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без ПДВ
116-93-316-41-003000 Mill-Max Manufacturing Corp. 111.PDF Description: CONN IC DIP SOCKET 16POS GOLD
товар відсутній
116-93-316-41-006000 Mill-Max Manufacturing Corp. 111.PDF Description: CONN IC DIP SOCKET 16POS GOLD
товар відсутній
116-93-316-41-007000 Mill-Max Manufacturing Corp. 111.PDF Description: CONN IC DIP SOCKET 16POS GOLD
товар відсутній
116-93-316-41-008000 Mill-Max Manufacturing Corp. 111.PDF Description: CONN IC DIP SOCKET 16POS GOLD
товар відсутній
116-93-318-41-001000 Mill-Max Manufacturing Corp. 111.PDF Description: CONN IC DIP SOCKET 18POS GOLD
товар відсутній
116-93-318-41-003000 Mill-Max Manufacturing Corp. 111.PDF Description: CONN IC DIP SOCKET 18POS GOLD
товар відсутній
116-93-318-41-006000 Mill-Max Manufacturing Corp. 2017-11%3A111.pdf Description: CONN IC DIP SOCKET 18POS GOLD
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
116-93-318-41-007000 116-93-318-41-007000 Mill-Max Manufacturing Corp. 2017-11%3A111.pdf Description: CONN IC DIP SOCKET 18POS GOLD
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 892 шт:
термін постачання 21-31 дні (днів)
1+1376.06 грн
22+ 1148.1 грн
44+ 1072.39 грн
110+ 888 грн
264+ 828.8 грн
506+ 811.03 грн
116-93-318-41-008000 Mill-Max Manufacturing Corp. 2017-11%3A111.pdf Description: CONN IC DIP SOCKET 18POS GOLD
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
116-93-320-41-001000 Mill-Max Manufacturing Corp. 2017-11%3A111.pdf Description: CONN IC DIP SOCKET 20POS GOLD
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
116-93-320-41-003000 Mill-Max Manufacturing Corp. 111.PDF Description: CONN IC DIP SOCKET 20POS GOLD
товар відсутній
116-93-320-41-006000 Mill-Max Manufacturing Corp. 111.PDF Description: CONN IC DIP SOCKET 20POS GOLD
товар відсутній
116-93-320-41-007000 Mill-Max Manufacturing Corp. 111.PDF Description: CONN IC DIP SOCKET 20POS GOLD
товар відсутній
116-93-320-41-008000 Mill-Max Manufacturing Corp. 111.PDF Description: CONN IC DIP SOCKET 20POS GOLD
товар відсутній
116-93-322-41-001000 Mill-Max Manufacturing Corp. 111.PDF Description: CONN IC DIP SOCKET 22POS GOLD
товар відсутній
116-93-322-41-003000 Mill-Max Manufacturing Corp. 111.PDF Description: CONN IC DIP SOCKET 22POS GOLD
товар відсутній
116-93-322-41-006000 Mill-Max Manufacturing Corp. 111.PDF Description: CONN IC DIP SOCKET 22POS GOLD
товар відсутній
116-93-322-41-007000 Mill-Max Manufacturing Corp. 111.PDF Description: CONN IC DIP SOCKET 22POS GOLD
товар відсутній
116-93-322-41-008000 Mill-Max Manufacturing Corp. 111.PDF Description: CONN IC DIP SOCKET 22POS GOLD
товар відсутній
116-93-324-41-001000 Mill-Max Manufacturing Corp. 111.PDF Description: CONN IC DIP SOCKET 24POS GOLD
товар відсутній
116-93-324-41-003000 Mill-Max Manufacturing Corp. 111.PDF Description: CONN IC DIP SOCKET 24POS GOLD
товар відсутній
116-93-324-41-006000 Mill-Max Manufacturing Corp. 111.PDF Description: CONN IC DIP SOCKET 24POS GOLD
товар відсутній
116-93-324-41-007000 Mill-Max Manufacturing Corp. 111.PDF Description: CONN IC DIP SOCKET 24POS GOLD
товар відсутній
116-93-324-41-008000 Mill-Max Manufacturing Corp. 111.PDF Description: CONN IC DIP SOCKET 24POS GOLD
товар відсутній
116-93-328-41-001000 Mill-Max Manufacturing Corp. 111.PDF Description: CONN IC DIP SOCKET 28POS GOLD
товар відсутній
116-93-328-41-003000 Mill-Max Manufacturing Corp. 2017-11%3A111.pdf Description: CONN IC DIP SOCKET 28POS GOLD
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
116-93-328-41-006000 Mill-Max Manufacturing Corp. 111.PDF Description: CONN IC DIP SOCKET 28POS GOLD
товар відсутній
116-93-328-41-007000 Mill-Max Manufacturing Corp. 111.PDF Description: CONN IC DIP SOCKET 28POS GOLD
товар відсутній
116-93-328-41-008000 Mill-Max Manufacturing Corp. 111.PDF Description: CONN IC DIP SOCKET 28POS GOLD
товар відсутній
116-93-420-41-001000 Mill-Max Manufacturing Corp. 111.PDF Description: CONN IC DIP SOCKET 20POS GOLD
товар відсутній
116-93-420-41-003000 Mill-Max Manufacturing Corp. 111.PDF Description: CONN IC DIP SOCKET 20POS GOLD
товар відсутній
116-93-420-41-006000 Mill-Max Manufacturing Corp. 111.PDF Description: CONN IC DIP SOCKET 20POS GOLD
товар відсутній
116-93-420-41-007000 Mill-Max Manufacturing Corp. 111.PDF Description: CONN IC DIP SOCKET 20POS GOLD
товар відсутній
116-93-420-41-008000 Mill-Max Manufacturing Corp. 111.PDF Description: CONN IC DIP SOCKET 20POS GOLD
товар відсутній
116-93-422-41-001000 Mill-Max Manufacturing Corp. 111.PDF Description: CONN IC DIP SOCKET 22POS GOLD
товар відсутній
116-93-422-41-003000 Mill-Max Manufacturing Corp. 111.PDF Description: CONN IC DIP SOCKET 22POS GOLD
товар відсутній
116-93-422-41-006000 Mill-Max Manufacturing Corp. 111.PDF Description: CONN IC DIP SOCKET 22POS GOLD
товар відсутній
116-93-422-41-007000 Mill-Max Manufacturing Corp. 111.PDF Description: CONN IC DIP SOCKET 22POS GOLD
товар відсутній
116-93-422-41-008000 Mill-Max Manufacturing Corp. 111.PDF Description: CONN IC DIP SOCKET 22POS GOLD
товар відсутній
116-93-424-41-001000 Mill-Max Manufacturing Corp. 111.PDF Description: CONN IC DIP SOCKET 24POS GOLD
товар відсутній
116-93-424-41-003000 116-93-424-41-003000 Mill-Max Manufacturing Corp. 2017-11%3A111.pdf Description: CONN IC DIP SOCKET 24POS GOLD
товар відсутній
116-93-424-41-006000 116-93-424-41-006000 Mill-Max Manufacturing Corp. 111.PDF Description: CONN IC DIP SOCKET 24POS GOLD
на замовлення 4 шт:
термін постачання 21-31 дні (днів)
116-93-424-41-007000 Mill-Max Manufacturing Corp. 111.PDF Description: CONN IC DIP SOCKET 24POS GOLD
товар відсутній
116-93-424-41-008000 Mill-Max Manufacturing Corp. 111.PDF Description: CONN IC DIP SOCKET 24POS GOLD
товар відсутній
116-93-428-41-001000 Mill-Max Manufacturing Corp. 111.PDF Description: CONN IC DIP SOCKET 28POS GOLD
товар відсутній
116-93-428-41-003000 Mill-Max Manufacturing Corp. 2017-11%3A111.pdf Description: CONN IC DIP SOCKET 28POS GOLD
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
116-93-428-41-006000 Mill-Max Manufacturing Corp. 111.PDF Description: CONN IC DIP SOCKET 28POS GOLD
товар відсутній
116-93-428-41-007000 Mill-Max Manufacturing Corp. 111.PDF Description: CONN IC DIP SOCKET 28POS GOLD
товар відсутній
116-93-428-41-008000 Mill-Max Manufacturing Corp. 111.PDF Description: CONN IC DIP SOCKET 28POS GOLD
товар відсутній
116-93-432-41-001000 Mill-Max Manufacturing Corp. 2017-11%3A111.pdf Description: CONN IC DIP SOCKET 32POS GOLD
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
116-93-432-41-003000 Mill-Max Manufacturing Corp. 2017-11%3A111.pdf Description: CONN IC DIP SOCKET 32POS GOLD
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
116-93-432-41-006000 Mill-Max Manufacturing Corp. 2017-11%3A111.pdf Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
116-93-432-41-007000 Mill-Max Manufacturing Corp. 2017-11%3A111.pdf Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
116-93-432-41-008000 Mill-Max Manufacturing Corp. 2017-11%3A111.pdf Description: CONN IC DIP SOCKET 32POS GOLD
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
116-93-624-41-001000 Mill-Max Manufacturing Corp. 111.pdf Description: CONN IC DIP SOCKET 24POS GOLD
товар відсутній
116-93-624-41-003000 Mill-Max Manufacturing Corp. 111.pdf Description: CONN IC DIP SOCKET 24POS GOLD
товар відсутній
116-93-624-41-006000 Mill-Max Manufacturing Corp. 2017-11%3A111.pdf Description: CONN IC DIP SOCKET 24POS GOLD
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
116-93-624-41-007000 Mill-Max Manufacturing Corp. 111.pdf Description: CONN IC DIP SOCKET 24POS GOLD
товар відсутній
116-93-624-41-008000 Mill-Max Manufacturing Corp. 111.pdf Description: CONN IC DIP SOCKET 24POS GOLD
товар відсутній
116-93-628-41-001000 Mill-Max Manufacturing Corp. 111.PDF Description: CONN IC DIP SOCKET 28POS GOLD
товар відсутній
116-93-316-41-003000 111.PDF
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 16POS GOLD
товар відсутній
116-93-316-41-006000 111.PDF
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 16POS GOLD
товар відсутній
116-93-316-41-007000 111.PDF
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 16POS GOLD
товар відсутній
116-93-316-41-008000 111.PDF
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 16POS GOLD
товар відсутній
116-93-318-41-001000 111.PDF
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 18POS GOLD
товар відсутній
116-93-318-41-003000 111.PDF
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 18POS GOLD
товар відсутній
116-93-318-41-006000 2017-11%3A111.pdf
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 18POS GOLD
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
116-93-318-41-007000 2017-11%3A111.pdf
116-93-318-41-007000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 18POS GOLD
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 892 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+1376.06 грн
22+ 1148.1 грн
44+ 1072.39 грн
110+ 888 грн
264+ 828.8 грн
506+ 811.03 грн
116-93-318-41-008000 2017-11%3A111.pdf
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 18POS GOLD
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
116-93-320-41-001000 2017-11%3A111.pdf
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 20POS GOLD
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
116-93-320-41-003000 111.PDF
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 20POS GOLD
товар відсутній
116-93-320-41-006000 111.PDF
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 20POS GOLD
товар відсутній
116-93-320-41-007000 111.PDF
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 20POS GOLD
товар відсутній
116-93-320-41-008000 111.PDF
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 20POS GOLD
товар відсутній
116-93-322-41-001000 111.PDF
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 22POS GOLD
товар відсутній
116-93-322-41-003000 111.PDF
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 22POS GOLD
товар відсутній
116-93-322-41-006000 111.PDF
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 22POS GOLD
товар відсутній
116-93-322-41-007000 111.PDF
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 22POS GOLD
товар відсутній
116-93-322-41-008000 111.PDF
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 22POS GOLD
товар відсутній
116-93-324-41-001000 111.PDF
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 24POS GOLD
товар відсутній
116-93-324-41-003000 111.PDF
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 24POS GOLD
товар відсутній
116-93-324-41-006000 111.PDF
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 24POS GOLD
товар відсутній
116-93-324-41-007000 111.PDF
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 24POS GOLD
товар відсутній
116-93-324-41-008000 111.PDF
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 24POS GOLD
товар відсутній
116-93-328-41-001000 111.PDF
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 28POS GOLD
товар відсутній
116-93-328-41-003000 2017-11%3A111.pdf
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 28POS GOLD
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
116-93-328-41-006000 111.PDF
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 28POS GOLD
товар відсутній
116-93-328-41-007000 111.PDF
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 28POS GOLD
товар відсутній
116-93-328-41-008000 111.PDF
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 28POS GOLD
товар відсутній
116-93-420-41-001000 111.PDF
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 20POS GOLD
товар відсутній
116-93-420-41-003000 111.PDF
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 20POS GOLD
товар відсутній
116-93-420-41-006000 111.PDF
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 20POS GOLD
товар відсутній
116-93-420-41-007000 111.PDF
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 20POS GOLD
товар відсутній
116-93-420-41-008000 111.PDF
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 20POS GOLD
товар відсутній
116-93-422-41-001000 111.PDF
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 22POS GOLD
товар відсутній
116-93-422-41-003000 111.PDF
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 22POS GOLD
товар відсутній
116-93-422-41-006000 111.PDF
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 22POS GOLD
товар відсутній
116-93-422-41-007000 111.PDF
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 22POS GOLD
товар відсутній
116-93-422-41-008000 111.PDF
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 22POS GOLD
товар відсутній
116-93-424-41-001000 111.PDF
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 24POS GOLD
товар відсутній
116-93-424-41-003000 2017-11%3A111.pdf
116-93-424-41-003000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 24POS GOLD
товар відсутній
116-93-424-41-006000 111.PDF
116-93-424-41-006000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 24POS GOLD
на замовлення 4 шт:
термін постачання 21-31 дні (днів)
116-93-424-41-007000 111.PDF
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 24POS GOLD
товар відсутній
116-93-424-41-008000 111.PDF
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 24POS GOLD
товар відсутній
116-93-428-41-001000 111.PDF
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 28POS GOLD
товар відсутній
116-93-428-41-003000 2017-11%3A111.pdf
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 28POS GOLD
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
116-93-428-41-006000 111.PDF
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 28POS GOLD
товар відсутній
116-93-428-41-007000 111.PDF
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 28POS GOLD
товар відсутній
116-93-428-41-008000 111.PDF
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 28POS GOLD
товар відсутній
116-93-432-41-001000 2017-11%3A111.pdf
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 32POS GOLD
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
116-93-432-41-003000 2017-11%3A111.pdf
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 32POS GOLD
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
116-93-432-41-006000 2017-11%3A111.pdf
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
116-93-432-41-007000 2017-11%3A111.pdf
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
116-93-432-41-008000 2017-11%3A111.pdf
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 32POS GOLD
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
116-93-624-41-001000 111.pdf
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 24POS GOLD
товар відсутній
116-93-624-41-003000 111.pdf
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 24POS GOLD
товар відсутній
116-93-624-41-006000 2017-11%3A111.pdf
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 24POS GOLD
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
116-93-624-41-007000 111.pdf
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 24POS GOLD
товар відсутній
116-93-624-41-008000 111.pdf
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 24POS GOLD
товар відсутній
116-93-628-41-001000 111.PDF
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 28POS GOLD
товар відсутній
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