voltage - Test: 50 V
Current - Test: 100 mA
товар відсутній
MMRF1312HSR5 |
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Cut Tape (CT)
Package / Case: NI-1230-4S
Mounting Type: Chassis Mount
Frequency: 1.034GHz
Configuration: Dual
Power - Output: 1000W
Gain: 19.6dB
Technology: LDMOS
Supplier Device Package: NI-1230-4S
Part Status: Active
Voltage - Rated: 112 V
Voltage - Test: 50 V
Current - Test: 100 mA
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Cut Tape (CT)
Package / Case: NI-1230-4S
Mounting Type: Chassis Mount
Frequency: 1.034GHz
Configuration: Dual
Power - Output: 1000W
Gain: 19.6dB
Technology: LDMOS
Supplier Device Package: NI-1230-4S
Part Status: Active
Voltage - Rated: 112 V
Voltage - Test: 50 V
Current - Test: 100 mA
на замовлення 23 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 41089.01 грн |
10+ | 38377.03 грн |
OM13503UL |
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Виробник: NXP USA Inc.
Description: PCA8539 LCD DEMO BOARD
Packaging: Bulk
Function: LCD Controller
Type: Display
Utilized IC / Part: PCA8539
Supplied Contents: Board(s)
Embedded: Yes, MCU, 32-Bit
Part Status: Obsolete
Description: PCA8539 LCD DEMO BOARD
Packaging: Bulk
Function: LCD Controller
Type: Display
Utilized IC / Part: PCA8539
Supplied Contents: Board(s)
Embedded: Yes, MCU, 32-Bit
Part Status: Obsolete
на замовлення 14 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 5879.42 грн |
MRFE6VS25GN-960 |
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Виробник: NXP USA Inc.
Description: MRFE6VS25GN REF BRD 1215MHZ 30W
Packaging: Bulk
For Use With/Related Products: MRFE6VS25N
Frequency: 960MHz ~ 1.215GHz
Type: Transistor
Supplied Contents: Board(s)
Description: MRFE6VS25GN REF BRD 1215MHZ 30W
Packaging: Bulk
For Use With/Related Products: MRFE6VS25N
Frequency: 960MHz ~ 1.215GHz
Type: Transistor
Supplied Contents: Board(s)
на замовлення 4 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 64068.38 грн |
BGU8051X |
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Виробник: NXP USA Inc.
Description: IC AMP GSM 300MHZ-1.5GHZ 8HWSON
Packaging: Tape & Reel (TR)
Package / Case: 8-WFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 300MHz ~ 1.5GHz
RF Type: GSM, LTE, W-CDMA
Voltage - Supply: 4.75V ~ 5.25V
Gain: 18.3dB
Current - Supply: 48mA
Noise Figure: 0.43dB
P1dB: 19dBm
Test Frequency: 900MHz
Supplier Device Package: 8-HWSON (2x2)
Part Status: Active
Description: IC AMP GSM 300MHZ-1.5GHZ 8HWSON
Packaging: Tape & Reel (TR)
Package / Case: 8-WFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 300MHz ~ 1.5GHz
RF Type: GSM, LTE, W-CDMA
Voltage - Supply: 4.75V ~ 5.25V
Gain: 18.3dB
Current - Supply: 48mA
Noise Figure: 0.43dB
P1dB: 19dBm
Test Frequency: 900MHz
Supplier Device Package: 8-HWSON (2x2)
Part Status: Active
на замовлення 6000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
2000+ | 104.98 грн |
6000+ | 96.92 грн |
BGU8051X |
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Виробник: NXP USA Inc.
Description: IC AMP GSM 300MHZ-1.5GHZ 8HWSON
Packaging: Cut Tape (CT)
Package / Case: 8-WFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 300MHz ~ 1.5GHz
RF Type: GSM, LTE, W-CDMA
Voltage - Supply: 4.75V ~ 5.25V
Gain: 18.3dB
Current - Supply: 48mA
Noise Figure: 0.43dB
P1dB: 19dBm
Test Frequency: 900MHz
Supplier Device Package: 8-HWSON (2x2)
Part Status: Active
Description: IC AMP GSM 300MHZ-1.5GHZ 8HWSON
Packaging: Cut Tape (CT)
Package / Case: 8-WFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 300MHz ~ 1.5GHz
RF Type: GSM, LTE, W-CDMA
Voltage - Supply: 4.75V ~ 5.25V
Gain: 18.3dB
Current - Supply: 48mA
Noise Figure: 0.43dB
P1dB: 19dBm
Test Frequency: 900MHz
Supplier Device Package: 8-HWSON (2x2)
Part Status: Active
на замовлення 7403 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
2+ | 221.25 грн |
10+ | 190.06 грн |
25+ | 171.03 грн |
100+ | 146.23 грн |
250+ | 131.97 грн |
500+ | 118.42 грн |
1000+ | 98.23 грн |
MC56F83000-EVK |
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Виробник: NXP USA Inc.
Description: MC56F83XXX EVK
Packaging: Bulk
Mounting Type: Fixed
Type: DSP
Contents: Board(s)
Core Processor: 56800EX
Board Type: Evaluation Platform
Utilized IC / Part: MC56F83789
Part Status: Active
Description: MC56F83XXX EVK
Packaging: Bulk
Mounting Type: Fixed
Type: DSP
Contents: Board(s)
Core Processor: 56800EX
Board Type: Evaluation Platform
Utilized IC / Part: MC56F83789
Part Status: Active
на замовлення 3 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 3758.93 грн |
MC34PF8101A0EP |
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Виробник: NXP USA Inc.
Description: IC POWER MANAGEMENT
Description: IC POWER MANAGEMENT
на замовлення 260 шт:
термін постачання 21-31 дні (днів)SPC5777CDK3MMO4 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 8MB FLASH 516MAPBGA
Packaging: Tray
Package / Case: 516-BGA
Mounting Type: Surface Mount
Speed: 264MHz
Program Memory Size: 8MB (8M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z7
Data Converters: A/D 16b Sigma-Delta, eQADC
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals: DMA, LVD, POR, Zipwire
Supplier Device Package: 516-MAPBGA (27x27)
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 8MB FLASH 516MAPBGA
Packaging: Tray
Package / Case: 516-BGA
Mounting Type: Surface Mount
Speed: 264MHz
Program Memory Size: 8MB (8M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z7
Data Converters: A/D 16b Sigma-Delta, eQADC
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals: DMA, LVD, POR, Zipwire
Supplier Device Package: 516-MAPBGA (27x27)
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 350 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 5056.01 грн |
10+ | 3977 грн |
N74F786D,602 |
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Виробник: NXP USA Inc.
Description: IC ASYNC BUS ARBITER 16-SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Bits: 4
Logic Type: Bus Arbiter
Operating Temperature: 0°C ~ 70°C
Supply Voltage: 4.5V ~ 5.5V
Supplier Device Package: 16-SO
Description: IC ASYNC BUS ARBITER 16-SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Bits: 4
Logic Type: Bus Arbiter
Operating Temperature: 0°C ~ 70°C
Supply Voltage: 4.5V ~ 5.5V
Supplier Device Package: 16-SO
на замовлення 1495 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
118+ | 182.24 грн |
MPC8548ECVJAQGD |
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Виробник: NXP USA Inc.
Description: IC MPU MPC85XX 1.0GHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Part Status: Obsolete
Description: IC MPU MPC85XX 1.0GHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Part Status: Obsolete
товар відсутній
PCA9673D,118 |
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Виробник: NXP USA Inc.
Description: IC XPNDR 1MHZ I2C 24SO
Features: POR
Packaging: Bulk
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I²C
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 1 MHz
Interrupt Output: Yes
Supplier Device Package: 24-SO
Current - Output Source/Sink: 100µA, 25mA
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: IC XPNDR 1MHZ I2C 24SO
Features: POR
Packaging: Bulk
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I²C
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 1 MHz
Interrupt Output: Yes
Supplier Device Package: 24-SO
Current - Output Source/Sink: 100µA, 25mA
Part Status: Obsolete
DigiKey Programmable: Not Verified
на замовлення 1581 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
254+ | 89.72 грн |
PCA9670PW112 |
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Виробник: NXP USA Inc.
Description: IC XPNDR 1MHZ I2C 16TSSOP
Packaging: Bulk
Features: POR
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I²C
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 1 MHz
Interrupt Output: No
Supplier Device Package: 16-TSSOP
Current - Output Source/Sink: 100µA, 25mA
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC XPNDR 1MHZ I2C 16TSSOP
Packaging: Bulk
Features: POR
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I²C
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 1 MHz
Interrupt Output: No
Supplier Device Package: 16-TSSOP
Current - Output Source/Sink: 100µA, 25mA
Part Status: Active
DigiKey Programmable: Not Verified
товар відсутній
74HC240DB,118-NXP |
Виробник: NXP USA Inc.
Description: IC BUFFER INVERT 6V 20SSOP
Packaging: Bulk
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 4
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 20-SSOP
Part Status: Active
Description: IC BUFFER INVERT 6V 20SSOP
Packaging: Bulk
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 4
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 20-SSOP
Part Status: Active
товар відсутній
LPC4330FET180/3D551 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 180TFBGA
Packaging: Bulk
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 264K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
Part Status: Active
Number of I/O: 118
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 180TFBGA
Packaging: Bulk
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 264K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
Part Status: Active
Number of I/O: 118
DigiKey Programmable: Not Verified
товар відсутній
P87C52SBBB,557 |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB OTP 44PQFP
Packaging: Tray
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: EBI/EMI, UART/USART
Peripherals: POR
Supplier Device Package: 44-PQFP (10x10)
Number of I/O: 32
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 8KB OTP 44PQFP
Packaging: Tray
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: EBI/EMI, UART/USART
Peripherals: POR
Supplier Device Package: 44-PQFP (10x10)
Number of I/O: 32
DigiKey Programmable: Not Verified
на замовлення 280 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
42+ | 501.85 грн |
J111,126 |
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Виробник: NXP USA Inc.
Description: JFET N-CH 40V TO92-3
Packaging: Bulk
Package / Case: TO-226-3, TO-92-3 (TO-226AA) Formed Leads
Mounting Type: Through Hole
Operating Temperature: 150°C (TJ)
FET Type: N-Channel
Input Capacitance (Ciss) (Max) @ Vds: 6pF @ 10V (VGS)
Voltage - Breakdown (V(BR)GSS): 40 V
Supplier Device Package: TO-92-3
Part Status: Obsolete
Drain to Source Voltage (Vdss): 40 V
Power - Max: 400 mW
Resistance - RDS(On): 30 Ohms
Voltage - Cutoff (VGS off) @ Id: 10 V @ 1 µA
Current - Drain (Idss) @ Vds (Vgs=0): 20 mA @ 15 V
Description: JFET N-CH 40V TO92-3
Packaging: Bulk
Package / Case: TO-226-3, TO-92-3 (TO-226AA) Formed Leads
Mounting Type: Through Hole
Operating Temperature: 150°C (TJ)
FET Type: N-Channel
Input Capacitance (Ciss) (Max) @ Vds: 6pF @ 10V (VGS)
Voltage - Breakdown (V(BR)GSS): 40 V
Supplier Device Package: TO-92-3
Part Status: Obsolete
Drain to Source Voltage (Vdss): 40 V
Power - Max: 400 mW
Resistance - RDS(On): 30 Ohms
Voltage - Cutoff (VGS off) @ Id: 10 V @ 1 µA
Current - Drain (Idss) @ Vds (Vgs=0): 20 mA @ 15 V
на замовлення 6000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1066+ | 19.59 грн |
74HC7541D/S400118 |
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Виробник: NXP USA Inc.
Description: IC BUFFER NON-INVERT 6V 20SO
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Input Type: Schmitt Trigger
Number of Bits per Element: 8
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 20-SO
Description: IC BUFFER NON-INVERT 6V 20SO
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Input Type: Schmitt Trigger
Number of Bits per Element: 8
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 20-SO
на замовлення 1880 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
476+ | 43.67 грн |
74HC7540D/C4118 |
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Виробник: NXP USA Inc.
Description: IC BUFFER INVERT 6V 20SO
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 8
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 20-SO
Description: IC BUFFER INVERT 6V 20SO
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 8
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 20-SO
товар відсутній
S912XDP512J1CAL |
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b, 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, I²C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 512KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b, 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, I²C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
товар відсутній
MM912I637AV1EP-NXP |
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Виробник: NXP USA Inc.
Description: BATTERY SENSOR, LIN, 96KB FLASH,
Packaging: Bulk
DigiKey Programmable: Not Verified
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: LIN, PWM, SCI, SPI
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.25V ~ 5.25V
Controller Series: HCS12
Program Memory Type: FLASH (48kB)
Core Processor: HCS12
Supplier Device Package: 48-QFN-EP (7x7)
Grade: Automotive
Number of I/O: 14
Description: BATTERY SENSOR, LIN, 96KB FLASH,
Packaging: Bulk
DigiKey Programmable: Not Verified
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: LIN, PWM, SCI, SPI
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.25V ~ 5.25V
Controller Series: HCS12
Program Memory Type: FLASH (48kB)
Core Processor: HCS12
Supplier Device Package: 48-QFN-EP (7x7)
Grade: Automotive
Number of I/O: 14
на замовлення 438 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
51+ | 408.28 грн |