Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (35285) > Сторінка 285 з 589
Фото | Назва | Виробник | Інформація |
Доступність |
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JN5169SMA/EVAL1Z | NXP USA Inc. | Description: DEMO BOARD WIRELESS MCU |
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JN516X-EK001Z | NXP USA Inc. |
![]() Packaging: Bulk For Use With/Related Products: JN516x Frequency: 2.4GHz Type: Transceiver; 802.15.4 (ZigBee®) Supplied Contents: Board(s) Part Status: Obsolete |
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JN5179-001-SMAZ | NXP USA Inc. |
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JN5179-001-T00Z | NXP USA Inc. |
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JN5179-001-T06Z | NXP USA Inc. |
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JN5179DB/01Z | NXP USA Inc. |
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JN5179KIT/03Z | NXP USA Inc. | Description: DEMO BOARD MCU WIRELESS |
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JN5179MOD/02Z | NXP USA Inc. | Description: DEMO BOARD MCU WIRELESS |
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JN5179-SMA-EVAL1Z | NXP USA Inc. | Description: DEMO OM15025 + OM15026 |
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E1TDA19978/KIT,598 | NXP USA Inc. |
Description: EVALKIT TDA19978RX+TDA19978 Packaging: Box Function: Video Processing Type: Video Utilized IC / Part: TDA19978 Supplied Contents: Board(s) Part Status: Obsolete |
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E1TDA19988AET/KIT, | NXP USA Inc. |
Description: KIT MB+DBTDA19988+TDA19978 Packaging: Box Function: Video Processing Type: Video Utilized IC / Part: TDA19978 Supplied Contents: Board(s) Part Status: Obsolete |
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E1TDA9984A/KIT,598 | NXP USA Inc. |
Description: EVALKIT TDA9984AHWC1HLD+19978N2T Packaging: Box Function: Video Processing Type: Video Utilized IC / Part: TDA19978 Supplied Contents: Board(s) Part Status: Obsolete |
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E2TDA19998/BOARD,5 | NXP USA Inc. | Description: EVAL BOARD TDA19998 |
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MC33663BSEF | NXP USA Inc. | Description: IC TRANSCEIVER HALF 2/2 14SOIC |
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MC33901SNEF | NXP USA Inc. |
Description: IC TRANSCEIVER 1/1 8SOIC Packaging: Tube Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 125°C Voltage - Supply: 4.5V ~ 5.5V Number of Drivers/Receivers: 1/1 Protocol: CANbus Supplier Device Package: 8-SOIC Part Status: Obsolete |
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MC33901SNEFR2 | NXP USA Inc. |
Description: IC TRANSCEIVER 1/1 8SOIC Packaging: Tape & Reel (TR) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 125°C Voltage - Supply: 4.5V ~ 5.5V Number of Drivers/Receivers: 1/1 Protocol: CANbus Supplier Device Package: 8-SOIC Part Status: Obsolete |
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MC33909D3AD | NXP USA Inc. |
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48 Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 3.5V ~ 28V Applications: System Basis Chip Current - Supply: 7mA Supplier Device Package: 48-LQFP-EP (7x7) |
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MC33909D3ADR2 | NXP USA Inc. |
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48 Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 3.5V ~ 28V Applications: System Basis Chip Current - Supply: 7mA Supplier Device Package: 48-LQFP-EP (7x7) |
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MC33909D5AD | NXP USA Inc. |
Description: SBC 5V 1CAN 2LIN 6SG HLQFP48 Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 3.5V ~ 28V Applications: System Basis Chip Current - Supply: 7mA Supplier Device Package: 48-LQFP-EP (7x7) |
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MC33909D5ADR2 | NXP USA Inc. |
Description: SBC 5V 1CAN 2LIN 6SG HLQFP48 Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 3.5V ~ 28V Applications: System Basis Chip Current - Supply: 7mA Supplier Device Package: 48-LQFP-EP (7x7) |
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MC33909L3AD | NXP USA Inc. |
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48 Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 3.5V ~ 28V Applications: System Basis Chip Current - Supply: 7mA Supplier Device Package: 48-LQFP-EP (7x7) |
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MC33909L3ADR2 | NXP USA Inc. |
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48 Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 3.5V ~ 28V Applications: System Basis Chip Current - Supply: 7mA Supplier Device Package: 48-LQFP-EP (7x7) |
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MC33909L5AD | NXP USA Inc. |
Description: SBC 5V 1CAN 1LIN 6SG HLQFP48 Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 3.5V ~ 28V Applications: System Basis Chip Current - Supply: 7mA Supplier Device Package: 48-LQFP-EP (7x7) |
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MC33909L5ADR2 | NXP USA Inc. |
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48 Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 3.5V ~ 28V Applications: System Basis Chip Current - Supply: 7mA Supplier Device Package: 48-LQFP-EP (7x7) |
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MC33909N3AD | NXP USA Inc. |
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48 Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 3.5V ~ 28V Applications: System Basis Chip Current - Supply: 7mA Supplier Device Package: 48-LQFP-EP (7x7) |
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MC33909N3ADR2 | NXP USA Inc. |
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48 Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 3.5V ~ 28V Applications: System Basis Chip Current - Supply: 7mA Supplier Device Package: 48-LQFP-EP (7x7) |
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MC33909N5AD | NXP USA Inc. |
Description: SBC SG 1 CAN 0 LIN HLQFP48 Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 3.5V ~ 28V Applications: System Basis Chip Current - Supply: 7mA Supplier Device Package: 48-LQFP-EP (7x7) |
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MC33909N5ADR2 | NXP USA Inc. |
Description: SBC SG 1 CAN 0 LIN HLQFP48 Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 3.5V ~ 28V Applications: System Basis Chip Current - Supply: 7mA Supplier Device Package: 48-LQFP-EP (7x7) |
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MC33909Q3AD | NXP USA Inc. |
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48 Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 3.5V ~ 28V Applications: System Basis Chip Current - Supply: 7mA Supplier Device Package: 48-LQFP-EP (7x7) |
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MC33909Q3ADR2 | NXP USA Inc. |
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48 Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 3.5V ~ 28V Applications: System Basis Chip Current - Supply: 7mA Supplier Device Package: 48-LQFP-EP (7x7) |
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MC33909Q5AD | NXP USA Inc. |
Description: SBC 5V 1CAN 4LIN 6SG HLQFP48 Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 3.5V ~ 28V Applications: System Basis Chip Current - Supply: 7mA Supplier Device Package: 48-LQFP-EP (7x7) |
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MC33909Q5ADR2 | NXP USA Inc. |
Description: SBC 5V 1CAN 4LIN 6SG HLQFP48 Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 3.5V ~ 28V Applications: System Basis Chip Current - Supply: 7mA Supplier Device Package: 48-LQFP-EP (7x7) |
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MC34901WNEF | NXP USA Inc. |
Description: IC TRANSCEIVER 1/1 8SOIC Packaging: Tube Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 125°C Voltage - Supply: 4.5V ~ 5.5V Number of Drivers/Receivers: 1/1 Protocol: CANbus Supplier Device Package: 8-SOIC Part Status: Obsolete |
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MC34901WNEFR2 | NXP USA Inc. |
Description: IC TRANSCEIVER 1/1 8SOIC Packaging: Tape & Reel (TR) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 125°C Voltage - Supply: 4.5V ~ 5.5V Number of Drivers/Receivers: 1/1 Protocol: CANbus Supplier Device Package: 8-SOIC Part Status: Obsolete |
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MFRC53101W/X3E,005 | NXP USA Inc. | Description: CL READER SYSTEMS UNCASED |
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OM15031Z | NXP USA Inc. | Description: BOARD LIGHTING DVR SLN61 |
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OM15035Z | NXP USA Inc. | Description: DEMO RASPBERRY PI MODEL |
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OM15036Z | NXP USA Inc. | Description: DEMO DR1128 |
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OM15039Z | NXP USA Inc. |
Description: DEMO BD CONNECTOR RPSMA Packaging: Box Supplied Contents: Board(s) Part Status: Obsolete |
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OM15042Z | NXP USA Inc. | Description: DEMO SMART PLUG ZIGBEE NFC |
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OM15050Z | NXP USA Inc. | Description: DEMO LARGE SIGNAL SSL8001DB1324 |
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PC33663BJEFR2 | NXP USA Inc. | Description: DUAL LINCELL 14SOIC |
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PC33663LEFR2 | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED SO14 Packaging: Tape & Reel (TR) Part Status: Obsolete |
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PC33901WNEF | NXP USA Inc. | Description: IC INTERFACE SPECIALIZED 8SOIC |
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PC33909AD | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED HLQFP48 Packaging: Tube |
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PC33909ADR2 | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED HLQFP48 Packaging: Tape & Reel (TR) |
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PC33909AE | NXP USA Inc. | Description: IC INTERFACE SPECIALIZED 64HLQFP |
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PC33909AER2 | NXP USA Inc. | Description: IC INTERFACE SPECIALIZED 64HLQFP |
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PC34909AD | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED HLQFP48 Packaging: Tube |
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PC34909ADR2 | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED HLQFP48 Packaging: Tape & Reel (TR) |
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PREV601M/01M | NXP USA Inc. | Description: BOARD EV B READER FOR PRH601 |
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SAF7741HV/N115YK | NXP USA Inc. |
Description: IC HD RADIO PROCESSOR 144HLQFP Packaging: Tray Part Status: Obsolete |
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SAF7741HV/N115YY | NXP USA Inc. |
Description: IC HD RADIO PROCESSOR 144HLQFP Packaging: Tape & Reel (TR) Part Status: Obsolete |
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SAF7741HV/N125YK | NXP USA Inc. |
Description: IC HD RADIO PROCESSOR 144HLQFP Packaging: Tray Part Status: Obsolete |
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SAF7741HV/N125YY | NXP USA Inc. |
Description: IC HD RADIO PROCESSOR 144HLQFP Packaging: Tape & Reel (TR) Part Status: Obsolete |
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TDA18274HN/C1,551 | NXP USA Inc. | Description: IC VIDEO TUNER 40HVQFN |
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MKE15Z128VLL7 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 72MHz Program Memory Size: 128KB (128K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 32K x 8 Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 28x12b SAR; D/A 1x8b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: FlexIO, I2C, SPI, UART/USART Peripherals: DMA, LVD, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Part Status: Active Number of I/O: 89 DigiKey Programmable: Not Verified |
на замовлення 6570 шт: термін постачання 21-31 дні (днів) |
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NHS3152DBUL | NXP USA Inc. |
![]() Packaging: Bulk For Use With/Related Products: NHS3152 Frequency: 13.56MHz Type: Near Field Communication (NFC) Supplied Contents: Board(s) |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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NHS3152TEMOADKUL | NXP USA Inc. |
![]() Packaging: Bulk For Use With/Related Products: NHS3152 Frequency: 13.56MHz Type: Near Field Communication (NFC) Supplied Contents: Board(s) |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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MCIMX6V7DVN10AB | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 432-TFBGA Mounting Type: Surface Mount Speed: 1GHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V Supplier Device Package: 432-MAPBGA (13x13) USB: USB 2.0 OTG + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LPDDR3 Graphics Acceleration: Yes Display & Interface Controllers: EPDC, LCD Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS Part Status: Active |
на замовлення 114 шт: термін постачання 21-31 дні (днів) |
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JN516X-EK001Z |
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Виробник: NXP USA Inc.
Description: EVAL KIT JN516X
Packaging: Bulk
For Use With/Related Products: JN516x
Frequency: 2.4GHz
Type: Transceiver; 802.15.4 (ZigBee®)
Supplied Contents: Board(s)
Part Status: Obsolete
Description: EVAL KIT JN516X
Packaging: Bulk
For Use With/Related Products: JN516x
Frequency: 2.4GHz
Type: Transceiver; 802.15.4 (ZigBee®)
Supplied Contents: Board(s)
Part Status: Obsolete
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E1TDA19978/KIT,598 |
Виробник: NXP USA Inc.
Description: EVALKIT TDA19978RX+TDA19978
Packaging: Box
Function: Video Processing
Type: Video
Utilized IC / Part: TDA19978
Supplied Contents: Board(s)
Part Status: Obsolete
Description: EVALKIT TDA19978RX+TDA19978
Packaging: Box
Function: Video Processing
Type: Video
Utilized IC / Part: TDA19978
Supplied Contents: Board(s)
Part Status: Obsolete
товар відсутній
E1TDA19988AET/KIT, |
Виробник: NXP USA Inc.
Description: KIT MB+DBTDA19988+TDA19978
Packaging: Box
Function: Video Processing
Type: Video
Utilized IC / Part: TDA19978
Supplied Contents: Board(s)
Part Status: Obsolete
Description: KIT MB+DBTDA19988+TDA19978
Packaging: Box
Function: Video Processing
Type: Video
Utilized IC / Part: TDA19978
Supplied Contents: Board(s)
Part Status: Obsolete
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E1TDA9984A/KIT,598 |
Виробник: NXP USA Inc.
Description: EVALKIT TDA9984AHWC1HLD+19978N2T
Packaging: Box
Function: Video Processing
Type: Video
Utilized IC / Part: TDA19978
Supplied Contents: Board(s)
Part Status: Obsolete
Description: EVALKIT TDA9984AHWC1HLD+19978N2T
Packaging: Box
Function: Video Processing
Type: Video
Utilized IC / Part: TDA19978
Supplied Contents: Board(s)
Part Status: Obsolete
товар відсутній
MC33901SNEF |
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER 1/1 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 8-SOIC
Part Status: Obsolete
Description: IC TRANSCEIVER 1/1 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 8-SOIC
Part Status: Obsolete
товар відсутній
MC33901SNEFR2 |
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER 1/1 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 8-SOIC
Part Status: Obsolete
Description: IC TRANSCEIVER 1/1 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 8-SOIC
Part Status: Obsolete
товар відсутній
MC33909D3AD |
Виробник: NXP USA Inc.
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
товар відсутній
MC33909D3ADR2 |
Виробник: NXP USA Inc.
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
товар відсутній
MC33909D5AD |
Виробник: NXP USA Inc.
Description: SBC 5V 1CAN 2LIN 6SG HLQFP48
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Description: SBC 5V 1CAN 2LIN 6SG HLQFP48
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
товар відсутній
MC33909D5ADR2 |
Виробник: NXP USA Inc.
Description: SBC 5V 1CAN 2LIN 6SG HLQFP48
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Description: SBC 5V 1CAN 2LIN 6SG HLQFP48
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
товар відсутній
MC33909L3AD |
Виробник: NXP USA Inc.
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
товар відсутній
MC33909L3ADR2 |
Виробник: NXP USA Inc.
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
товар відсутній
MC33909L5AD |
Виробник: NXP USA Inc.
Description: SBC 5V 1CAN 1LIN 6SG HLQFP48
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Description: SBC 5V 1CAN 1LIN 6SG HLQFP48
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
товар відсутній
MC33909L5ADR2 |
Виробник: NXP USA Inc.
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
товар відсутній
MC33909N3AD |
Виробник: NXP USA Inc.
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
товар відсутній
MC33909N3ADR2 |
Виробник: NXP USA Inc.
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
товар відсутній
MC33909N5AD |
Виробник: NXP USA Inc.
Description: SBC SG 1 CAN 0 LIN HLQFP48
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Description: SBC SG 1 CAN 0 LIN HLQFP48
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
товар відсутній
MC33909N5ADR2 |
Виробник: NXP USA Inc.
Description: SBC SG 1 CAN 0 LIN HLQFP48
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Description: SBC SG 1 CAN 0 LIN HLQFP48
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
товар відсутній
MC33909Q3AD |
Виробник: NXP USA Inc.
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
товар відсутній
MC33909Q3ADR2 |
Виробник: NXP USA Inc.
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
товар відсутній
MC33909Q5AD |
Виробник: NXP USA Inc.
Description: SBC 5V 1CAN 4LIN 6SG HLQFP48
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Description: SBC 5V 1CAN 4LIN 6SG HLQFP48
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
товар відсутній
MC33909Q5ADR2 |
Виробник: NXP USA Inc.
Description: SBC 5V 1CAN 4LIN 6SG HLQFP48
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Description: SBC 5V 1CAN 4LIN 6SG HLQFP48
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
товар відсутній
MC34901WNEF |
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER 1/1 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 8-SOIC
Part Status: Obsolete
Description: IC TRANSCEIVER 1/1 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 8-SOIC
Part Status: Obsolete
товар відсутній
MC34901WNEFR2 |
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER 1/1 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 8-SOIC
Part Status: Obsolete
Description: IC TRANSCEIVER 1/1 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 8-SOIC
Part Status: Obsolete
товар відсутній
OM15039Z |
Виробник: NXP USA Inc.
Description: DEMO BD CONNECTOR RPSMA
Packaging: Box
Supplied Contents: Board(s)
Part Status: Obsolete
Description: DEMO BD CONNECTOR RPSMA
Packaging: Box
Supplied Contents: Board(s)
Part Status: Obsolete
товар відсутній
PC33663LEFR2 |
Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED SO14
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Description: IC INTERFACE SPECIALIZED SO14
Packaging: Tape & Reel (TR)
Part Status: Obsolete
товар відсутній
PC33909AD |
товар відсутній
PC33909ADR2 |
товар відсутній
PC34909AD |
товар відсутній
PC34909ADR2 |
товар відсутній
SAF7741HV/N115YK |
Виробник: NXP USA Inc.
Description: IC HD RADIO PROCESSOR 144HLQFP
Packaging: Tray
Part Status: Obsolete
Description: IC HD RADIO PROCESSOR 144HLQFP
Packaging: Tray
Part Status: Obsolete
товар відсутній
SAF7741HV/N115YY |
Виробник: NXP USA Inc.
Description: IC HD RADIO PROCESSOR 144HLQFP
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Description: IC HD RADIO PROCESSOR 144HLQFP
Packaging: Tape & Reel (TR)
Part Status: Obsolete
товар відсутній
SAF7741HV/N125YK |
Виробник: NXP USA Inc.
Description: IC HD RADIO PROCESSOR 144HLQFP
Packaging: Tray
Part Status: Obsolete
Description: IC HD RADIO PROCESSOR 144HLQFP
Packaging: Tray
Part Status: Obsolete
товар відсутній
SAF7741HV/N125YY |
Виробник: NXP USA Inc.
Description: IC HD RADIO PROCESSOR 144HLQFP
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Description: IC HD RADIO PROCESSOR 144HLQFP
Packaging: Tape & Reel (TR)
Part Status: Obsolete
товар відсутній
MKE15Z128VLL7 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 32K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 28x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 89
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 32K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 28x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 89
DigiKey Programmable: Not Verified
на замовлення 6570 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 494.2 грн |
10+ | 373.83 грн |
90+ | 309.49 грн |
990+ | 253.33 грн |
2430+ | 243.95 грн |
NHS3152DBUL |
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Виробник: NXP USA Inc.
Description: NHS3152 EVALUATION BOARD
Packaging: Bulk
For Use With/Related Products: NHS3152
Frequency: 13.56MHz
Type: Near Field Communication (NFC)
Supplied Contents: Board(s)
Description: NHS3152 EVALUATION BOARD
Packaging: Bulk
For Use With/Related Products: NHS3152
Frequency: 13.56MHz
Type: Near Field Communication (NFC)
Supplied Contents: Board(s)
на замовлення 1 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 4320.04 грн |
NHS3152TEMOADKUL |
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Виробник: NXP USA Inc.
Description: NHS3152 STARTER KIT
Packaging: Bulk
For Use With/Related Products: NHS3152
Frequency: 13.56MHz
Type: Near Field Communication (NFC)
Supplied Contents: Board(s)
Description: NHS3152 STARTER KIT
Packaging: Bulk
For Use With/Related Products: NHS3152
Frequency: 13.56MHz
Type: Near Field Communication (NFC)
Supplied Contents: Board(s)
на замовлення 1 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 9944.75 грн |
MCIMX6V7DVN10AB |
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Виробник: NXP USA Inc.
Description: IC MPU I.MX6SLL 1GHZ 432MAPBGA
Packaging: Tray
Package / Case: 432-TFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 432-MAPBGA (13x13)
USB: USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LPDDR3
Graphics Acceleration: Yes
Display & Interface Controllers: EPDC, LCD
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Part Status: Active
Description: IC MPU I.MX6SLL 1GHZ 432MAPBGA
Packaging: Tray
Package / Case: 432-TFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 432-MAPBGA (13x13)
USB: USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LPDDR3
Graphics Acceleration: Yes
Display & Interface Controllers: EPDC, LCD
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Part Status: Active
на замовлення 114 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 789.19 грн |
10+ | 607.39 грн |