Продукція > MILL-MAX MANUFACTURING CORP. > Всі товари виробника MILL-MAX MANUFACTURING CORP. (39583) > Сторінка 58 з 660

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116-93-628-41-003000 Mill-Max Manufacturing Corp. 2017-11%3A111.pdf Description: CONN IC DIP SOCKET 28POS GOLD
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
116-93-628-41-006000 Mill-Max Manufacturing Corp. 111.PDF Description: CONN IC DIP SOCKET 28POS GOLD
товар відсутній
116-93-628-41-007000 Mill-Max Manufacturing Corp. 111.PDF Description: CONN IC DIP SOCKET 28POS GOLD
товар відсутній
116-93-628-41-008000 Mill-Max Manufacturing Corp. 111.PDF Description: CONN IC DIP SOCKET 28POS GOLD
товар відсутній
116-93-632-41-001000 Mill-Max Manufacturing Corp. 111.PDF Description: CONN IC DIP SOCKET 32POS GOLD
товар відсутній
116-93-632-41-003000 Mill-Max Manufacturing Corp. 111.PDF Description: CONN IC DIP SOCKET 32POS GOLD
товар відсутній
116-93-632-41-006000 116-93-632-41-006000 Mill-Max Manufacturing Corp. 111.PDF Description: CONN IC DIP SOCKET 32POS GOLD
на замовлення 1 шт:
термін постачання 21-31 дні (днів)
116-93-632-41-007000 Mill-Max Manufacturing Corp. 111.PDF Description: CONN IC DIP SOCKET 32POS GOLD
товар відсутній
116-93-632-41-008000 Mill-Max Manufacturing Corp. 111.PDF Description: CONN IC DIP SOCKET 32POS GOLD
товар відсутній
116-93-636-41-001000 Mill-Max Manufacturing Corp. 111.PDF Description: CONN IC DIP SOCKET 36POS GOLD
товар відсутній
116-93-636-41-003000 Mill-Max Manufacturing Corp. 111.PDF Description: CONN IC DIP SOCKET 36POS GOLD
товар відсутній
116-93-636-41-006000 Mill-Max Manufacturing Corp. 111.PDF Description: CONN IC DIP SOCKET 36POS GOLD
товар відсутній
116-93-636-41-007000 Mill-Max Manufacturing Corp. 111.PDF Description: CONN IC DIP SOCKET 36POS GOLD
товар відсутній
116-93-636-41-008000 Mill-Max Manufacturing Corp. 111.PDF Description: CONN IC DIP SOCKET 36POS GOLD
товар відсутній
116-93-640-41-001000 Mill-Max Manufacturing Corp. 111.PDF Description: CONN IC DIP SOCKET 40POS GOLD
товар відсутній
116-93-640-41-003000 Mill-Max Manufacturing Corp. 111.PDF Description: CONN IC DIP SOCKET 40POS GOLD
товар відсутній
116-93-640-41-006000 Mill-Max Manufacturing Corp. 111.PDF Description: CONN IC DIP SOCKET 40POS GOLD
товар відсутній
116-93-640-41-007000 Mill-Max Manufacturing Corp. 111.PDF Description: CONN IC DIP SOCKET 40POS GOLD
товар відсутній
116-93-640-41-008000 Mill-Max Manufacturing Corp. 111.PDF Description: CONN IC DIP SOCKET 40POS GOLD
товар відсутній
116-93-642-41-001000 Mill-Max Manufacturing Corp. 111.PDF Description: CONN IC DIP SOCKET 42POS GOLD
товар відсутній
116-93-642-41-003000 Mill-Max Manufacturing Corp. 111.PDF Description: CONN IC DIP SOCKET 42POS GOLD
товар відсутній
116-93-642-41-006000 Mill-Max Manufacturing Corp. 111.PDF Description: CONN IC DIP SOCKET 42POS GOLD
товар відсутній
116-93-642-41-007000 Mill-Max Manufacturing Corp. 111.pdf Description: CONN IC DIP SOCKET 42POS GOLD
товар відсутній
116-93-642-41-008000 Mill-Max Manufacturing Corp. 111.PDF Description: CONN IC DIP SOCKET 42POS GOLD
товар відсутній
116-93-648-41-001000 Mill-Max Manufacturing Corp. 2017-11%3A111.pdf Description: CONN IC DIP SOCKET 48POS GOLD
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
116-93-648-41-003000 Mill-Max Manufacturing Corp. 2017-11%3A111.pdf Description: CONN IC DIP SOCKET 48POS GOLD
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
116-93-648-41-006000 Mill-Max Manufacturing Corp. 2017-11%3A111.pdf Description: CONN IC DIP SOCKET 48POS GOLD
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
116-93-648-41-007000 Mill-Max Manufacturing Corp. 2017-11%3A111.pdf Description: CONN IC DIP SOCKET 48POS GOLD
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
116-93-648-41-008000 Mill-Max Manufacturing Corp. 2017-11%3A111.pdf Description: CONN IC DIP SOCKET 48POS GOLD
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
116-93-650-41-001000 Mill-Max Manufacturing Corp. 111.PDF Description: CONN IC DIP SOCKET 50POS GOLD
товар відсутній
116-93-650-41-003000 Mill-Max Manufacturing Corp. 111.PDF Description: CONN IC DIP SOCKET 50POS GOLD
товар відсутній
116-93-650-41-006000 Mill-Max Manufacturing Corp. 111.PDF Description: CONN IC DIP SOCKET 50POS GOLD
товар відсутній
116-93-650-41-007000 Mill-Max Manufacturing Corp. 111.PDF Description: CONN IC DIP SOCKET 50POS GOLD
товар відсутній
116-93-650-41-008000 Mill-Max Manufacturing Corp. 111.PDF Description: CONN IC DIP SOCKET 50POS GOLD
товар відсутній
116-93-652-41-001000 Mill-Max Manufacturing Corp. 111.PDF Description: CONN IC DIP SOCKET 52POS GOLD
товар відсутній
116-93-652-41-003000 Mill-Max Manufacturing Corp. 111.PDF Description: CONN IC DIP SOCKET 52POS GOLD
товар відсутній
116-93-652-41-006000 Mill-Max Manufacturing Corp. 111.PDF Description: CONN IC DIP SOCKET 52POS GOLD
товар відсутній
116-93-652-41-007000 Mill-Max Manufacturing Corp. 111.PDF Description: CONN IC DIP SOCKET 52POS GOLD
товар відсутній
116-93-652-41-008000 Mill-Max Manufacturing Corp. 111.PDF Description: CONN IC DIP SOCKET 52POS GOLD
товар відсутній
116-93-950-41-001000 Mill-Max Manufacturing Corp. 111.pdf Description: CONN IC DIP SOCKET 50POS GOLD
товар відсутній
116-93-950-41-003000 Mill-Max Manufacturing Corp. 111.pdf Description: CONN IC DIP SOCKET 50POS GOLD
товар відсутній
116-93-950-41-006000 Mill-Max Manufacturing Corp. 111.pdf Description: CONN IC DIP SOCKET 50POS GOLD
товар відсутній
116-93-950-41-007000 Mill-Max Manufacturing Corp. 111.pdf Description: CONN IC DIP SOCKET 50POS GOLD
товар відсутній
116-93-950-41-008000 Mill-Max Manufacturing Corp. 111.pdf Description: CONN IC DIP SOCKET 50POS GOLD
товар відсутній
116-93-952-41-001000 Mill-Max Manufacturing Corp. 111.pdf Description: CONN IC DIP SOCKET 52POS GOLD
товар відсутній
116-93-952-41-003000 Mill-Max Manufacturing Corp. 111.pdf Description: CONN IC DIP SOCKET 52POS GOLD
товар відсутній
116-93-952-41-006000 Mill-Max Manufacturing Corp. 111.pdf Description: CONN IC DIP SOCKET 52POS GOLD
товар відсутній
116-93-952-41-007000 Mill-Max Manufacturing Corp. 111.pdf Description: CONN IC DIP SOCKET 52POS GOLD
товар відсутній
116-93-952-41-008000 Mill-Max Manufacturing Corp. 111.pdf Description: CONN IC DIP SOCKET 52POS GOLD
товар відсутній
116-93-964-41-001000 Mill-Max Manufacturing Corp. 2017-11%3A111.pdf Description: CONN IC DIP SOCKET 64POS GOLD
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 64 (2 x 32)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
116-93-964-41-003000 Mill-Max Manufacturing Corp. 2017-11%3A111.pdf Description: CONN IC DIP SOCKET 64POS GOLD
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 64 (2 x 32)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
116-93-964-41-006000 Mill-Max Manufacturing Corp. 2017-11%3A111.pdf Description: CONN IC DIP SOCKET 64POS GOLD
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 64 (2 x 32)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
116-93-964-41-007000 Mill-Max Manufacturing Corp. 2017-11%3A111.pdf Description: CONN IC DIP SOCKET 64POS GOLD
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 64 (2 x 32)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
116-93-964-41-008000 Mill-Max Manufacturing Corp. 2017-11%3A111.pdf Description: CONN IC DIP SOCKET 64POS GOLD
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 64 (2 x 32)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
121-13-210-41-001000 Mill-Max Manufacturing Corp. 109.PDF Description: CONN IC DIP SOCKET 10POS GOLD
товар відсутній
121-13-304-41-001000 Mill-Max Manufacturing Corp. 109.PDF Description: CONN IC DIP SOCKET 4POS GOLD
товар відсутній
121-13-306-41-001000 Mill-Max Manufacturing Corp. 109.PDF Description: CONN IC DIP SOCKET 6POS GOLD
товар відсутній
121-13-308-41-001000 121-13-308-41-001000 Mill-Max Manufacturing Corp. 2017-11%3A109.pdf Description: CONN IC DIP SOCKET 8POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 48 шт:
термін постачання 21-31 дні (днів)
1+1171.63 грн
10+ 977.53 грн
25+ 926.45 грн
121-13-310-41-001000 Mill-Max Manufacturing Corp. 2017-11%3A109.pdf Description: CONN IC DIP SOCKET 10POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
121-13-314-41-001000 Mill-Max Manufacturing Corp. 109.PDF Description: CONN IC DIP SOCKET 14POS GOLD
товар відсутній
116-93-628-41-003000 2017-11%3A111.pdf
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 28POS GOLD
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
116-93-628-41-006000 111.PDF
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 28POS GOLD
товар відсутній
116-93-628-41-007000 111.PDF
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 28POS GOLD
товар відсутній
116-93-628-41-008000 111.PDF
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 28POS GOLD
товар відсутній
116-93-632-41-001000 111.PDF
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 32POS GOLD
товар відсутній
116-93-632-41-003000 111.PDF
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 32POS GOLD
товар відсутній
116-93-632-41-006000 111.PDF
116-93-632-41-006000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 32POS GOLD
на замовлення 1 шт:
термін постачання 21-31 дні (днів)
116-93-632-41-007000 111.PDF
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 32POS GOLD
товар відсутній
116-93-632-41-008000 111.PDF
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 32POS GOLD
товар відсутній
116-93-636-41-001000 111.PDF
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 36POS GOLD
товар відсутній
116-93-636-41-003000 111.PDF
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 36POS GOLD
товар відсутній
116-93-636-41-006000 111.PDF
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 36POS GOLD
товар відсутній
116-93-636-41-007000 111.PDF
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 36POS GOLD
товар відсутній
116-93-636-41-008000 111.PDF
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 36POS GOLD
товар відсутній
116-93-640-41-001000 111.PDF
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 40POS GOLD
товар відсутній
116-93-640-41-003000 111.PDF
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 40POS GOLD
товар відсутній
116-93-640-41-006000 111.PDF
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 40POS GOLD
товар відсутній
116-93-640-41-007000 111.PDF
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 40POS GOLD
товар відсутній
116-93-640-41-008000 111.PDF
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 40POS GOLD
товар відсутній
116-93-642-41-001000 111.PDF
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 42POS GOLD
товар відсутній
116-93-642-41-003000 111.PDF
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 42POS GOLD
товар відсутній
116-93-642-41-006000 111.PDF
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 42POS GOLD
товар відсутній
116-93-642-41-007000 111.pdf
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 42POS GOLD
товар відсутній
116-93-642-41-008000 111.PDF
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 42POS GOLD
товар відсутній
116-93-648-41-001000 2017-11%3A111.pdf
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 48POS GOLD
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
116-93-648-41-003000 2017-11%3A111.pdf
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 48POS GOLD
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
116-93-648-41-006000 2017-11%3A111.pdf
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 48POS GOLD
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
116-93-648-41-007000 2017-11%3A111.pdf
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 48POS GOLD
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
116-93-648-41-008000 2017-11%3A111.pdf
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 48POS GOLD
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
116-93-650-41-001000 111.PDF
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 50POS GOLD
товар відсутній
116-93-650-41-003000 111.PDF
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 50POS GOLD
товар відсутній
116-93-650-41-006000 111.PDF
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 50POS GOLD
товар відсутній
116-93-650-41-007000 111.PDF
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 50POS GOLD
товар відсутній
116-93-650-41-008000 111.PDF
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 50POS GOLD
товар відсутній
116-93-652-41-001000 111.PDF
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 52POS GOLD
товар відсутній
116-93-652-41-003000 111.PDF
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 52POS GOLD
товар відсутній
116-93-652-41-006000 111.PDF
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 52POS GOLD
товар відсутній
116-93-652-41-007000 111.PDF
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 52POS GOLD
товар відсутній
116-93-652-41-008000 111.PDF
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 52POS GOLD
товар відсутній
116-93-950-41-001000 111.pdf
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 50POS GOLD
товар відсутній
116-93-950-41-003000 111.pdf
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 50POS GOLD
товар відсутній
116-93-950-41-006000 111.pdf
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 50POS GOLD
товар відсутній
116-93-950-41-007000 111.pdf
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 50POS GOLD
товар відсутній
116-93-950-41-008000 111.pdf
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 50POS GOLD
товар відсутній
116-93-952-41-001000 111.pdf
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 52POS GOLD
товар відсутній
116-93-952-41-003000 111.pdf
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 52POS GOLD
товар відсутній
116-93-952-41-006000 111.pdf
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 52POS GOLD
товар відсутній
116-93-952-41-007000 111.pdf
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 52POS GOLD
товар відсутній
116-93-952-41-008000 111.pdf
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 52POS GOLD
товар відсутній
116-93-964-41-001000 2017-11%3A111.pdf
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 64POS GOLD
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 64 (2 x 32)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
116-93-964-41-003000 2017-11%3A111.pdf
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 64POS GOLD
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 64 (2 x 32)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
116-93-964-41-006000 2017-11%3A111.pdf
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 64POS GOLD
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 64 (2 x 32)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
116-93-964-41-007000 2017-11%3A111.pdf
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 64POS GOLD
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 64 (2 x 32)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
116-93-964-41-008000 2017-11%3A111.pdf
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 64POS GOLD
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 64 (2 x 32)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
121-13-210-41-001000 109.PDF
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 10POS GOLD
товар відсутній
121-13-304-41-001000 109.PDF
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 4POS GOLD
товар відсутній
121-13-306-41-001000 109.PDF
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 6POS GOLD
товар відсутній
121-13-308-41-001000 2017-11%3A109.pdf
121-13-308-41-001000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 8POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 48 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+1171.63 грн
10+ 977.53 грн
25+ 926.45 грн
121-13-310-41-001000 2017-11%3A109.pdf
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 10POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
121-13-314-41-001000 109.PDF
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 14POS GOLD
товар відсутній
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