Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (35529) > Сторінка 367 з 593
| Фото | Назва | Виробник | Інформація |
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LPC2364FET100,518 | NXP USA Inc. |
 Description: IC MCU 16/32BIT 128KB 100TFBGAPackaging: Cut Tape (CT) Package / Case: 100-TFBGA Mounting Type: Surface Mount Speed: 72MHz Program Memory Size: 128KB (128K x 8) RAM Size: 34K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM7® Data Converters: A/D 6x10b; D/A 1x10b Core Size: 16/32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: CANbus, Ethernet, I²C, Microwire, SPI, SSI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT Supplier Device Package: 100-TFBGA (9x9) Part Status: Not For New Designs Number of I/O: 70 DigiKey Programmable: Not Verified |
товару немає в наявності |
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PDTD113ZQA147 | NXP USA Inc. |
Description: TRANS PREBIAS NPN 50V 500MA Packaging: Bulk Package / Case: 3-XDFN Exposed Pad Mounting Type: Surface Mount Transistor Type: NPN - Pre-Biased Vce Saturation (Max) @ Ib, Ic: 100mV @ 2.5mA, 50mA Current - Collector Cutoff (Max): 500nA DC Current Gain (hFE) (Min) @ Ic, Vce: 70 @ 50mA, 5V Supplier Device Package: DFN1010D-3 Grade: Automotive Part Status: Active Current - Collector (Ic) (Max): 500 mA Voltage - Collector Emitter Breakdown (Max): 50 V Power - Max: 940 mW Frequency - Transition: 210 MHz Resistor - Base (R1): 1 kOhms Resistor - Emitter Base (R2): 10 kOhms Qualification: AEC-Q101 |
товару немає в наявності |
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| PDTD113ZU115 | NXP USA Inc. |
Description: 500 MA, 50 V NPN RESISTOR-EQUIPP Packaging: Bulk Part Status: Active |
товару немає в наявності |
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PDTD143XT215 | NXP USA Inc. |
Description: 500 MA, 50 V NPN RESISTOR-EQUIPP Packaging: Bulk |
товару немає в наявності |
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| PDTD123YU115 | NXP USA Inc. | Description: 0.5A, 50V, NPN, SOT323 |
товару немає в наявності |
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ASL5008FHV/0Y | NXP USA Inc. |
Description: ASL5008FHV/0 |
товару немає в наявності |
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| 74LVC16245AEV,518 | NXP USA Inc. |
Description: IC TXRX NON-INVERT 3.6V 56VFBGA Packaging: Bulk Package / Case: 56-VFBGA Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 2 Logic Type: Transceiver, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1.2V ~ 3.6V Number of Bits per Element: 8 Current - Output High, Low: 24mA, 24mA Supplier Device Package: 56-VFBGA (4.5x7) Part Status: Active |
на замовлення 6865 шт: термін постачання 21-31 дні (днів) |
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| TJA1027TK/20/1,118 | NXP USA Inc. | Description: LIN 2.2A/SAE J2602 TRANSCEIVER |
товару немає в наявності |
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| TJA1027TK/20/1 | NXP USA Inc. | Description: LIN 2.2A/SAE J2602 TRANSCEIVER |
товару немає в наявності |
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| OM13062UL,598 | NXP USA Inc. |
Description: LPCXPRESSO LPC11U37H EVAL BRD Packaging: Bulk Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: ARM® Cortex®-M0 Utilized IC / Part: LPC11U37H Platform: LPCXpresso™ |
товару немає в наявності |
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OM13022598 | NXP USA Inc. |
Description: IAR KICKSTART LPC11U24 EVAL BRD Packaging: Bulk Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: ARM® Cortex®-M0 Utilized IC / Part: LPC11U24 Platform: IAR KickStart |
товару немає в наявності |
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| MIMX8MD6DVAJZAA557 | NXP USA Inc. |
Description: 8M QUAD APPLICATIONS PROCESSOR |
товару немає в наявності |
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MIMX8MQ6DVAJZAA | NXP USA Inc. |
Description: IC MPU I.MX8MQ 1.5GHZ 621FCPBGA Packaging: Tray Package / Case: 621-FBGA, FCBGA Mounting Type: Surface Mount Speed: 1.5GHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: ARM® Cortex®-A53 Supplier Device Package: 621-FCPBGA (17x17) Ethernet: GbE USB: USB 3.0 (2) Number of Cores/Bus Width: 4 Core, 64-Bit Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC Part Status: Active |
на замовлення 2055 шт: термін постачання 21-31 дні (днів) |
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| MIMX8MQ6DVAJZAA,557 | NXP USA Inc. |
Description: I.MX 8M: ARM CORTEX A53 QUAD COR Packaging: Tray Part Status: Active |
товару немає в наявності |
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8MIC-RPI-MX8 | NXP USA Inc. |
Description: 8 MICROPHONE BOARD FOR VOICE Packaging: Bulk Function: Microphone Type: Audio Contents: Board(s) Part Status: Active |
на замовлення 8 шт: термін постачання 21-31 дні (днів) |
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| 74LVC1T45U/C025 | NXP USA Inc. |
Description: BUS TRANSCVR, LVC/LCX/Z SERIES Packaging: Bulk Output Type: Tri-State Operating Temperature: -40°C ~ 125°C (TA) Data Rate: 420Mbps Channel Type: Bidirectional Output Signal: CMOS, LVTTL Translator Type: Voltage Level Channels per Circuit: 1 Voltage - VCCA: 1.2 V ~ 5.5 V Voltage - VCCB: 1.2 V ~ 5.5 V Part Status: Active Number of Circuits: 1 |
товару немає в наявності |
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LPC2420FBD208K | NXP USA Inc. |
Description: IC MCU 16/32BIT ROMLESS 208LQFP Packaging: Tray Package / Case: 208-LQFP Mounting Type: Surface Mount Speed: 72MHz RAM Size: 82K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: ARM7® Data Converters: A/D 8x10b; D/A 1x10b Core Size: 16/32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: EBI/EMI, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Supplier Device Package: 208-LQFP (28x28) Part Status: Active Number of I/O: 160 DigiKey Programmable: Not Verified |
на замовлення 340 шт: термін постачання 21-31 дні (днів) |
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74HC253DB,112-NXP | NXP USA Inc. |
Description: IC DATA SEL/MULTPL 2X4:1 16SSOP Packaging: Tube Package / Case: 16-SSOP (0.209", 5.30mm Width) Mounting Type: Surface Mount Circuit: 2 x 4:1 Type: Data Selector/Multiplexer Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2V ~ 6V Independent Circuits: 2 Current - Output High, Low: 7.8mA, 7.8mA Voltage Supply Source: Single Supply Supplier Device Package: 16-SSOP Part Status: Active |
товару немає в наявності |
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| JN5179-001-M10Z | NXP USA Inc. |
Description: RF TXRX MOD 802.15.4 TH SMD Packaging: Bulk Package / Case: Module Sensitivity: -96dBm Mounting Type: Surface Mount Frequency: 2.4GHz Operating Temperature: -40°C ~ 85°C Voltage - Supply: 3.6V Power - Output: 8.5dBm Protocol: Zigbee® Current - Receiving: 16.4mA Current - Transmitting: 114mA Antenna Type: Integrated, Trace RF Family/Standard: 802.15.4 Serial Interfaces: I2C, SPI, UART Part Status: Obsolete DigiKey Programmable: Not Verified |
на замовлення 3965 шт: термін постачання 21-31 дні (днів) |
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MCIMX6Q7CVT08AE | NXP USA Inc. |
Description: IC MPU I.MX6Q 800MHZ 624FCBGA Packaging: Tray Package / Case: 624-FBGA, FCBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 624-FCBGA (21x21) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (4) Number of Cores/Bus Width: 4 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection SATA: SATA 3Gbps (1) Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART Part Status: Active |
на замовлення 70 шт: термін постачання 21-31 дні (днів) |
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FRDM-K32L2B3 | NXP USA Inc. |
Description: FREEDOM EVAL BOARD K32L2B3 Packaging: Bulk Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s), Cable(s) Core Processor: ARM® Cortex®-M0+ Utilized IC / Part: K32 L2B Platform: Freedom |
на замовлення 10 шт: термін постачання 21-31 дні (днів) |
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S08PB16-EVK | NXP USA Inc. |
Description: S08PLS EVAL KIT Packaging: Box Mounting Type: Fixed Type: MCU 8-Bit Contents: Board(s) Core Processor: HCS08 Board Type: Evaluation Platform Utilized IC / Part: MC9S08PB16 Part Status: Active |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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MPC5748G-GW-RDB | NXP USA Inc. |
Description: MPC5748G ETHERNET GATEWAY Packaging: Bulk Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: e200 Board Type: Evaluation Platform Utilized IC / Part: MPC5748G Part Status: Active |
на замовлення 12 шт: термін постачання 21-31 дні (днів) |
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BC859CW/ZL115 | NXP USA Inc. |
Description: SMALL SIGNAL BIPOLAR TRANSISTOR Packaging: Bulk Part Status: Active |
на замовлення 280999 шт: термін постачання 21-31 дні (днів) |
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MKV46F128VLL16 | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 100LQFP |
товару немає в наявності |
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A2I20D020GNR1 | NXP USA Inc. |
Description: IC AMP W-CDMA 1.4-2.2GHZ TO270WB Packaging: Tape & Reel (TR) Package / Case: TO-270-17 Variant, Flat Leads Mounting Type: Surface Mount Frequency: 1.4GHz ~ 2.2GHz RF Type: W-CDMA Voltage - Supply: 28V Gain: 35dB Test Frequency: 2.2GHz Supplier Device Package: TO-270WB-17 |
товару немає в наявності |
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SPC5645SF1VLUR | NXP USA Inc. |
Description: IC MCU 32BIT 2MB FLASH 176LQFP Packaging: Tape & Reel (TR) Package / Case: 176-LQFP Mounting Type: Surface Mount Speed: 125MHz Program Memory Size: 2MB (2M x 8) RAM Size: 1.064M x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z4d Data Converters: A/D 16x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 176-LQFP (24x24) Part Status: Active Number of I/O: 128 DigiKey Programmable: Not Verified |
товару немає в наявності |
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LS1043AXE7KQA | NXP USA Inc. |
Description: QORIQ 4XCPU 64-BIT ARM ARCH 1. |
товару немає в наявності |
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| TDA9989ET/C1,518 | NXP USA Inc. |
Description: IC VIDEO TRANSMITTER 64TFBGA Packaging: Bulk Package / Case: 64-TFBGA Mounting Type: Surface Mount Function: Transmitter Voltage - Supply: 1.1V ~ 1.3V, 1.7V ~ 1.9V Applications: Consumer Video Standards: CEA-861B, DVI 1.0, HMDI 1.3a, ITU656 Supplier Device Package: 64-TFBGA (4.5x4.5) Control Interface: I2C |
на замовлення 56831 шт: термін постачання 21-31 дні (днів) |
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BF821/DG/B2215 | NXP USA Inc. |
Description: SMALL SIGNAL BIPOLAR TRANSISTOR Packaging: Bulk Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Transistor Type: PNP Operating Temperature: 150°C (TJ) Vce Saturation (Max) @ Ib, Ic: 800mV @ 5mA, 30mA Current - Collector Cutoff (Max): 10nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 50 @ 25mA, 20V Frequency - Transition: 60MHz Supplier Device Package: SOT-23-3 (TO-236) Grade: Automotive Part Status: Active Current - Collector (Ic) (Max): 50 mA Voltage - Collector Emitter Breakdown (Max): 300 V Power - Max: 250 mW Qualification: AEC-Q101 |
товару немає в наявності |
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PCA9450CHNY | NXP USA Inc. |
Description: PMIC I.MX 8M MINI/NANO/PLUS HVQF Packaging: Tape & Reel (TR) Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C Voltage - Supply: 2.85V ~ 5.5V Applications: General Purpose Current - Supply: 20µA Supplier Device Package: 56-HVQFN (7x7) |
на замовлення 14000 шт: термін постачання 21-31 дні (днів) |
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PCA9450CHNY | NXP USA Inc. |
Description: PMIC I.MX 8M MINI/NANO/PLUS HVQF Packaging: Cut Tape (CT) Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C Voltage - Supply: 2.85V ~ 5.5V Applications: General Purpose Current - Supply: 20µA Supplier Device Package: 56-HVQFN (7x7) |
на замовлення 16065 шт: термін постачання 21-31 дні (днів) |
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LPC1820FBD144,551 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 144LQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 180MHz RAM Size: 168K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: ARM® Cortex®-M3 Data Converters: A/D 8x10b; D/A 1x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V Connectivity: CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Part Status: Discontinued at Digi-Key Number of I/O: 83 DigiKey Programmable: Not Verified |
товару немає в наявності |
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| BZX84-B9V1/DG/B3215 | NXP USA Inc. |
Description: DIODE ZENER Packaging: Bulk Part Status: Active |
товару немає в наявності |
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BZX84-B9V1/LF1R | NXP USA Inc. |
Description: DIODE ZENER 9.1V 250MW TO236AB Tolerance: ±2% Packaging: Tape & Reel (TR) Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Operating Temperature: -65°C ~ 150°C Voltage - Zener (Nom) (Vz): 9.1 V Impedance (Max) (Zzt): 15 Ohms Supplier Device Package: SOT-23 (TO-236AB) Grade: Automotive Part Status: Active Power - Max: 250 mW Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Current - Reverse Leakage @ Vr: 500 nA @ 6 V Qualification: AEC-Q101 |
товару немає в наявності |
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74LVC1G19GW-Q100125 | NXP USA Inc. |
Description: DECODER/DRIVER, LVC/LCX/Z SERIES Packaging: Bulk Part Status: Active |
товару немає в наявності |
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| 74LVC1G19GS132 | NXP USA Inc. |
Description: DECODER/DRIVER, LVC/LCX/Z SERIE Packaging: Bulk Part Status: Active |
товару немає в наявності |
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| BLF7G22LS-160,112 | NXP USA Inc. |
Description: FET RF 65V 2.17GHZ SOT502B Packaging: Tube |
на замовлення 78 шт: термін постачання 21-31 дні (днів) |
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| BLF7G21LS-160,112 | NXP USA Inc. |
Description: IC AMP CDMA 1.8-2.05GHZ SOT1121B Packaging: Tube Package / Case: SOT-1121B Current Rating (Amps): 32.5A Mounting Type: Flange Mount Frequency: 1.93GHz ~ 1.99GHz Configuration: Dual, Common Source Power - Output: 45W Gain: 18dB Technology: LDMOS Supplier Device Package: LDMOST Part Status: Active Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 1.08 A |
на замовлення 40 шт: термін постачання 21-31 дні (днів) |
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| BLF8G10LS-160,112 | NXP USA Inc. |
Description: RF PFET, 1-ELEMENT, ULTRA HIGH F |
на замовлення 4 шт: термін постачання 21-31 дні (днів) |
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| MC908QY4CDWER518 | NXP USA Inc. |
Description: MICROCONTROLLER, 8 BIT, HC08/S08 Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
товару немає в наявності |
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MC908QY4CDWER | NXP USA Inc. |
Description: IC MCU 8BIT 4KB FLASH 16SOIC Packaging: Bulk Package / Case: 16-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 4KB (4K x 8) RAM Size: 128 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HC08 Data Converters: A/D 4x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Peripherals: LVD, POR, PWM Supplier Device Package: 16-SOIC Part Status: Not For New Designs Number of I/O: 13 DigiKey Programmable: Not Verified |
на замовлення 31245 шт: термін постачання 21-31 дні (днів) |
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MPF5024AMBA0ES | NXP USA Inc. |
Description: POWER MANAGEMENT IC, PRE-PROG, 4 Packaging: Tray Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2.5V ~ 5.5V Applications: High Performance i.MX 8, S32x Processor Based Current - Supply: 10µA Supplier Device Package: 40-HVQFN (6x6) Part Status: Active |
на замовлення 490 шт: термін постачання 21-31 дні (днів) |
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74HCT4066PW-Q100118 | NXP USA Inc. |
Description: DIFFERENTIAL MUX Packaging: Bulk Package / Case: 14-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) On-State Resistance (Max): 95Ohm -3db Bandwidth: 200MHz Supplier Device Package: 14-TSSOP Voltage - Supply, Single (V+): 4.5V ~ 5.5V Crosstalk: -60dB @ 1MHz Switch Circuit: SPST - NO Multiplexer/Demultiplexer Circuit: 1:1 Channel-to-Channel Matching (ΔRon): 3Ohm Switch Time (Ton, Toff) (Max): 20ns, 30ns Channel Capacitance (CS(off), CD(off)): 3.5pF Current - Leakage (IS(off)) (Max): 1µA Grade: Automotive Part Status: Active Number of Circuits: 4 Qualification: AEC-Q100 |
товару немає в наявності |
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74HCT4066PW/C118 | NXP USA Inc. |
Description: 74HCT4066PW - SPST, 4 FUNC Packaging: Bulk Part Status: Active |
на замовлення 3500 шт: термін постачання 21-31 дні (днів) |
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| 74HCT4066D-Q100118 | NXP USA Inc. |
Description: DIFFERENTIAL MUX Packaging: Bulk Part Status: Active |
товару немає в наявності |
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NTP52101G0JHKZ | NXP USA Inc. |
Description: NTAG Packaging: Tape & Reel (TR) Package / Case: 16-XFQFN Mounting Type: Surface Mount Frequency: 13.56MHz Interface: PWM Type: RFID Reader Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.62V ~ 5.5V Standards: NFC, ISO 15693 Supplier Device Package: 16-XQFN (1.8x2.6) Part Status: Active |
товару немає в наявності |
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NTP52101G0JHKZ | NXP USA Inc. |
Description: NTAG Packaging: Cut Tape (CT) Package / Case: 16-XFQFN Mounting Type: Surface Mount Frequency: 13.56MHz Interface: PWM Type: RFID Reader Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.62V ~ 5.5V Standards: NFC, ISO 15693 Supplier Device Package: 16-XQFN (1.8x2.6) Part Status: Active |
на замовлення 5469 шт: термін постачання 21-31 дні (днів) |
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NTP53121G0JHKZ | NXP USA Inc. |
Description: RFID NTAG5 XQFN Packaging: Tape & Reel (TR) Package / Case: 16-XFQFN Size / Dimension: 0.071" L x 0.102" W (1.80mm x 2.60mm) Mounting Type: Surface Mount Frequency: 13.56MHz Memory Type: Read/Write Interface: I2C Type: RFID Reader Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.62V ~ 5.5V Standards: ISO 15693, NFC Supplier Device Package: 16-XQFN (1.8x2.6) Writable Memory: 16kb (User) Part Status: Active |
товару немає в наявності |
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NTP53121G0JHKZ | NXP USA Inc. |
Description: RFID NTAG5 XQFN Packaging: Cut Tape (CT) Package / Case: 16-XFQFN Size / Dimension: 0.071" L x 0.102" W (1.80mm x 2.60mm) Mounting Type: Surface Mount Frequency: 13.56MHz Memory Type: Read/Write Interface: I2C Type: RFID Reader Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.62V ~ 5.5V Standards: ISO 15693, NFC Supplier Device Package: 16-XQFN (1.8x2.6) Writable Memory: 16kb (User) Part Status: Active |
на замовлення 4357 шт: термін постачання 21-31 дні (днів) |
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NTP53321G0JHK | NXP USA Inc. |
Description: RFID NTAG5 XQFN Packaging: Tape & Reel (TR) Size / Dimension: 0.071" L x 0.102" W (1.80mm x 2.60mm) Frequency: 13.56MHz Memory Type: Read/Write Operating Temperature: -40°C ~ 85°C Standards: ISO 15693, NFC Writable Memory: 16kb (User) |
товару немає в наявності |
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NTP53321G0JHK | NXP USA Inc. |
Description: RFID NTAG5 XQFN Packaging: Cut Tape (CT) Size / Dimension: 0.071" L x 0.102" W (1.80mm x 2.60mm) Frequency: 13.56MHz Memory Type: Read/Write Operating Temperature: -40°C ~ 85°C Standards: ISO 15693, NFC Writable Memory: 16kb (User) |
товару немає в наявності |
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NTA53321G0FTTZ | NXP USA Inc. |
Description: NTAG Packaging: Tape & Reel (TR) Package / Case: 16-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Frequency: 13.56MHz Interface: I2C Type: RFID Reader Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.62V ~ 5.5V Standards: NFC, ISO 15693 Supplier Device Package: 16-TSSOP Part Status: Active |
товару немає в наявності |
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| NTAGFCL5LEDM | NXP USA Inc. | Description: DEV TOOL NFC NTAG |
товару немає в наявності |
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| BLF888DU112 | NXP USA Inc. |
Description: UHF POWER LDMOS TRANSISTOR, SOT5 |
на замовлення 141 шт: термін постачання 21-31 дні (днів) |
|
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| BLF888D112 | NXP USA Inc. |
Description: RF MOSFET LDMOS SOT5 Packaging: Bulk |
на замовлення 122 шт: термін постачання 21-31 дні (днів) |
|
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| BLF888DS112 | NXP USA Inc. |
Description: RF MOSFET LDMOS SOT5 Packaging: Bulk |
на замовлення 40 шт: термін постачання 21-31 дні (днів) |
|
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| BLM7G1822S-20PB518 | NXP USA Inc. |
Description: LDMOS 2-STAGE POWER MMIC, SOT121 Packaging: Bulk |
на замовлення 594 шт: термін постачання 21-31 дні (днів) |
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|
74LV367PW,118 | NXP USA Inc. |
Description: IC BUF NON-INVERT 3.6V 16TSSOP Packaging: Bulk Package / Case: 16-TSSOP (0.173", 4.40mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 2 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1V ~ 3.6V Number of Bits per Element: 2, 4 (Hex) Current - Output High, Low: 8mA, 8mA Supplier Device Package: 16-TSSOP |
на замовлення 4910 шт: термін постачання 21-31 дні (днів) |
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74LV367D,112 | NXP USA Inc. |
Description: IC BUFFER NON-INVERT 3.6V 16SO Packaging: Tube Package / Case: 16-SOIC (0.154", 3.90mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 2 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1V ~ 3.6V Number of Bits per Element: 2, 4 (Hex) Current - Output High, Low: 8mA, 8mA Supplier Device Package: 16-SO |
на замовлення 4000 шт: термін постачання 21-31 дні (днів) |
|
| LPC2364FET100,518 |
|
Виробник: NXP USA Inc.
Description: IC MCU 16/32BIT 128KB 100TFBGA
Packaging: Cut Tape (CT)
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 34K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 6x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, Ethernet, I²C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Not For New Designs
Number of I/O: 70
DigiKey Programmable: Not Verified
Description: IC MCU 16/32BIT 128KB 100TFBGA
Packaging: Cut Tape (CT)
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 34K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 6x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, Ethernet, I²C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Not For New Designs
Number of I/O: 70
DigiKey Programmable: Not Verified
товару немає в наявності
| PDTD113ZQA147 |
|
Виробник: NXP USA Inc.
Description: TRANS PREBIAS NPN 50V 500MA
Packaging: Bulk
Package / Case: 3-XDFN Exposed Pad
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 100mV @ 2.5mA, 50mA
Current - Collector Cutoff (Max): 500nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 70 @ 50mA, 5V
Supplier Device Package: DFN1010D-3
Grade: Automotive
Part Status: Active
Current - Collector (Ic) (Max): 500 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 940 mW
Frequency - Transition: 210 MHz
Resistor - Base (R1): 1 kOhms
Resistor - Emitter Base (R2): 10 kOhms
Qualification: AEC-Q101
Description: TRANS PREBIAS NPN 50V 500MA
Packaging: Bulk
Package / Case: 3-XDFN Exposed Pad
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 100mV @ 2.5mA, 50mA
Current - Collector Cutoff (Max): 500nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 70 @ 50mA, 5V
Supplier Device Package: DFN1010D-3
Grade: Automotive
Part Status: Active
Current - Collector (Ic) (Max): 500 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 940 mW
Frequency - Transition: 210 MHz
Resistor - Base (R1): 1 kOhms
Resistor - Emitter Base (R2): 10 kOhms
Qualification: AEC-Q101
товару немає в наявності
| PDTD113ZU115 |
|
Виробник: NXP USA Inc.
Description: 500 MA, 50 V NPN RESISTOR-EQUIPP
Packaging: Bulk
Part Status: Active
Description: 500 MA, 50 V NPN RESISTOR-EQUIPP
Packaging: Bulk
Part Status: Active
товару немає в наявності
| 74LVC16245AEV,518 |
|
Виробник: NXP USA Inc.
Description: IC TXRX NON-INVERT 3.6V 56VFBGA
Packaging: Bulk
Package / Case: 56-VFBGA
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 56-VFBGA (4.5x7)
Part Status: Active
Description: IC TXRX NON-INVERT 3.6V 56VFBGA
Packaging: Bulk
Package / Case: 56-VFBGA
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 56-VFBGA (4.5x7)
Part Status: Active
на замовлення 6865 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 143+ | 161.22 грн |
| TJA1027TK/20/1,118 |
Виробник: NXP USA Inc.
Description: LIN 2.2A/SAE J2602 TRANSCEIVER
Description: LIN 2.2A/SAE J2602 TRANSCEIVER
товару немає в наявності
| TJA1027TK/20/1 |
Виробник: NXP USA Inc.
Description: LIN 2.2A/SAE J2602 TRANSCEIVER
Description: LIN 2.2A/SAE J2602 TRANSCEIVER
товару немає в наявності
| OM13062UL,598 |
Виробник: NXP USA Inc.
Description: LPCXPRESSO LPC11U37H EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0
Utilized IC / Part: LPC11U37H
Platform: LPCXpresso™
Description: LPCXPRESSO LPC11U37H EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0
Utilized IC / Part: LPC11U37H
Platform: LPCXpresso™
товару немає в наявності
| OM13022598 |
Виробник: NXP USA Inc.
Description: IAR KICKSTART LPC11U24 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0
Utilized IC / Part: LPC11U24
Platform: IAR KickStart
Description: IAR KICKSTART LPC11U24 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0
Utilized IC / Part: LPC11U24
Platform: IAR KickStart
товару немає в наявності
| MIMX8MD6DVAJZAA557 |
|
Виробник: NXP USA Inc.
Description: 8M QUAD APPLICATIONS PROCESSOR
Description: 8M QUAD APPLICATIONS PROCESSOR
товару немає в наявності
| MIMX8MQ6DVAJZAA |
|
Виробник: NXP USA Inc.
Description: IC MPU I.MX8MQ 1.5GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
USB: USB 3.0 (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
Part Status: Active
Description: IC MPU I.MX8MQ 1.5GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
USB: USB 3.0 (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
Part Status: Active
на замовлення 2055 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 5+ | 4687.7 грн |
| MIMX8MQ6DVAJZAA,557 |
|
Виробник: NXP USA Inc.
Description: I.MX 8M: ARM CORTEX A53 QUAD COR
Packaging: Tray
Part Status: Active
Description: I.MX 8M: ARM CORTEX A53 QUAD COR
Packaging: Tray
Part Status: Active
товару немає в наявності
| 8MIC-RPI-MX8 |
|
Виробник: NXP USA Inc.
Description: 8 MICROPHONE BOARD FOR VOICE
Packaging: Bulk
Function: Microphone
Type: Audio
Contents: Board(s)
Part Status: Active
Description: 8 MICROPHONE BOARD FOR VOICE
Packaging: Bulk
Function: Microphone
Type: Audio
Contents: Board(s)
Part Status: Active
на замовлення 8 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 17018.81 грн |
| 74LVC1T45U/C025 |
|
Виробник: NXP USA Inc.
Description: BUS TRANSCVR, LVC/LCX/Z SERIES
Packaging: Bulk
Output Type: Tri-State
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 420Mbps
Channel Type: Bidirectional
Output Signal: CMOS, LVTTL
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.2 V ~ 5.5 V
Voltage - VCCB: 1.2 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
Description: BUS TRANSCVR, LVC/LCX/Z SERIES
Packaging: Bulk
Output Type: Tri-State
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 420Mbps
Channel Type: Bidirectional
Output Signal: CMOS, LVTTL
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.2 V ~ 5.5 V
Voltage - VCCB: 1.2 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
товару немає в наявності
| LPC2420FBD208K |
|
Виробник: NXP USA Inc.
Description: IC MCU 16/32BIT ROMLESS 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
RAM Size: 82K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM7®
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: EBI/EMI, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Part Status: Active
Number of I/O: 160
DigiKey Programmable: Not Verified
Description: IC MCU 16/32BIT ROMLESS 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
RAM Size: 82K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM7®
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: EBI/EMI, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Part Status: Active
Number of I/O: 160
DigiKey Programmable: Not Verified
на замовлення 340 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 966.56 грн |
| 10+ | 744.31 грн |
| 180+ | 678.94 грн |
| 74HC253DB,112-NXP |
|
Виробник: NXP USA Inc.
Description: IC DATA SEL/MULTPL 2X4:1 16SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Circuit: 2 x 4:1
Type: Data Selector/Multiplexer
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Independent Circuits: 2
Current - Output High, Low: 7.8mA, 7.8mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SSOP
Part Status: Active
Description: IC DATA SEL/MULTPL 2X4:1 16SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Circuit: 2 x 4:1
Type: Data Selector/Multiplexer
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Independent Circuits: 2
Current - Output High, Low: 7.8mA, 7.8mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SSOP
Part Status: Active
товару немає в наявності
| JN5179-001-M10Z |
|
Виробник: NXP USA Inc.
Description: RF TXRX MOD 802.15.4 TH SMD
Packaging: Bulk
Package / Case: Module
Sensitivity: -96dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.6V
Power - Output: 8.5dBm
Protocol: Zigbee®
Current - Receiving: 16.4mA
Current - Transmitting: 114mA
Antenna Type: Integrated, Trace
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, SPI, UART
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: RF TXRX MOD 802.15.4 TH SMD
Packaging: Bulk
Package / Case: Module
Sensitivity: -96dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.6V
Power - Output: 8.5dBm
Protocol: Zigbee®
Current - Receiving: 16.4mA
Current - Transmitting: 114mA
Antenna Type: Integrated, Trace
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, SPI, UART
Part Status: Obsolete
DigiKey Programmable: Not Verified
на замовлення 3965 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 24+ | 919.6 грн |
| MCIMX6Q7CVT08AE |
|
Виробник: NXP USA Inc.
Description: IC MPU I.MX6Q 800MHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Part Status: Active
Description: IC MPU I.MX6Q 800MHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Part Status: Active
на замовлення 70 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 6152.51 грн |
| 10+ | 4729.58 грн |
| 60+ | 4306.73 грн |
| FRDM-K32L2B3 |
|
Виробник: NXP USA Inc.
Description: FREEDOM EVAL BOARD K32L2B3
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: K32 L2B
Platform: Freedom
Description: FREEDOM EVAL BOARD K32L2B3
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: K32 L2B
Platform: Freedom
на замовлення 10 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 2106.62 грн |
| S08PB16-EVK |
|
Виробник: NXP USA Inc.
Description: S08PLS EVAL KIT
Packaging: Box
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s)
Core Processor: HCS08
Board Type: Evaluation Platform
Utilized IC / Part: MC9S08PB16
Part Status: Active
Description: S08PLS EVAL KIT
Packaging: Box
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s)
Core Processor: HCS08
Board Type: Evaluation Platform
Utilized IC / Part: MC9S08PB16
Part Status: Active
на замовлення 1 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 2077.45 грн |
| MPC5748G-GW-RDB |
|
Виробник: NXP USA Inc.
Description: MPC5748G ETHERNET GATEWAY
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Board Type: Evaluation Platform
Utilized IC / Part: MPC5748G
Part Status: Active
Description: MPC5748G ETHERNET GATEWAY
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Board Type: Evaluation Platform
Utilized IC / Part: MPC5748G
Part Status: Active
на замовлення 12 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 39698.02 грн |
| BC859CW/ZL115 |
|
Виробник: NXP USA Inc.
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
Part Status: Active
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
Part Status: Active
на замовлення 280999 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 15000+ | 1.54 грн |
| MKV46F128VLL16 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 100LQFP
Description: IC MCU 32BIT 128KB FLASH 100LQFP
товару немає в наявності
| A2I20D020GNR1 |
|
Виробник: NXP USA Inc.
Description: IC AMP W-CDMA 1.4-2.2GHZ TO270WB
Packaging: Tape & Reel (TR)
Package / Case: TO-270-17 Variant, Flat Leads
Mounting Type: Surface Mount
Frequency: 1.4GHz ~ 2.2GHz
RF Type: W-CDMA
Voltage - Supply: 28V
Gain: 35dB
Test Frequency: 2.2GHz
Supplier Device Package: TO-270WB-17
Description: IC AMP W-CDMA 1.4-2.2GHZ TO270WB
Packaging: Tape & Reel (TR)
Package / Case: TO-270-17 Variant, Flat Leads
Mounting Type: Surface Mount
Frequency: 1.4GHz ~ 2.2GHz
RF Type: W-CDMA
Voltage - Supply: 28V
Gain: 35dB
Test Frequency: 2.2GHz
Supplier Device Package: TO-270WB-17
товару немає в наявності
| SPC5645SF1VLUR |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 125MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 1.064M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4d
Data Converters: A/D 16x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 128
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 2MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 125MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 1.064M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4d
Data Converters: A/D 16x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 128
DigiKey Programmable: Not Verified
товару немає в наявності
| LS1043AXE7KQA |
|
Виробник: NXP USA Inc.
Description: QORIQ 4XCPU 64-BIT ARM ARCH 1.
Description: QORIQ 4XCPU 64-BIT ARM ARCH 1.
товару немає в наявності
| TDA9989ET/C1,518 |
Виробник: NXP USA Inc.
Description: IC VIDEO TRANSMITTER 64TFBGA
Packaging: Bulk
Package / Case: 64-TFBGA
Mounting Type: Surface Mount
Function: Transmitter
Voltage - Supply: 1.1V ~ 1.3V, 1.7V ~ 1.9V
Applications: Consumer Video
Standards: CEA-861B, DVI 1.0, HMDI 1.3a, ITU656
Supplier Device Package: 64-TFBGA (4.5x4.5)
Control Interface: I2C
Description: IC VIDEO TRANSMITTER 64TFBGA
Packaging: Bulk
Package / Case: 64-TFBGA
Mounting Type: Surface Mount
Function: Transmitter
Voltage - Supply: 1.1V ~ 1.3V, 1.7V ~ 1.9V
Applications: Consumer Video
Standards: CEA-861B, DVI 1.0, HMDI 1.3a, ITU656
Supplier Device Package: 64-TFBGA (4.5x4.5)
Control Interface: I2C
на замовлення 56831 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 128+ | 160.85 грн |
| BF821/DG/B2215 |
|
Виробник: NXP USA Inc.
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 800mV @ 5mA, 30mA
Current - Collector Cutoff (Max): 10nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 50 @ 25mA, 20V
Frequency - Transition: 60MHz
Supplier Device Package: SOT-23-3 (TO-236)
Grade: Automotive
Part Status: Active
Current - Collector (Ic) (Max): 50 mA
Voltage - Collector Emitter Breakdown (Max): 300 V
Power - Max: 250 mW
Qualification: AEC-Q101
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 800mV @ 5mA, 30mA
Current - Collector Cutoff (Max): 10nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 50 @ 25mA, 20V
Frequency - Transition: 60MHz
Supplier Device Package: SOT-23-3 (TO-236)
Grade: Automotive
Part Status: Active
Current - Collector (Ic) (Max): 50 mA
Voltage - Collector Emitter Breakdown (Max): 300 V
Power - Max: 250 mW
Qualification: AEC-Q101
товару немає в наявності
| PCA9450CHNY |
|
Виробник: NXP USA Inc.
Description: PMIC I.MX 8M MINI/NANO/PLUS HVQF
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.85V ~ 5.5V
Applications: General Purpose
Current - Supply: 20µA
Supplier Device Package: 56-HVQFN (7x7)
Description: PMIC I.MX 8M MINI/NANO/PLUS HVQF
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.85V ~ 5.5V
Applications: General Purpose
Current - Supply: 20µA
Supplier Device Package: 56-HVQFN (7x7)
на замовлення 14000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2000+ | 228.55 грн |
| PCA9450CHNY |
|
Виробник: NXP USA Inc.
Description: PMIC I.MX 8M MINI/NANO/PLUS HVQF
Packaging: Cut Tape (CT)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.85V ~ 5.5V
Applications: General Purpose
Current - Supply: 20µA
Supplier Device Package: 56-HVQFN (7x7)
Description: PMIC I.MX 8M MINI/NANO/PLUS HVQF
Packaging: Cut Tape (CT)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.85V ~ 5.5V
Applications: General Purpose
Current - Supply: 20µA
Supplier Device Package: 56-HVQFN (7x7)
на замовлення 16065 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 455.26 грн |
| 10+ | 393.82 грн |
| 25+ | 372.33 грн |
| 100+ | 302.83 грн |
| 250+ | 287.3 грн |
| 500+ | 257.79 грн |
| 1000+ | 213.85 грн |
| LPC1820FBD144,551 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 168K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Discontinued at Digi-Key
Number of I/O: 83
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 168K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Discontinued at Digi-Key
Number of I/O: 83
DigiKey Programmable: Not Verified
товару немає в наявності
| BZX84-B9V1/DG/B3215 |
|
товару немає в наявності
| BZX84-B9V1/LF1R |
|
Виробник: NXP USA Inc.
Description: DIODE ZENER 9.1V 250MW TO236AB
Tolerance: ±2%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 9.1 V
Impedance (Max) (Zzt): 15 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Grade: Automotive
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 500 nA @ 6 V
Qualification: AEC-Q101
Description: DIODE ZENER 9.1V 250MW TO236AB
Tolerance: ±2%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 9.1 V
Impedance (Max) (Zzt): 15 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Grade: Automotive
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 500 nA @ 6 V
Qualification: AEC-Q101
товару немає в наявності
| 74LVC1G19GW-Q100125 |
|
Виробник: NXP USA Inc.
Description: DECODER/DRIVER, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Active
Description: DECODER/DRIVER, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Active
товару немає в наявності
| 74LVC1G19GS132 |
Виробник: NXP USA Inc.
Description: DECODER/DRIVER, LVC/LCX/Z SERIE
Packaging: Bulk
Part Status: Active
Description: DECODER/DRIVER, LVC/LCX/Z SERIE
Packaging: Bulk
Part Status: Active
товару немає в наявності
| BLF7G22LS-160,112 |
на замовлення 78 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 4+ | 6628.3 грн |
| BLF7G21LS-160,112 |
|
Виробник: NXP USA Inc.
Description: IC AMP CDMA 1.8-2.05GHZ SOT1121B
Packaging: Tube
Package / Case: SOT-1121B
Current Rating (Amps): 32.5A
Mounting Type: Flange Mount
Frequency: 1.93GHz ~ 1.99GHz
Configuration: Dual, Common Source
Power - Output: 45W
Gain: 18dB
Technology: LDMOS
Supplier Device Package: LDMOST
Part Status: Active
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.08 A
Description: IC AMP CDMA 1.8-2.05GHZ SOT1121B
Packaging: Tube
Package / Case: SOT-1121B
Current Rating (Amps): 32.5A
Mounting Type: Flange Mount
Frequency: 1.93GHz ~ 1.99GHz
Configuration: Dual, Common Source
Power - Output: 45W
Gain: 18dB
Technology: LDMOS
Supplier Device Package: LDMOST
Part Status: Active
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.08 A
на замовлення 40 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 4+ | 7594.28 грн |
| BLF8G10LS-160,112 |
|
Виробник: NXP USA Inc.
Description: RF PFET, 1-ELEMENT, ULTRA HIGH F
Description: RF PFET, 1-ELEMENT, ULTRA HIGH F
на замовлення 4 шт:
термін постачання 21-31 дні (днів)| MC908QY4CDWER518 |
|
Виробник: NXP USA Inc.
Description: MICROCONTROLLER, 8 BIT, HC08/S08
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: MICROCONTROLLER, 8 BIT, HC08/S08
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
товару немає в наявності
| MC908QY4CDWER |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 16SOIC
Packaging: Bulk
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-SOIC
Part Status: Not For New Designs
Number of I/O: 13
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 4KB FLASH 16SOIC
Packaging: Bulk
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-SOIC
Part Status: Not For New Designs
Number of I/O: 13
DigiKey Programmable: Not Verified
на замовлення 31245 шт:
термін постачання 21-31 дні (днів)| MPF5024AMBA0ES |
|
Виробник: NXP USA Inc.
Description: POWER MANAGEMENT IC, PRE-PROG, 4
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: 10µA
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Active
Description: POWER MANAGEMENT IC, PRE-PROG, 4
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: 10µA
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Active
на замовлення 490 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 532.8 грн |
| 10+ | 463.98 грн |
| 25+ | 442.45 грн |
| 80+ | 360.52 грн |
| 230+ | 344.32 грн |
| 490+ | 313.94 грн |
| 74HCT4066PW-Q100118 |
|
Виробник: NXP USA Inc.
Description: DIFFERENTIAL MUX
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 95Ohm
-3db Bandwidth: 200MHz
Supplier Device Package: 14-TSSOP
Voltage - Supply, Single (V+): 4.5V ~ 5.5V
Crosstalk: -60dB @ 1MHz
Switch Circuit: SPST - NO
Multiplexer/Demultiplexer Circuit: 1:1
Channel-to-Channel Matching (ΔRon): 3Ohm
Switch Time (Ton, Toff) (Max): 20ns, 30ns
Channel Capacitance (CS(off), CD(off)): 3.5pF
Current - Leakage (IS(off)) (Max): 1µA
Grade: Automotive
Part Status: Active
Number of Circuits: 4
Qualification: AEC-Q100
Description: DIFFERENTIAL MUX
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 95Ohm
-3db Bandwidth: 200MHz
Supplier Device Package: 14-TSSOP
Voltage - Supply, Single (V+): 4.5V ~ 5.5V
Crosstalk: -60dB @ 1MHz
Switch Circuit: SPST - NO
Multiplexer/Demultiplexer Circuit: 1:1
Channel-to-Channel Matching (ΔRon): 3Ohm
Switch Time (Ton, Toff) (Max): 20ns, 30ns
Channel Capacitance (CS(off), CD(off)): 3.5pF
Current - Leakage (IS(off)) (Max): 1µA
Grade: Automotive
Part Status: Active
Number of Circuits: 4
Qualification: AEC-Q100
товару немає в наявності
| 74HCT4066PW/C118 |
|
на замовлення 3500 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2404+ | 9.21 грн |
| 74HCT4066D-Q100118 |
товару немає в наявності
| NTP52101G0JHKZ |
|
Виробник: NXP USA Inc.
Description: NTAG
Packaging: Tape & Reel (TR)
Package / Case: 16-XFQFN
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: PWM
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 5.5V
Standards: NFC, ISO 15693
Supplier Device Package: 16-XQFN (1.8x2.6)
Part Status: Active
Description: NTAG
Packaging: Tape & Reel (TR)
Package / Case: 16-XFQFN
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: PWM
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 5.5V
Standards: NFC, ISO 15693
Supplier Device Package: 16-XQFN (1.8x2.6)
Part Status: Active
товару немає в наявності
| NTP52101G0JHKZ |
|
Виробник: NXP USA Inc.
Description: NTAG
Packaging: Cut Tape (CT)
Package / Case: 16-XFQFN
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: PWM
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 5.5V
Standards: NFC, ISO 15693
Supplier Device Package: 16-XQFN (1.8x2.6)
Part Status: Active
Description: NTAG
Packaging: Cut Tape (CT)
Package / Case: 16-XFQFN
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: PWM
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 5.5V
Standards: NFC, ISO 15693
Supplier Device Package: 16-XQFN (1.8x2.6)
Part Status: Active
на замовлення 5469 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 3+ | 114.39 грн |
| 10+ | 82.87 грн |
| 25+ | 74.52 грн |
| 100+ | 60.32 грн |
| 250+ | 55.18 грн |
| 500+ | 51.85 грн |
| 1000+ | 48.13 грн |
| NTP53121G0JHKZ |
|
Виробник: NXP USA Inc.
Description: RFID NTAG5 XQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-XFQFN
Size / Dimension: 0.071" L x 0.102" W (1.80mm x 2.60mm)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Memory Type: Read/Write
Interface: I2C
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 5.5V
Standards: ISO 15693, NFC
Supplier Device Package: 16-XQFN (1.8x2.6)
Writable Memory: 16kb (User)
Part Status: Active
Description: RFID NTAG5 XQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-XFQFN
Size / Dimension: 0.071" L x 0.102" W (1.80mm x 2.60mm)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Memory Type: Read/Write
Interface: I2C
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 5.5V
Standards: ISO 15693, NFC
Supplier Device Package: 16-XQFN (1.8x2.6)
Writable Memory: 16kb (User)
Part Status: Active
товару немає в наявності
| NTP53121G0JHKZ |
|
Виробник: NXP USA Inc.
Description: RFID NTAG5 XQFN
Packaging: Cut Tape (CT)
Package / Case: 16-XFQFN
Size / Dimension: 0.071" L x 0.102" W (1.80mm x 2.60mm)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Memory Type: Read/Write
Interface: I2C
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 5.5V
Standards: ISO 15693, NFC
Supplier Device Package: 16-XQFN (1.8x2.6)
Writable Memory: 16kb (User)
Part Status: Active
Description: RFID NTAG5 XQFN
Packaging: Cut Tape (CT)
Package / Case: 16-XFQFN
Size / Dimension: 0.071" L x 0.102" W (1.80mm x 2.60mm)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Memory Type: Read/Write
Interface: I2C
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 5.5V
Standards: ISO 15693, NFC
Supplier Device Package: 16-XQFN (1.8x2.6)
Writable Memory: 16kb (User)
Part Status: Active
на замовлення 4357 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 3+ | 108.25 грн |
| 10+ | 94.11 грн |
| 25+ | 83.98 грн |
| 100+ | 70.93 грн |
| 250+ | 63.05 грн |
| 500+ | 55.17 грн |
| 1000+ | 44.96 грн |
| NTP53321G0JHK |
|
Виробник: NXP USA Inc.
Description: RFID NTAG5 XQFN
Packaging: Tape & Reel (TR)
Size / Dimension: 0.071" L x 0.102" W (1.80mm x 2.60mm)
Frequency: 13.56MHz
Memory Type: Read/Write
Operating Temperature: -40°C ~ 85°C
Standards: ISO 15693, NFC
Writable Memory: 16kb (User)
Description: RFID NTAG5 XQFN
Packaging: Tape & Reel (TR)
Size / Dimension: 0.071" L x 0.102" W (1.80mm x 2.60mm)
Frequency: 13.56MHz
Memory Type: Read/Write
Operating Temperature: -40°C ~ 85°C
Standards: ISO 15693, NFC
Writable Memory: 16kb (User)
товару немає в наявності
| NTP53321G0JHK |
|
Виробник: NXP USA Inc.
Description: RFID NTAG5 XQFN
Packaging: Cut Tape (CT)
Size / Dimension: 0.071" L x 0.102" W (1.80mm x 2.60mm)
Frequency: 13.56MHz
Memory Type: Read/Write
Operating Temperature: -40°C ~ 85°C
Standards: ISO 15693, NFC
Writable Memory: 16kb (User)
Description: RFID NTAG5 XQFN
Packaging: Cut Tape (CT)
Size / Dimension: 0.071" L x 0.102" W (1.80mm x 2.60mm)
Frequency: 13.56MHz
Memory Type: Read/Write
Operating Temperature: -40°C ~ 85°C
Standards: ISO 15693, NFC
Writable Memory: 16kb (User)
товару немає в наявності
| NTA53321G0FTTZ |
|
Виробник: NXP USA Inc.
Description: NTAG
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 5.5V
Standards: NFC, ISO 15693
Supplier Device Package: 16-TSSOP
Part Status: Active
Description: NTAG
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 5.5V
Standards: NFC, ISO 15693
Supplier Device Package: 16-TSSOP
Part Status: Active
товару немає в наявності
| BLF888DU112 |
|
Виробник: NXP USA Inc.
Description: UHF POWER LDMOS TRANSISTOR, SOT5
Description: UHF POWER LDMOS TRANSISTOR, SOT5
на замовлення 141 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 21199.05 грн |
| BLF888D112 |
|
на замовлення 122 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 17565.43 грн |
| BLF888DS112 |
|
на замовлення 40 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 17471 грн |
| BLM7G1822S-20PB518 |
|
на замовлення 594 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 13+ | 1734.46 грн |
| 74LV367PW,118 |
|
Виробник: NXP USA Inc.
Description: IC BUF NON-INVERT 3.6V 16TSSOP
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 3.6V
Number of Bits per Element: 2, 4 (Hex)
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 16-TSSOP
Description: IC BUF NON-INVERT 3.6V 16TSSOP
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 3.6V
Number of Bits per Element: 2, 4 (Hex)
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 16-TSSOP
на замовлення 4910 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1025+ | 20.48 грн |
| 74LV367D,112 |
|
Виробник: NXP USA Inc.
Description: IC BUFFER NON-INVERT 3.6V 16SO
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 3.6V
Number of Bits per Element: 2, 4 (Hex)
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 16-SO
Description: IC BUFFER NON-INVERT 3.6V 16SO
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 3.6V
Number of Bits per Element: 2, 4 (Hex)
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 16-SO
на замовлення 4000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1025+ | 20.85 грн |