Продукція > HARIMATEC INC. > Всі товари виробника HARIMATEC INC. (119) > Сторінка 2 з 2
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Фото | Назва | Виробник | Інформація |
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386840 | Harimatec Inc. |
![]() Packaging: Spool Diameter: 0.024" (0.61mm) Wire Gauge: 22 AWG, 23 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 1 lb (454 g) Process: Leaded Flux Type: Rosin Activated (RA) |
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386844 | Harimatec Inc. |
![]() Packaging: Bulk Diameter: 0.015" (0.38mm) Wire Gauge: 27 AWG, 28 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 8.8 oz (250g) Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C) |
на замовлення 56 шт: термін постачання 21-31 дні (днів) |
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386848 | Harimatec Inc. |
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386851 | Harimatec Inc. |
![]() Packaging: Bulk Diameter: 0.022" (0.56mm) Wire Gauge: 23 AWG, 24 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 1 lb (454 g) Process: Leaded Flux Type: No-Clean Part Status: Active |
на замовлення 26 шт: термін постачання 21-31 дні (днів) |
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386862 | Harimatec Inc. |
![]() Packaging: Bulk Diameter: 0.032" (0.81mm) Wire Gauge: 20 AWG, 21 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 1 lb (454 g) Process: Leaded Flux Type: No-Clean Part Status: Active |
товар відсутній |
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386876 | Harimatec Inc. |
![]() Packaging: Bulk Diameter: 0.024" (0.61mm) Wire Gauge: 22 AWG, 23 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 1 lb (454 g) Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C) |
на замовлення 13 шт: термін постачання 21-31 дні (днів) |
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386927 | Harimatec Inc. |
![]() Packaging: Bulk Diameter: 0.032" (0.81mm) Wire Gauge: 20 AWG, 21 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 1 lb (454 g) Process: Leaded Flux Type: No-Clean |
товар відсутній |
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389261 | Harimatec Inc. |
![]() Packaging: Bulk Diameter: 0.015" (0.38mm) Wire Gauge: 27 AWG, 28 SWG Composition: Sn60Pb40 (60/40) Type: Wire Solder Melting Point: 361 ~ 374°F (183 ~ 190°C) Form: Spool, 8.8 oz (250g) Process: Leaded Flux Type: Rosin Activated (RA) Part Status: Active |
на замовлення 35 шт: термін постачання 21-31 дні (днів) |
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389283 | Harimatec Inc. |
![]() Packaging: Bulk Diameter: 0.015" (0.38mm) Wire Gauge: 27 AWG, 28 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 8.8 oz (250g) Process: Leaded Flux Type: Water Soluble |
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392249 | Harimatec Inc. |
![]() Packaging: Bulk Diameter: 0.064" (1.63mm) Wire Gauge: 14 AWG, 16 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 1 lb (454 g) Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C) |
на замовлення 28 шт: термін постачання 21-31 дні (днів) |
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395437 | Harimatec Inc. |
![]() Packaging: Bulk Diameter: 0.028" (0.71mm) Wire Gauge: 21 AWG, 22 SWG Composition: Pb93.5Sn5Ag1.5 (93.5/5/1.5) Type: Wire Solder Melting Point: 565 ~ 574°F (296 ~ 301°C) Form: Spool, 17.64 oz (500g) Process: Leaded Flux Type: Rosin Activated (RA) |
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395439 | Harimatec Inc. |
![]() Packaging: Bulk Diameter: 0.050" (1.27mm) Wire Gauge: 16 AWG, 18 SWG Composition: Pb93.5Sn5Ag1.5 (93.5/5/1.5) Type: Wire Solder Melting Point: 565 ~ 574°F (296 ~ 301°C) Form: Spool, 17.64 oz (500g) Process: Leaded Flux Type: Rosin Activated (RA) |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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395451 | Harimatec Inc. |
![]() Packaging: Bulk Diameter: 0.032" (0.81mm) Wire Gauge: 20 AWG, 21 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 1 lb (454 g) Process: Leaded Flux Type: No-Clean Part Status: Active |
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395465 | Harimatec Inc. |
![]() Packaging: Bulk Diameter: 0.064" (1.63mm) Wire Gauge: 14 AWG, 16 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 1 lb (454 g) Process: Leaded Flux Type: No-Clean Part Status: Active |
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395467 | Harimatec Inc. |
![]() Packaging: Bulk Diameter: 0.048" (1.22mm) Wire Gauge: 16 AWG, 18 SWG Composition: Sn60Pb40 (60/40) Type: Wire Solder Melting Point: 361 ~ 374°F (183 ~ 190°C) Form: Spool, 17.64 oz (500g) Process: Leaded Flux Type: Rosin Activated (RA) Part Status: Active |
на замовлення 11 шт: термін постачання 21-31 дні (днів) |
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397102 | Harimatec Inc. |
![]() Packaging: Bulk Diameter: 0.048" (1.22mm) Wire Gauge: 16 AWG, 18 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 1 lb (454 g) Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C) |
на замовлення 8 шт: термін постачання 21-31 дні (днів) |
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397127 | Harimatec Inc. |
![]() Packaging: Spool Diameter: 0.024" (0.61mm) Wire Gauge: 22 AWG, 23 SWG Composition: Sn62Pb38 (62/38) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 17.64 oz (500g) Process: Leaded Flux Type: Rosin Activated (RA) |
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397952 | Harimatec Inc. |
![]() Packaging: Bulk Diameter: 0.022" (0.56mm) Wire Gauge: 23 AWG, 24 SWG Composition: Pb93.5Sn5Ag1.5 (93.5/5/1.5) Type: Wire Solder Melting Point: 565 ~ 574°F (296 ~ 301°C) Form: Spool, 8.8 oz (250g) Process: Leaded Flux Type: Rosin Activated (RA) |
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397982 | Harimatec Inc. |
![]() Packaging: Spool Diameter: 0.015" (0.38mm) Wire Gauge: 27 AWG, 28 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 8.8 oz (250g) Process: Leaded Flux Type: No-Clean Part Status: Obsolete |
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412183 | Harimatec Inc. |
![]() Packaging: Bulk Diameter: 0.040" (1.02mm) Wire Gauge: 18 AWG, 19 SWG Composition: Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7) Type: Wire Solder Melting Point: 423°F (217°C) Form: Spool, 1 lb (454 g) Process: Lead Free Flux Type: No-Clean Part Status: Obsolete Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C) |
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412185 | Harimatec Inc. |
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450314 | Harimatec Inc. |
![]() Packaging: Bulk Diameter: 0.022" (0.56mm) Wire Gauge: 23 AWG, 24 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 1 lb (454 g) Process: Leaded Flux Type: No-Clean Part Status: Active |
на замовлення 8 шт: термін постачання 21-31 дні (днів) |
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519430 | Harimatec Inc. |
![]() Packaging: Bulk Shipping Info: Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. Type: Flux - No Clean, Tacky Solder Form: Syringe, 0.35 oz (10g), 10cc Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
на замовлення 23 шт: термін постачання 21-31 дні (днів) |
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536290 | Harimatec Inc. |
![]() Packaging: Bulk Diameter: 0.128" (3.25mm) Wire Gauge: 8 AWG, 10 SWG Composition: Sn97Cu3 (97/3) Type: Wire Solder Form: Spool, 22.05 lbs (10kg) Process: Lead Free Part Status: Obsolete |
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544784 | Harimatec Inc. |
![]() Packaging: Bulk Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Mesh Type: 3 Process: Leaded Flux Type: Water Soluble Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
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550014 | Harimatec Inc. |
![]() Packaging: Dispenser Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Syringe, 2.65 oz (75g) Process: Leaded Flux Type: Water Soluble Storage/Refrigeration Temperature: 35°F ~ 50°F (2°C ~ 10°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
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556385 | Harimatec Inc. |
![]() Packaging: Bulk Length: 100' (30.5m) Type: No Clean Width: 0.060" (1.52mm) ESD Protection: Static Dissipative (SD) Product Type: Braid/Wick Part Status: Obsolete |
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583489 | Harimatec Inc. |
![]() Packaging: Bulk Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Cartridge, 0.88 oz (25g) Process: Leaded Flux Type: No-Clean Storage/Refrigeration Temperature: Room Temperature Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
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605500 | Harimatec Inc. |
![]() Packaging: Bulk Diameter: 0.022" (0.56mm) Wire Gauge: 23 AWG, 24 SWG Composition: Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7) Type: Wire Solder Melting Point: 423°F (217°C) Form: Spool, 5.51 lbs (2.5kg) Process: Lead Free Flux Type: No-Clean Part Status: Obsolete Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C) |
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673828 | Harimatec Inc. |
![]() Packaging: Bulk Diameter: 0.022" (0.56mm) Wire Gauge: 23 AWG, 24 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423°F (217°C) Form: Spool, 8.8 oz (250g) Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C) |
на замовлення 96 шт: термін постачання 21-31 дні (днів) |
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673829 | Harimatec Inc. |
![]() Packaging: Bulk Diameter: 0.032" (0.81mm) Wire Gauge: 20 AWG, 21 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423°F (217°C) Form: Spool, 1 lb (454 g) Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C) |
на замовлення 71 шт: термін постачання 21-31 дні (днів) |
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673831 | Harimatec Inc. |
![]() Packaging: Bulk Diameter: 0.048" (1.22mm) Wire Gauge: 16 AWG, 18 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423°F (217°C) Form: Spool, 1 lb (454 g) Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C) |
на замовлення 29 шт: термін постачання 21-31 дні (днів) |
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673832 | Harimatec Inc. |
![]() Packaging: Bulk Diameter: 0.064" (1.63mm) Wire Gauge: 14 AWG, 16 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423°F (217°C) Form: Spool, 1 lb (454 g) Process: Lead Free Flux Type: No-Clean Part Status: Active |
на замовлення 10 шт: термін постачання 21-31 дні (днів) |
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680290 | Harimatec Inc. |
![]() Packaging: Bulk Composition: Sn99.3Cu0.7 (99.3/0.7) Type: Bar Solder Melting Point: 440 ~ 464°F (227 ~ 240°C) Form: Bar, 2.5 lbs (1.13kg) Process: Lead Free Part Status: Obsolete Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C) |
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692857 | Harimatec Inc. |
![]() Packaging: Bulk Diameter: 0.032" (0.81mm) Wire Gauge: 20 AWG, 21 SWG Composition: Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7) Type: Wire Solder Melting Point: 423°F (217°C) Form: Spool, 1 lb (454 g) Process: Lead Free Flux Type: No-Clean Part Status: Obsolete Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C) |
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706397 | Harimatec Inc. |
![]() Packaging: Bulk Type: Tip Tinner (Activator) Part Status: Obsolete |
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716856 | Harimatec Inc. |
![]() Packaging: Bulk Diameter: 0.064" (1.63mm) Wire Gauge: 14 AWG, 16 SWG Composition: Sn99.3Cu0.7 (99.3/0.7) Type: Wire Solder Melting Point: 440 ~ 464°F (227 ~ 240°C) Form: Spool, 2.20 lbs (1kg) Process: Lead Free Flux Type: No-Clean Part Status: Obsolete |
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721440 | Harimatec Inc. |
![]() Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423°F (217°C) Form: Jar, 17.64 oz (500g) Mesh Type: 3 Process: Lead Free Flux Type: No-Clean Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
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721471 | Harimatec Inc. |
![]() Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423°F (217°C) Form: Cartridge, 21.16 oz (600g) Mesh Type: 3 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
на замовлення 4 шт: термін постачання 21-31 дні (днів) |
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721472 | Harimatec Inc. |
![]() Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423°F (217°C) Form: Syringe, 2.65 oz (75g) Mesh Type: 3 Process: Lead Free Flux Type: No-Clean Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
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721473 | Harimatec Inc. |
![]() Packaging: Bulk Type: Solder Paste Form: Syringe, 1.06 oz (30g) Mesh Type: 3 Process: Lead Free Flux Type: No-Clean Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
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727190 | Harimatec Inc. |
![]() Packaging: Bulk Diameter: 0.022" (0.56mm) Wire Gauge: 23 AWG, 24 SWG Composition: Sn99.3Cu0.7 (99.3/0.7) Type: Wire Solder Melting Point: 440 ~ 464°F (227 ~ 240°C) Form: Spool, 1 lb (454 g) Process: Lead Free Flux Type: No-Clean Part Status: Obsolete |
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732977 | Harimatec Inc. |
![]() Packaging: Bulk Diameter: 0.064" (1.63mm) Wire Gauge: 14 AWG, 16 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423°F (217°C) Form: Spool, 1 lb (454 g) Process: Lead Free Flux Type: Water Soluble Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C) |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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732998 | Harimatec Inc. |
![]() Packaging: Bulk Diameter: 0.064" (1.63mm) Wire Gauge: 14 AWG, 16 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423°F (217°C) Form: Spool, 1 lb (454 g) Process: Lead Free Flux Type: No-Clean Part Status: Active |
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732999 | Harimatec Inc. |
![]() Packaging: Bulk Diameter: 0.048" (1.22mm) Wire Gauge: 16 AWG, 18 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423°F (217°C) Form: Spool, 1 lb (454 g) Process: Lead Free Flux Type: No-Clean |
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733001 | Harimatec Inc. |
![]() Packaging: Bulk Diameter: 0.022" (0.56mm) Wire Gauge: 23 AWG, 24 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423°F (217°C) Form: Spool, 8.8 oz (250g) Process: Lead Free Flux Type: No-Clean Part Status: Active |
на замовлення 762 шт: термін постачання 21-31 дні (днів) |
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733002 | Harimatec Inc. |
![]() Packaging: Bulk Diameter: 0.032" (0.81mm) Wire Gauge: 20 AWG, 21 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423°F (217°C) Form: Spool, 1 lb (454 g) Process: Lead Free Flux Type: No-Clean Part Status: Active |
на замовлення 54 шт: термін постачання 21-31 дні (днів) |
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733010 | Harimatec Inc. |
![]() Packaging: Bulk Diameter: 0.032" (0.81mm) Wire Gauge: 20 AWG, 21 SWG Composition: Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7) Type: Wire Solder Melting Point: 423°F (217°C) Form: Spool, 1 lb (454 g) Process: Lead Free Flux Type: No-Clean Part Status: Obsolete |
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733024 | Harimatec Inc. |
![]() Packaging: Bulk Diameter: 0.022" (0.56mm) Wire Gauge: 23 AWG, 24 SWG Composition: Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7) Type: Wire Solder Melting Point: 423°F (217°C) Form: Spool, 8.8 oz (250g) Process: Lead Free Flux Type: No-Clean Part Status: Obsolete Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C) |
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760088 | Harimatec Inc. |
![]() Packaging: Bulk Type: Flux - No Clean Form: Pen, 0.34 oz (9.64g) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
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796037 | Harimatec Inc. |
![]() Packaging: Bulk Diameter: 0.015" (0.38mm) Wire Gauge: 27 AWG, 28 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423°F (217°C) Form: Spool, 8.8 oz (250g) Process: Lead Free Flux Type: Rosin Mildly Activated (RMA) Part Status: Active |
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796065 | Harimatec Inc. |
![]() Packaging: Bulk Diameter: 0.015" (0.38mm) Wire Gauge: 27 AWG, 28 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423°F (217°C) Form: Spool, 8.8 oz (250g) Process: Lead Free Flux Type: No-Clean Part Status: Active |
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818006 | Harimatec Inc. |
![]() Packaging: Bulk Diameter: 0.028" (0.71mm) Wire Gauge: 21 AWG, 22 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 1 lb (454 g) Process: Leaded Flux Type: No-Clean Part Status: Active |
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838498 | Harimatec Inc. |
![]() Packaging: Bulk Diameter: 0.025" (0.64mm) Wire Gauge: 22 AWG, 23 SWG Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 8.8 oz (250g) Flux Type: No-Clean Part Status: Obsolete |
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848874 | Harimatec Inc. |
![]() Packaging: Bulk Diameter: 0.032" (0.81mm) Wire Gauge: 20 AWG, 21 SWG Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 1 lb (454 g) Flux Type: No-Clean |
на замовлення 17 шт: термін постачання 21-31 дні (днів) |
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865940 | Harimatec Inc. |
![]() Packaging: Bulk Diameter: 0.032" (0.81mm) Wire Gauge: 20 AWG, 21 SWG Composition: Sn99.3Cu0.7 (99.3/0.7) Type: Wire Solder Melting Point: 440 ~ 464°F (227 ~ 240°C) Form: Spool, 1 lb (454 g) Process: Lead Free Flux Type: No-Clean Part Status: Active |
на замовлення 22 шт: термін постачання 21-31 дні (днів) |
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891672 | Harimatec Inc. |
![]() Packaging: Bulk Type: Flux - Lead Free, Water-Soluble Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
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893357 | Harimatec Inc. |
![]() Packaging: Bulk Diameter: 0.015" (0.38mm) Wire Gauge: 27 AWG, 28 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423°F (217°C) Form: Spool, 8.8 oz (250g) Process: Lead Free Flux Type: Water Soluble |
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981501 | Harimatec Inc. |
![]() Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Bar Solder Melting Point: 423°F (217°C) Form: Bar, 2.5 lbs (1.13kg) Process: Lead Free |
товар відсутній |
386840 |
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Виробник: Harimatec Inc.
Description: 63/37 370, 3% .024DIA 22AWG
Packaging: Spool
Diameter: 0.024" (0.61mm)
Wire Gauge: 22 AWG, 23 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: Rosin Activated (RA)
Description: 63/37 370, 3% .024DIA 22AWG
Packaging: Spool
Diameter: 0.024" (0.61mm)
Wire Gauge: 22 AWG, 23 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: Rosin Activated (RA)
товар відсутній
386844 |
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Виробник: Harimatec Inc.
Description: 63/37 400 2% .015DIA 27AWG
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 8.8 oz (250g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C)
Description: 63/37 400 2% .015DIA 27AWG
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 8.8 oz (250g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C)
на замовлення 56 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 2378.31 грн |
5+ | 2243.43 грн |
10+ | 2056.45 грн |
40+ | 1491.29 грн |
386851 |
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Виробник: Harimatec Inc.
Description: 63/37 CRYSL 502 2% .022DIA 23AWG
Packaging: Bulk
Diameter: 0.022" (0.56mm)
Wire Gauge: 23 AWG, 24 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Description: 63/37 CRYSL 502 2% .022DIA 23AWG
Packaging: Bulk
Diameter: 0.022" (0.56mm)
Wire Gauge: 23 AWG, 24 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
на замовлення 26 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 4168.03 грн |
5+ | 3640.15 грн |
10+ | 3266.79 грн |
386862 |
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Виробник: Harimatec Inc.
Description: 63/37 CRYSL 502 2% .032DIA 20AWG
Packaging: Bulk
Diameter: 0.032" (0.81mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Description: 63/37 CRYSL 502 2% .032DIA 20AWG
Packaging: Bulk
Diameter: 0.032" (0.81mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
товар відсутній
386876 |
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Виробник: Harimatec Inc.
Description: 63/37 400 2% .024DIA 22AWG
Packaging: Bulk
Diameter: 0.024" (0.61mm)
Wire Gauge: 22 AWG, 23 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C)
Description: 63/37 400 2% .024DIA 22AWG
Packaging: Bulk
Diameter: 0.024" (0.61mm)
Wire Gauge: 22 AWG, 23 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C)
на замовлення 13 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 4289.91 грн |
5+ | 3786.79 грн |
10+ | 3270.43 грн |
386927 |
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Виробник: Harimatec Inc.
Description: 63/37 400 2% .032DIA 20AWG
Packaging: Bulk
Diameter: 0.032" (0.81mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Description: 63/37 400 2% .032DIA 20AWG
Packaging: Bulk
Diameter: 0.032" (0.81mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
товар відсутній
389261 |
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Виробник: Harimatec Inc.
Description: 60/40 370 3% .015DIA 27AWG
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 374°F (183 ~ 190°C)
Form: Spool, 8.8 oz (250g)
Process: Leaded
Flux Type: Rosin Activated (RA)
Part Status: Active
Description: 60/40 370 3% .015DIA 27AWG
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 374°F (183 ~ 190°C)
Form: Spool, 8.8 oz (250g)
Process: Leaded
Flux Type: Rosin Activated (RA)
Part Status: Active
на замовлення 35 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 4240.54 грн |
5+ | 3743.41 грн |
10+ | 3232.91 грн |
25+ | 2714.59 грн |
389283 |
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Виробник: Harimatec Inc.
Description: 63/37 HX 3C 0.38MM 0.25KG .015"
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 8.8 oz (250g)
Process: Leaded
Flux Type: Water Soluble
Description: 63/37 HX 3C 0.38MM 0.25KG .015"
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 8.8 oz (250g)
Process: Leaded
Flux Type: Water Soluble
товар відсутній
392249 |
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Виробник: Harimatec Inc.
Description: 63/37 400 2% .064DIA 14AWG
Packaging: Bulk
Diameter: 0.064" (1.63mm)
Wire Gauge: 14 AWG, 16 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C)
Description: 63/37 400 2% .064DIA 14AWG
Packaging: Bulk
Diameter: 0.064" (1.63mm)
Wire Gauge: 14 AWG, 16 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C)
на замовлення 28 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 4277.57 грн |
5+ | 3775.65 грн |
10+ | 3260.85 грн |
395437 |
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Виробник: Harimatec Inc.
Description: HMP 366 3% .028DIA 21AWG
Packaging: Bulk
Diameter: 0.028" (0.71mm)
Wire Gauge: 21 AWG, 22 SWG
Composition: Pb93.5Sn5Ag1.5 (93.5/5/1.5)
Type: Wire Solder
Melting Point: 565 ~ 574°F (296 ~ 301°C)
Form: Spool, 17.64 oz (500g)
Process: Leaded
Flux Type: Rosin Activated (RA)
Description: HMP 366 3% .028DIA 21AWG
Packaging: Bulk
Diameter: 0.028" (0.71mm)
Wire Gauge: 21 AWG, 22 SWG
Composition: Pb93.5Sn5Ag1.5 (93.5/5/1.5)
Type: Wire Solder
Melting Point: 565 ~ 574°F (296 ~ 301°C)
Form: Spool, 17.64 oz (500g)
Process: Leaded
Flux Type: Rosin Activated (RA)
товар відсутній
395439 |
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Виробник: Harimatec Inc.
Description: HMP 366 3% .050DIA 16AWG
Packaging: Bulk
Diameter: 0.050" (1.27mm)
Wire Gauge: 16 AWG, 18 SWG
Composition: Pb93.5Sn5Ag1.5 (93.5/5/1.5)
Type: Wire Solder
Melting Point: 565 ~ 574°F (296 ~ 301°C)
Form: Spool, 17.64 oz (500g)
Process: Leaded
Flux Type: Rosin Activated (RA)
Description: HMP 366 3% .050DIA 16AWG
Packaging: Bulk
Diameter: 0.050" (1.27mm)
Wire Gauge: 16 AWG, 18 SWG
Composition: Pb93.5Sn5Ag1.5 (93.5/5/1.5)
Type: Wire Solder
Melting Point: 565 ~ 574°F (296 ~ 301°C)
Form: Spool, 17.64 oz (500g)
Process: Leaded
Flux Type: Rosin Activated (RA)
на замовлення 2 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 4063.89 грн |
395451 |
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Виробник: Harimatec Inc.
Description: 63/37 CRYSL 502 3% .032DIA 20AWG
Packaging: Bulk
Diameter: 0.032" (0.81mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Description: 63/37 CRYSL 502 3% .032DIA 20AWG
Packaging: Bulk
Diameter: 0.032" (0.81mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
товар відсутній
395465 |
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Виробник: Harimatec Inc.
Description: 63/37 CRYSL 502 3% .064DIA 14AWG
Packaging: Bulk
Diameter: 0.064" (1.63mm)
Wire Gauge: 14 AWG, 16 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Description: 63/37 CRYSL 502 3% .064DIA 14AWG
Packaging: Bulk
Diameter: 0.064" (1.63mm)
Wire Gauge: 14 AWG, 16 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
товар відсутній
395467 |
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Виробник: Harimatec Inc.
Description: 60/40 370 5C 1.22MM 0.5KG AM
Packaging: Bulk
Diameter: 0.048" (1.22mm)
Wire Gauge: 16 AWG, 18 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 374°F (183 ~ 190°C)
Form: Spool, 17.64 oz (500g)
Process: Leaded
Flux Type: Rosin Activated (RA)
Part Status: Active
Description: 60/40 370 5C 1.22MM 0.5KG AM
Packaging: Bulk
Diameter: 0.048" (1.22mm)
Wire Gauge: 16 AWG, 18 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 374°F (183 ~ 190°C)
Form: Spool, 17.64 oz (500g)
Process: Leaded
Flux Type: Rosin Activated (RA)
Part Status: Active
на замовлення 11 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 4059.26 грн |
5+ | 3583.25 грн |
10+ | 3094.67 грн |
397102 |
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Виробник: Harimatec Inc.
Description: 63/37 400 2% .048DIA 16AWG
Packaging: Bulk
Diameter: 0.048" (1.22mm)
Wire Gauge: 16 AWG, 18 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C)
Description: 63/37 400 2% .048DIA 16AWG
Packaging: Bulk
Diameter: 0.048" (1.22mm)
Wire Gauge: 16 AWG, 18 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C)
на замовлення 8 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 4113.26 грн |
5+ | 3631.38 грн |
397127 |
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Виробник: Harimatec Inc.
Description: SN62 370 3% .024DIA 22AWG
Packaging: Spool
Diameter: 0.024" (0.61mm)
Wire Gauge: 22 AWG, 23 SWG
Composition: Sn62Pb38 (62/38)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 17.64 oz (500g)
Process: Leaded
Flux Type: Rosin Activated (RA)
Description: SN62 370 3% .024DIA 22AWG
Packaging: Spool
Diameter: 0.024" (0.61mm)
Wire Gauge: 22 AWG, 23 SWG
Composition: Sn62Pb38 (62/38)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 17.64 oz (500g)
Process: Leaded
Flux Type: Rosin Activated (RA)
товар відсутній
397952 |
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Виробник: Harimatec Inc.
Description: HMP 366 3% .022DIA. 23AWG
Packaging: Bulk
Diameter: 0.022" (0.56mm)
Wire Gauge: 23 AWG, 24 SWG
Composition: Pb93.5Sn5Ag1.5 (93.5/5/1.5)
Type: Wire Solder
Melting Point: 565 ~ 574°F (296 ~ 301°C)
Form: Spool, 8.8 oz (250g)
Process: Leaded
Flux Type: Rosin Activated (RA)
Description: HMP 366 3% .022DIA. 23AWG
Packaging: Bulk
Diameter: 0.022" (0.56mm)
Wire Gauge: 23 AWG, 24 SWG
Composition: Pb93.5Sn5Ag1.5 (93.5/5/1.5)
Type: Wire Solder
Melting Point: 565 ~ 574°F (296 ~ 301°C)
Form: Spool, 8.8 oz (250g)
Process: Leaded
Flux Type: Rosin Activated (RA)
товар відсутній
397982 |
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Виробник: Harimatec Inc.
Description: 63/37 CRYSL 502 3% .015DIA 27AWG
Packaging: Spool
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 8.8 oz (250g)
Process: Leaded
Flux Type: No-Clean
Part Status: Obsolete
Description: 63/37 CRYSL 502 3% .015DIA 27AWG
Packaging: Spool
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 8.8 oz (250g)
Process: Leaded
Flux Type: No-Clean
Part Status: Obsolete
товар відсутній
412183 |
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Виробник: Harimatec Inc.
Description: 96SC C511 3C 1.02MM 0.5KG .040"
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Wire Gauge: 18 AWG, 19 SWG
Composition: Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Obsolete
Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C)
Description: 96SC C511 3C 1.02MM 0.5KG .040"
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Wire Gauge: 18 AWG, 19 SWG
Composition: Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Obsolete
Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C)
товар відсутній
450314 |
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Виробник: Harimatec Inc.
Description: 63/37 400 2% .022DIA 23AWG
Packaging: Bulk
Diameter: 0.022" (0.56mm)
Wire Gauge: 23 AWG, 24 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Description: 63/37 400 2% .022DIA 23AWG
Packaging: Bulk
Diameter: 0.022" (0.56mm)
Wire Gauge: 23 AWG, 24 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
на замовлення 8 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 4532.91 грн |
5+ | 3958.83 грн |
519430 |
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Виробник: Harimatec Inc.
Description: MP200 RWF SOLDER FLUX NO CLEAN
Packaging: Bulk
Shipping Info: Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.
Type: Flux - No Clean, Tacky Solder
Form: Syringe, 0.35 oz (10g), 10cc
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: MP200 RWF SOLDER FLUX NO CLEAN
Packaging: Bulk
Shipping Info: Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.
Type: Flux - No Clean, Tacky Solder
Form: Syringe, 0.35 oz (10g), 10cc
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
на замовлення 23 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 3373.46 грн |
5+ | 2977.67 грн |
10+ | 2571.7 грн |
536290 |
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Виробник: Harimatec Inc.
Description: 97CU3 ARAX 4C 3.25MM 10KG AM
Packaging: Bulk
Diameter: 0.128" (3.25mm)
Wire Gauge: 8 AWG, 10 SWG
Composition: Sn97Cu3 (97/3)
Type: Wire Solder
Form: Spool, 22.05 lbs (10kg)
Process: Lead Free
Part Status: Obsolete
Description: 97CU3 ARAX 4C 3.25MM 10KG AM
Packaging: Bulk
Diameter: 0.128" (3.25mm)
Wire Gauge: 8 AWG, 10 SWG
Composition: Sn97Cu3 (97/3)
Type: Wire Solder
Form: Spool, 22.05 lbs (10kg)
Process: Lead Free
Part Status: Obsolete
товар відсутній
544784 |
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Виробник: Harimatec Inc.
Description: WS200 RWF 30G SYRINGE
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Mesh Type: 3
Process: Leaded
Flux Type: Water Soluble
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: WS200 RWF 30G SYRINGE
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Mesh Type: 3
Process: Leaded
Flux Type: Water Soluble
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
товар відсутній
550014 |
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Виробник: Harimatec Inc.
Description: 63/37 WS200 SOLDER PASTE 75GM
Packaging: Dispenser
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 2.65 oz (75g)
Process: Leaded
Flux Type: Water Soluble
Storage/Refrigeration Temperature: 35°F ~ 50°F (2°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: 63/37 WS200 SOLDER PASTE 75GM
Packaging: Dispenser
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 2.65 oz (75g)
Process: Leaded
Flux Type: Water Soluble
Storage/Refrigeration Temperature: 35°F ~ 50°F (2°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
товар відсутній
556385 |
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Виробник: Harimatec Inc.
Description: DESOLDER BRAID NO-CLN 0.06" 100'
Packaging: Bulk
Length: 100' (30.5m)
Type: No Clean
Width: 0.060" (1.52mm)
ESD Protection: Static Dissipative (SD)
Product Type: Braid/Wick
Part Status: Obsolete
Description: DESOLDER BRAID NO-CLN 0.06" 100'
Packaging: Bulk
Length: 100' (30.5m)
Type: No Clean
Width: 0.060" (1.52mm)
ESD Protection: Static Dissipative (SD)
Product Type: Braid/Wick
Part Status: Obsolete
товар відсутній
583489 |
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Виробник: Harimatec Inc.
Description: 63/37 MP200 SOLDER FLUX 25GM
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Cartridge, 0.88 oz (25g)
Process: Leaded
Flux Type: No-Clean
Storage/Refrigeration Temperature: Room Temperature
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: 63/37 MP200 SOLDER FLUX 25GM
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Cartridge, 0.88 oz (25g)
Process: Leaded
Flux Type: No-Clean
Storage/Refrigeration Temperature: Room Temperature
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
товар відсутній
605500 |
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Виробник: Harimatec Inc.
Description: 96SC C511 5C 0.56MM 0.25KG
Packaging: Bulk
Diameter: 0.022" (0.56mm)
Wire Gauge: 23 AWG, 24 SWG
Composition: Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 5.51 lbs (2.5kg)
Process: Lead Free
Flux Type: No-Clean
Part Status: Obsolete
Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C)
Description: 96SC C511 5C 0.56MM 0.25KG
Packaging: Bulk
Diameter: 0.022" (0.56mm)
Wire Gauge: 23 AWG, 24 SWG
Composition: Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 5.51 lbs (2.5kg)
Process: Lead Free
Flux Type: No-Clean
Part Status: Obsolete
Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C)
товар відсутній
673828 |
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Виробник: Harimatec Inc.
Description: 97SC 400 2% .022DIA 23AWG
Packaging: Bulk
Diameter: 0.022" (0.56mm)
Wire Gauge: 23 AWG, 24 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 8.8 oz (250g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C)
Description: 97SC 400 2% .022DIA 23AWG
Packaging: Bulk
Diameter: 0.022" (0.56mm)
Wire Gauge: 23 AWG, 24 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 8.8 oz (250g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C)
на замовлення 96 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 4377.09 грн |
5+ | 3822.74 грн |
10+ | 3430.66 грн |
40+ | 2759.62 грн |
80+ | 2575.66 грн |
673829 |
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Виробник: Harimatec Inc.
Description: 97SC 400 2% .032DIA 20AWG
Packaging: Bulk
Diameter: 0.032" (0.81mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C)
Description: 97SC 400 2% .032DIA 20AWG
Packaging: Bulk
Diameter: 0.032" (0.81mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C)
на замовлення 71 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 7120.29 грн |
5+ | 6300.91 грн |
20+ | 5930.3 грн |
40+ | 4869.7 грн |
673831 |
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Виробник: Harimatec Inc.
Description: 97SC 400 2% .048DIA 16AWG
Packaging: Bulk
Diameter: 0.048" (1.22mm)
Wire Gauge: 16 AWG, 18 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C)
Description: 97SC 400 2% .048DIA 16AWG
Packaging: Bulk
Diameter: 0.048" (1.22mm)
Wire Gauge: 16 AWG, 18 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C)
на замовлення 29 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 6727.63 грн |
5+ | 5952.96 грн |
20+ | 5602.74 грн |
673832 |
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Виробник: Harimatec Inc.
Description: 97SC 400 2% .064DIA 14AWG
Packaging: Bulk
Diameter: 0.064" (1.63mm)
Wire Gauge: 14 AWG, 16 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Description: 97SC 400 2% .064DIA 14AWG
Packaging: Bulk
Diameter: 0.064" (1.63mm)
Wire Gauge: 14 AWG, 16 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
на замовлення 10 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 6928.97 грн |
5+ | 6131.39 грн |
680290 |
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Виробник: Harimatec Inc.
Description: 99C BAR SOLDER 2LB +/- 0.2LB
Packaging: Bulk
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Bar Solder
Melting Point: 440 ~ 464°F (227 ~ 240°C)
Form: Bar, 2.5 lbs (1.13kg)
Process: Lead Free
Part Status: Obsolete
Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C)
Description: 99C BAR SOLDER 2LB +/- 0.2LB
Packaging: Bulk
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Bar Solder
Melting Point: 440 ~ 464°F (227 ~ 240°C)
Form: Bar, 2.5 lbs (1.13kg)
Process: Lead Free
Part Status: Obsolete
Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C)
товар відсутній
692857 |
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Виробник: Harimatec Inc.
Description: 96SC C511 5C 0.81MM 0.5KG AM
Packaging: Bulk
Diameter: 0.032" (0.81mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Obsolete
Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C)
Description: 96SC C511 5C 0.81MM 0.5KG AM
Packaging: Bulk
Diameter: 0.032" (0.81mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Obsolete
Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C)
товар відсутній
706397 |
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Виробник: Harimatec Inc.
Description: SOLDER TIP TINNER (ACTIVATOR)1PC
Packaging: Bulk
Type: Tip Tinner (Activator)
Part Status: Obsolete
Description: SOLDER TIP TINNER (ACTIVATOR)1PC
Packaging: Bulk
Type: Tip Tinner (Activator)
Part Status: Obsolete
товар відсутній
716856 |
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Виробник: Harimatec Inc.
Description: 99C C511 3C 1.63MM 1KG AM
Packaging: Bulk
Diameter: 0.064" (1.63mm)
Wire Gauge: 14 AWG, 16 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 440 ~ 464°F (227 ~ 240°C)
Form: Spool, 2.20 lbs (1kg)
Process: Lead Free
Flux Type: No-Clean
Part Status: Obsolete
Description: 99C C511 3C 1.63MM 1KG AM
Packaging: Bulk
Diameter: 0.064" (1.63mm)
Wire Gauge: 14 AWG, 16 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 440 ~ 464°F (227 ~ 240°C)
Form: Spool, 2.20 lbs (1kg)
Process: Lead Free
Flux Type: No-Clean
Part Status: Obsolete
товар відсутній
721440 |
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Виробник: Harimatec Inc.
Description: LOCTITE LF 318 97SCAGS885V 500G
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423°F (217°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: LOCTITE LF 318 97SCAGS885V 500G
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423°F (217°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
товар відсутній
721471 |
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Виробник: Harimatec Inc.
Description: LOCTITE LF 318 97SCAGS885V 600G
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423°F (217°C)
Form: Cartridge, 21.16 oz (600g)
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: LOCTITE LF 318 97SCAGS885V 600G
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423°F (217°C)
Form: Cartridge, 21.16 oz (600g)
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
на замовлення 4 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 12936.09 грн |
721472 |
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Виробник: Harimatec Inc.
Description: LOCTITE LF 318 97SCAGS885V 75G S
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423°F (217°C)
Form: Syringe, 2.65 oz (75g)
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: LOCTITE LF 318 97SCAGS885V 75G S
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423°F (217°C)
Form: Syringe, 2.65 oz (75g)
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
товар відсутній
721473 |
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Виробник: Harimatec Inc.
Description: LF318 TACKY FLUX
Packaging: Bulk
Type: Solder Paste
Form: Syringe, 1.06 oz (30g)
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: LF318 TACKY FLUX
Packaging: Bulk
Type: Solder Paste
Form: Syringe, 1.06 oz (30g)
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
товар відсутній
727190 |
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Виробник: Harimatec Inc.
Description: 99C C511 3C 0.56MM 0.5KG
Packaging: Bulk
Diameter: 0.022" (0.56mm)
Wire Gauge: 23 AWG, 24 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 440 ~ 464°F (227 ~ 240°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Obsolete
Description: 99C C511 3C 0.56MM 0.5KG
Packaging: Bulk
Diameter: 0.022" (0.56mm)
Wire Gauge: 23 AWG, 24 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 440 ~ 464°F (227 ~ 240°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Obsolete
товар відсутній
732977 |
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Виробник: Harimatec Inc.
Description: 97SC HYDRO-X 2% .064DIA 14AWG
Packaging: Bulk
Diameter: 0.064" (1.63mm)
Wire Gauge: 14 AWG, 16 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: Water Soluble
Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C)
Description: 97SC HYDRO-X 2% .064DIA 14AWG
Packaging: Bulk
Diameter: 0.064" (1.63mm)
Wire Gauge: 14 AWG, 16 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: Water Soluble
Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C)
на замовлення 2 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 7631.74 грн |
732998 |
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Виробник: Harimatec Inc.
Description: 97SC C511 2% .064DIA 14AWG
Packaging: Bulk
Diameter: 0.064" (1.63mm)
Wire Gauge: 14 AWG, 16 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Description: 97SC C511 2% .064DIA 14AWG
Packaging: Bulk
Diameter: 0.064" (1.63mm)
Wire Gauge: 14 AWG, 16 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
товар відсутній
732999 |
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Виробник: Harimatec Inc.
Description: 97SC C511 3C 1.22MM 0.5KG
Packaging: Bulk
Diameter: 0.048" (1.22mm)
Wire Gauge: 16 AWG, 18 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean
Description: 97SC C511 3C 1.22MM 0.5KG
Packaging: Bulk
Diameter: 0.048" (1.22mm)
Wire Gauge: 16 AWG, 18 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean
товар відсутній
733001 |
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Виробник: Harimatec Inc.
Description: 97SC C511 2% .022DIA 22AWG 24SWG
Packaging: Bulk
Diameter: 0.022" (0.56mm)
Wire Gauge: 23 AWG, 24 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 8.8 oz (250g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Description: 97SC C511 2% .022DIA 22AWG 24SWG
Packaging: Bulk
Diameter: 0.022" (0.56mm)
Wire Gauge: 23 AWG, 24 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 8.8 oz (250g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
на замовлення 762 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 4420.29 грн |
5+ | 3860.93 грн |
10+ | 3464.98 грн |
40+ | 2787.21 грн |
80+ | 2601.4 грн |
733002 |
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Виробник: Harimatec Inc.
Description: 97SC C511 2% .032DIA 20AWG
Packaging: Bulk
Diameter: 0.032" (0.81mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Description: 97SC C511 2% .032DIA 20AWG
Packaging: Bulk
Diameter: 0.032" (0.81mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
на замовлення 54 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 7132.63 грн |
5+ | 6311.61 грн |
20+ | 5940.29 грн |
40+ | 4877.89 грн |
733010 |
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Виробник: Harimatec Inc.
Description: 96SC C511 3C 0.81MM 0.5KG .032"
Packaging: Bulk
Diameter: 0.032" (0.81mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Obsolete
Description: 96SC C511 3C 0.81MM 0.5KG .032"
Packaging: Bulk
Diameter: 0.032" (0.81mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Obsolete
товар відсутній
733024 |
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Виробник: Harimatec Inc.
Description: 96SC C400 3C 0.56MM 0.25KG.022"
Packaging: Bulk
Diameter: 0.022" (0.56mm)
Wire Gauge: 23 AWG, 24 SWG
Composition: Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 8.8 oz (250g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Obsolete
Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C)
Description: 96SC C400 3C 0.56MM 0.25KG.022"
Packaging: Bulk
Diameter: 0.022" (0.56mm)
Wire Gauge: 23 AWG, 24 SWG
Composition: Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 8.8 oz (250g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Obsolete
Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C)
товар відсутній
760088 |
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Виробник: Harimatec Inc.
Description: FLUX - NO CLEAN PEN
Packaging: Bulk
Type: Flux - No Clean
Form: Pen, 0.34 oz (9.64g)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: FLUX - NO CLEAN PEN
Packaging: Bulk
Type: Flux - No Clean
Form: Pen, 0.34 oz (9.64g)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
товар відсутній
796037 |
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Виробник: Harimatec Inc.
Description: 97SC C511 2% .015DIA 27AWG
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 8.8 oz (250g)
Process: Lead Free
Flux Type: Rosin Mildly Activated (RMA)
Part Status: Active
Description: 97SC C511 2% .015DIA 27AWG
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 8.8 oz (250g)
Process: Lead Free
Flux Type: Rosin Mildly Activated (RMA)
Part Status: Active
товар відсутній
796065 |
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Виробник: Harimatec Inc.
Description: 97SC 400 2% 0.38 DIA
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 8.8 oz (250g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Description: 97SC 400 2% 0.38 DIA
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 8.8 oz (250g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
товар відсутній
818006 |
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Виробник: Harimatec Inc.
Description: 63/37 C400 5C 0.71MM 0.5KG AM
Packaging: Bulk
Diameter: 0.028" (0.71mm)
Wire Gauge: 21 AWG, 22 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Description: 63/37 C400 5C 0.71MM 0.5KG AM
Packaging: Bulk
Diameter: 0.028" (0.71mm)
Wire Gauge: 21 AWG, 22 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
товар відсутній
838498 |
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Виробник: Harimatec Inc.
Description: 97SC C502 3C 0.25MM 0.25KG AM
Packaging: Bulk
Diameter: 0.025" (0.64mm)
Wire Gauge: 22 AWG, 23 SWG
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 8.8 oz (250g)
Flux Type: No-Clean
Part Status: Obsolete
Description: 97SC C502 3C 0.25MM 0.25KG AM
Packaging: Bulk
Diameter: 0.025" (0.64mm)
Wire Gauge: 22 AWG, 23 SWG
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 8.8 oz (250g)
Flux Type: No-Clean
Part Status: Obsolete
товар відсутній
848874 |
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Виробник: Harimatec Inc.
Description: 97SC C502 3C 0.81MM 0.5KG AM
Packaging: Bulk
Diameter: 0.032" (0.81mm)
Wire Gauge: 20 AWG, 21 SWG
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Flux Type: No-Clean
Description: 97SC C502 3C 0.81MM 0.5KG AM
Packaging: Bulk
Diameter: 0.032" (0.81mm)
Wire Gauge: 20 AWG, 21 SWG
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Flux Type: No-Clean
на замовлення 17 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 4866.94 грн |
5+ | 4460.41 грн |
865940 |
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Виробник: Harimatec Inc.
Description: 99C C511 3C 0.81MM 0.5KG AM
Packaging: Bulk
Diameter: 0.032" (0.81mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 440 ~ 464°F (227 ~ 240°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Description: 99C C511 3C 0.81MM 0.5KG AM
Packaging: Bulk
Diameter: 0.032" (0.81mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 440 ~ 464°F (227 ~ 240°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
на замовлення 22 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 5161.63 грн |
5+ | 4507.66 грн |
20+ | 4045.3 грн |
891672 |
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Виробник: Harimatec Inc.
Description: FLUX - WATER SOLUBLE LEAD FREE
Packaging: Bulk
Type: Flux - Lead Free, Water-Soluble
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: FLUX - WATER SOLUBLE LEAD FREE
Packaging: Bulk
Type: Flux - Lead Free, Water-Soluble
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
товар відсутній
893357 |
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Виробник: Harimatec Inc.
Description: 97SC HYDRO-X 3C0.38MM 0.25KG AM
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 8.8 oz (250g)
Process: Lead Free
Flux Type: Water Soluble
Description: 97SC HYDRO-X 3C0.38MM 0.25KG AM
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 8.8 oz (250g)
Process: Lead Free
Flux Type: Water Soluble
товар відсутній
981501 |
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Виробник: Harimatec Inc.
Description: SAC305 BAR SOLDR 2.5LB +/- 0.2LB
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Bar Solder
Melting Point: 423°F (217°C)
Form: Bar, 2.5 lbs (1.13kg)
Process: Lead Free
Description: SAC305 BAR SOLDR 2.5LB +/- 0.2LB
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Bar Solder
Melting Point: 423°F (217°C)
Form: Bar, 2.5 lbs (1.13kg)
Process: Lead Free
товар відсутній
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