Продукція > HARIMATEC INC. > Всі товари виробника HARIMATEC INC. (119) > Сторінка 1 з 2
Обрати Сторінку:
1
2
[ Наступна Сторінка >> ]
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 1007354 | Harimatec Inc. |
 Description: BI58 LM100 AAS90V PASTEPackaging: Bulk Composition: Bi58Sn42 (58/42) Type: Solder Paste Melting Point: 281°F (138°C) Form: Jar, 17.64 oz (500g) Mesh Type: 2 Process: Lead Free Flux Type: No-Clean Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
товар відсутній |
||||||||||
 |
1042097 | Harimatec Inc. |
Description: 96S ARAX 4C 1.6MM 0.5KG AM Packaging: Bulk Diameter: 0.063" (1.60mm) Wire Gauge: 14 AWG, 16 SWG Composition: Sn96.5Ag3.5 (96.5/3.5) Type: Wire Solder Melting Point: 430°F (221°C) Form: Spool, 17.64 oz (500g) Process: Lead Free Part Status: Active |
на замовлення 390 шт: термін постачання 21-31 дні (днів) |
|
||||||||
| 1042100 | Harimatec Inc. |
Description: 60/40C511 3C 1.63MM AF 2.5KG AM Packaging: Bulk Diameter: 0.064" (1.63mm) Wire Gauge: 14 AWG, 16 SWG Composition: Sn60Pb40 (60/40) Type: Wire Solder Melting Point: 361 ~ 374°F (183 ~ 190°C) Form: Spool, 5.51 lbs (2.5kg) Process: Leaded Flux Type: No-Clean |
товар відсутній |
||||||||||
| 1124309 | Harimatec Inc. |
Description: LOCTITE MF300 1GAL BTL Packaging: Bulk Type: Flux - No Clean Form: Container, 1 gal Part Status: Obsolete Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
товар відсутній |
||||||||||
| 1124342 | Harimatec Inc. |
Description: LOCTITE MF300 5GAL BOX Packaging: Bulk Type: Flux - No Clean Form: Container, 5 gal Part Status: Obsolete Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
товар відсутній |
||||||||||
| 1124343 | Harimatec Inc. |
Description: LOCTITE MF300 55GAL DRUM Packaging: Bulk Type: Flux - No Clean Form: Container, 55 gal Part Status: Obsolete Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
товар відсутній |
||||||||||
| 1179441 | Harimatec Inc. |
Description: 63/37 381 5C 0.81MM 0.5KG AM Packaging: Bulk Diameter: 0.032" (0.81mm) Wire Gauge: 20 AWG, 21 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 17.64 oz (500g) Process: Leaded Flux Type: Rosin Mildly Activated (RMA) |
товар відсутній |
||||||||||
| 1179443 | Harimatec Inc. |
Description: 63/37 381 5C 0.56MM 0.25KG AM Packaging: Bulk Diameter: 0.022" (0.56mm) Wire Gauge: 23 AWG, 24 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 8.8 oz (250g) Process: Leaded Flux Type: Rosin Mildly Activated (RMA) |
товар відсутній |
||||||||||
| 1210679 | Harimatec Inc. |
Description: LOCTITE MCF 800 5GAL PAIL Packaging: Bulk Type: Flux - No Clean, Water-Soluble Form: Container, 5 gal |
товар відсутній |
||||||||||
| 1334251 | Harimatec Inc. |
Description: FLUX - NO CLEAN Packaging: Bulk Type: Flux - No Clean, Tacky Solder Part Status: Obsolete Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
товар відсутній |
||||||||||
| 1354225 | Harimatec Inc. |
Description: LOCTITE WS 300 97SCT3V 75G SYRIN Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423°F (217°C) Form: Syringe, 2.65 oz (75g) Process: Lead Free Flux Type: Water Soluble Storage/Refrigeration Temperature: 35.6°F ~ 46.4°F (2°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
товар відсутній |
||||||||||
| 1354250 | Harimatec Inc. |
Description: LOCTITE WS 300 97SCT3V 500G SEMC Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423°F (217°C) Form: Syringe, 2.65 oz (75g) Process: Lead Free Flux Type: Water Soluble Storage/Refrigeration Temperature: 35.6°F ~ 46.4°F (2°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
товар відсутній |
||||||||||
| 1354291 | Harimatec Inc. |
Description: LOCTITE WS 300 97SCT3V 500G JAR Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423°F (217°C) Form: Jar, 17.64 oz (500g) Process: Lead Free Flux Type: Water Soluble Storage/Refrigeration Temperature: 35.6°F ~ 46.4°F (2°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
товар відсутній |
||||||||||
| 1354296 | Harimatec Inc. |
Description: 63S4 WS200 ACP PASTE 600G SEMCO Packaging: Bulk Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Cartridge, 21.16 oz (600g) Mesh Type: 3 Process: Leaded Flux Type: Water Soluble Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
товар відсутній |
||||||||||
| 1394819 | Harimatec Inc. |
Description: 92A DA100 DAP85V Packaging: Bulk Type: Solder Paste Melting Point: 546 ~ 567°F (286 ~ 297°C) Form: Syringe, 1.06 oz (30g) Mesh Type: 4 Part Status: Obsolete Storage/Refrigeration Temperature: -0.4°F (-18°C), 41°F ~ 50°F (5°C ~ 10°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
товар відсутній |
||||||||||
| 1405650 | Harimatec Inc. |
Description: LOCTITE WS 300 97SCDAP88V 500G J Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423°F (217°C) Form: Jar, 17.64 oz (500g) Process: Lead Free Flux Type: Water Soluble Part Status: Not For New Designs Storage/Refrigeration Temperature: 35.6°F ~ 46.4°F (2°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
товар відсутній |
||||||||||
| 1405673 | Harimatec Inc. |
Description: LOCTITE WS 300 97SCDAP88V 500G S Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423°F (217°C) Form: Cartridge, 17.64 oz (500g) Process: Lead Free Flux Type: Water Soluble Part Status: Not For New Designs Storage/Refrigeration Temperature: 35.6°F ~ 46.4°F (2°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
товар відсутній |
||||||||||
| 1405711 | Harimatec Inc. |
Description: LOCTITE MP 218 SN63DAP89.5V RU Packaging: Bulk Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Cartridge, 24.69 oz (700g) Mesh Type: 4 Process: Leaded Flux Type: No-Clean Part Status: Obsolete Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
товар відсутній |
||||||||||
| 1434501 | Harimatec Inc. |
Description: LOCTITE LF 318M 97SCAGS88.5V 600 Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 350°F (177°C) Form: Cartridge, 21.16 oz (600g) Process: Lead Free Flux Type: No-Clean Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
товар відсутній |
||||||||||
| 1434504 | Harimatec Inc. |
Description: LOCTITE LF 318M 97SCAGS88.5V 500 Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423°F (217°C) Form: Jar, 17.64 oz (500g) Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
товар відсутній |
||||||||||
| 1434537 | Harimatec Inc. |
Description: LOCTITE LF 318M 97SCDAP88.5V 600 Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423°F (217°C) Form: Cartridge, 21.16 oz (600g) Process: Lead Free Flux Type: No-Clean Part Status: Obsolete Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
товар відсутній |
||||||||||
| 1728117 | Harimatec Inc. |
Description: LOCTITE LF 318 97SCAGS885V 25G S Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423°F (217°C) Form: Syringe, 0.88 oz (25g) Mesh Type: 3 Process: Lead Free Flux Type: No-Clean Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
товар відсутній |
||||||||||
| 1747469 | Harimatec Inc. |
Description: LOCTITE HF 250DP 96SCKBP84V 25G Packaging: Bulk Composition: Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7) Type: Solder Paste Melting Point: 423°F (217°C) Form: Cartridge, 0.88 oz (25g) Process: Lead Free Flux Type: No-Clean Part Status: Obsolete |
товар відсутній |
||||||||||
 |
1769646 | Harimatec Inc. |
Description: SOLDER PASTE HF 212 - 500GRAM JA |
товар відсутній |
|||||||||
 |
1769647 | Harimatec Inc. |
Description: SOLDER PASTE HF 212 - 600GRAM JA |
товар відсутній |
|||||||||
| 1817250 | Harimatec Inc. |
Description: SAC0307 HF212AGS88.5 Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423°F (217°C) Form: Cartridge, 21.16 oz (600g) Process: Lead Free Part Status: Obsolete Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C) Shelf Life: 6 Months |
товар відсутній |
||||||||||
| 1844641 | Harimatec Inc. |
Description: LOCTITE HF 212 90ISCAGS88.5 500G Packaging: Bulk Composition: SnAg3.8Cu0.7Bi3Sb1.4Ni0.15 Type: Solder Paste Melting Point: 408 ~ 424°F (209 ~ 218°C) Form: Jar, 17.64 oz (500g) Process: Lead Free Flux Type: No-Clean Part Status: Obsolete Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
товар відсутній |
||||||||||
| 1844644 | Harimatec Inc. |
Description: LOCTITE HF 212 90ISCDAP88.5 500G Packaging: Bulk Composition: SnAg3.8Cu0.7Bi3Sb1.4Ni0.15 Type: Solder Paste Melting Point: 409 ~ 424°F (209 ~ 218°C) Form: Jar, 17.64 oz (500g) Process: Lead Free Flux Type: No-Clean Part Status: Obsolete Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
товар відсутній |
||||||||||
| 1844657 | Harimatec Inc. |
Description: LOCTITE HF 212 90ISCDAP88.5 600G Packaging: Bulk Composition: SnAg3.8Cu0.7Bi3Sb1.4Ni0.15 Type: Solder Paste Melting Point: 410 ~ 424°F (209 ~ 218°C) Form: Jar, 21.16 oz (600g) Process: Lead Free Flux Type: No-Clean Part Status: Obsolete Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
товар відсутній |
||||||||||
| 1844674 | Harimatec Inc. |
Description: LOCTITE HF 212 90ISCAGS88.5 600G Packaging: Bulk Composition: SnAg3.8Cu0.7Bi3Sb1.4Ni0.15 Type: Solder Paste Melting Point: 411 ~ 424°F (209 ~ 218°C) Form: Jar, 21.16 oz (600g) Process: Lead Free Flux Type: No-Clean Part Status: Obsolete Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
товар відсутній |
||||||||||
| 1844685 | Harimatec Inc. |
Description: LOCTITE HF 212 97SCAGS88.5 600G Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 401 ~ 424°F (205 ~ 218°C) Form: Cartridge, 6 oz (170.10g) Process: Lead Free Flux Type: No-Clean Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
товар відсутній |
||||||||||
| 1846154 | Harimatec Inc. |
Description: LOCTITE HF 212 97SCAGS88.5 500G Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423°F (217°C) Form: Jar, 17.64 oz (500g) Process: Lead Free Flux Type: No-Clean Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
товар відсутній |
||||||||||
| 1893165 | Harimatec Inc. |
Description: LOCTITE HF108 RWF EFD 10CC SYRIN Packaging: Bulk |
товар відсутній |
||||||||||
| 1910690 | Harimatec Inc. |
Description: LOCTITE MSC 1000CUS CLEANER Packaging: Bulk Accessory Type: Cleaner Part Status: Obsolete |
товар відсутній |
||||||||||
 |
1993881 | Harimatec Inc. |
Description: LOCTITE GC 10 SAC305T4 885 52U Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423°F (217°C) Form: Jar, 17.64 oz (500g) Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 41°F ~ 77°F (5°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
на замовлення 11 шт: термін постачання 21-31 дні (днів) |
|
||||||||
 |
2003721 | Harimatec Inc. |
Description: LOCTITE GC 10 SAC305T4 885 53U Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423°F (217°C) Form: Cartridge, 21.16 oz (600g) Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 41°F ~ 77°F (5°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
на замовлення 16 шт: термін постачання 21-31 дні (днів) |
|
||||||||
 |
2023628 | Harimatec Inc. |
Description: LOCTITE GC 10 SAC305T3 885 52U Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423°F (217°C) Form: Jar, 17.64 oz (500g) Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 41°F ~ 77°F (5°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
товар відсутній |
|||||||||
 |
2023641 | Harimatec Inc. |
Description: LOCTITE GC 10 SAC305T3 885 53U Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423°F (217°C) Form: Cartridge, 21.16 oz (600g) Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 41°F ~ 77°F (5°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
товар відсутній |
|||||||||
| 2040987 | Harimatec Inc. |
Description: LOCTITE GC 3W SAC305T4 895V 53U Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423°F (217°C) Form: Cartridge, 21.16 oz (600g) Process: Lead Free Flux Type: Water Soluble Storage/Refrigeration Temperature: 32°F ~ 77°F (0°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
товар відсутній |
||||||||||
| 2040989 | Harimatec Inc. |
Description: LOCTITE GC 3W SAC305T4 895V 52U Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423°F (217°C) Form: Jar, 17.64 oz (500g) Process: Lead Free Flux Type: Water Soluble Storage/Refrigeration Temperature: 32°F ~ 77°F (0°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
товар відсутній |
||||||||||
 |
2041005 | Harimatec Inc. |
Description: LOCTITE GC 3W SAC305T3 895V 52U Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423°F (217°C) Form: Jar, 17.64 oz (500g) Process: Lead Free Flux Type: Water Soluble Part Status: Active Storage/Refrigeration Temperature: 32°F ~ 77°F (0°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
на замовлення 9 шт: термін постачання 21-31 дні (днів) |
|
||||||||
 |
2041006 | Harimatec Inc. |
Description: LOCTITE GC 3W SAC305T3 895V 53U Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423°F (217°C) Form: Cartridge, 21.16 oz (600g) Process: Lead Free Flux Type: Water Soluble Part Status: Active Storage/Refrigeration Temperature: 32°F ~ 77°F (0°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
|
||||||||
| 2064239 | Harimatec Inc. |
Description: LOCTITE GC 10 SAC305T3 885V 2U P Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423°F (217°C) Form: Cartridge, 29.98 oz (850g) Process: Lead Free Flux Type: No-Clean Storage/Refrigeration Temperature: 41°F ~ 77°F (5°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
товар відсутній |
||||||||||
| 2064242 | Harimatec Inc. |
Description: LOCTITE GC 10 SAC305T4 885V 2U P Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423°F (217°C) Form: Cartridge, 29.98 oz (850g) Process: Lead Free Flux Type: No-Clean Part Status: Obsolete Storage/Refrigeration Temperature: 41°F ~ 77°F (5°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
товар відсутній |
||||||||||
 |
2323877 | Harimatec Inc. |
Description: SOLDER MASK MSC 1000S 250 ML Packaging: Bulk For Use With/Related Products: Printed Circuit Boards Accessory Type: Solder Mask Part Status: Obsolete |
товар відсутній |
|||||||||
| 2327449 | Harimatec Inc. |
Description: LOCTITE X33-08I 1 GALLON Packaging: Bulk Type: Flux - No Clean, Lead Free, Liquid Form: Container, 1 gal |
товар відсутній |
||||||||||
| 2370856 | Harimatec Inc. |
Description: LOCTITE GC 50 SAC305T5 84V 62K Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423°F (217°C) Form: Cartridge Mesh Type: 5 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 41°F ~ 77°F (5°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
товар відсутній |
||||||||||
 |
2472657 | Harimatec Inc. |
Description: LOCTITE GC 18 SAC305T3 885V 53U Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423°F (217°C) Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 41°F ~ 77°F (5°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
товар відсутній |
|||||||||
 |
2472658 | Harimatec Inc. |
Description: LOCTITE GC 18 SAC305T4 885V 53U Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423°F (217°C) Process: Lead Free Flux Type: No-Clean Part Status: Obsolete Storage/Refrigeration Temperature: 41°F ~ 77°F (5°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
товар відсутній |
|||||||||
|
|
2472659 | Harimatec Inc. |
Description: LOCTITE GC 18 SAC305T3 885V 52U Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423°F (217°C) Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 41°F ~ 77°F (5°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
товар відсутній |
|||||||||
| 2591111 | Harimatec Inc. |
Description: LOCTITE GC 50 SAC305T5 84V 12K Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423°F (217°C) Form: Cartridge Mesh Type: 5 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 41°F ~ 77°F (5°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
товар відсутній |
||||||||||
| 2591112 | Harimatec Inc. |
Description: LOCTITE GC 50 SAC305T5 84V 74K Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423°F (217°C) Form: Cartridge Mesh Type: 5 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 41°F ~ 77°F (5°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
на замовлення 10 шт: термін постачання 21-31 дні (днів) |
|
|||||||||
| 291007 | Harimatec Inc. |
Description: DESOLDER BRAID NO-CLN 0.1" 100' Packaging: Bulk Length: 100' (30.5m) Type: No Clean Width: 0.100" (2.54mm) ESD Protection: Static Dissipative (SD) Product Type: Braid/Wick |
товар відсутній |
||||||||||
 |
386818 | Harimatec Inc. |
Description: 63/37 HYDRO-X 2% .032DIA 20AWG Packaging: Bulk Diameter: 0.032" (0.81mm) Wire Gauge: 20 AWG, 21 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 1 lb (454 g) Process: Leaded Flux Type: Water Soluble Part Status: Active Storage/Refrigeration Temperature: 70°F ~ 85°F (20°C ~ 30°C) |
на замовлення 25 шт: термін постачання 21-31 дні (днів) |
|
||||||||
 |
386820 | Harimatec Inc. |
Description: 63/37 HYDRO-X 2% .022DIA 23AWG Packaging: Bulk Diameter: 0.022" (0.56mm) Wire Gauge: 23 AWG, 24 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 8.8 oz (250g) Process: Leaded Flux Type: Water Soluble Part Status: Active |
товар відсутній |
|||||||||
 |
386824 | Harimatec Inc. |
Description: 60/40 370 3% .024DIA 22AWG Packaging: Bulk Diameter: 0.024" (0.61mm) Wire Gauge: 22 AWG, 23 SWG Composition: Sn60Pb40 (60/40) Type: Wire Solder Melting Point: 361 ~ 374°F (183 ~ 190°C) Form: Spool, 17.64 oz (500g) Process: Leaded Flux Type: Rosin Activated (RA) Part Status: Active |
на замовлення 52 шт: термін постачання 21-31 дні (днів) |
|
||||||||
 |
386827 | Harimatec Inc. |
Description: 60/40 370 3% .032DIA 20AWG Packaging: Bulk Diameter: 0.032" (0.81mm) Wire Gauge: 20 AWG, 21 SWG Composition: Sn60Pb40 (60/40) Type: Wire Solder Melting Point: 361 ~ 374°F (183 ~ 190°C) Form: Spool, 17.64 oz (500g) Process: Leaded Flux Type: Rosin Activated (RA) Part Status: Active |
товар відсутній |
|||||||||
 |
386832 | Harimatec Inc. |
Description: 60/40 370 3% .064DIA. 14AWG Packaging: Bulk Diameter: 0.064" (1.63mm) Wire Gauge: 14 AWG, 16 SWG Composition: Sn60Pb40 (60/40) Type: Wire Solder Melting Point: 361 ~ 374°F (183 ~ 190°C) Form: Spool, 17.64 oz (500g) Process: Leaded Flux Type: Rosin Activated (RA) Part Status: Active |
на замовлення 16 шт: термін постачання 21-31 дні (днів) |
|
||||||||
| 386838 | Harimatec Inc. |
Description: 60/40 C511 5C 1.22MM 0.5KG.048" Packaging: Bulk Diameter: 0.048" (1.22mm) Wire Gauge: 16 AWG, 18 SWG Composition: Sn60Pb40 (60/40) Type: Wire Solder Melting Point: 361 ~ 374°F (183 ~ 190°C) Form: Spool, 1 lb (454 g) Process: Leaded Flux Type: No-Clean Part Status: Obsolete |
товар відсутній |
||||||||||
 |
386839 | Harimatec Inc. |
Description: 63/37 370 3% .032DIA 20AWG Packaging: Spool Diameter: 0.032" (0.81mm) Wire Gauge: 20 AWG, 21 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 17.64 oz (500g) Process: Leaded Flux Type: Rosin Activated (RA) |
товар відсутній |
| 1007354 |
|
Виробник: Harimatec Inc.
Description: BI58 LM100 AAS90V PASTE
Packaging: Bulk
Composition: Bi58Sn42 (58/42)
Type: Solder Paste
Melting Point: 281°F (138°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 2
Process: Lead Free
Flux Type: No-Clean
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: BI58 LM100 AAS90V PASTE
Packaging: Bulk
Composition: Bi58Sn42 (58/42)
Type: Solder Paste
Melting Point: 281°F (138°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 2
Process: Lead Free
Flux Type: No-Clean
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
товар відсутній
| 1042097 |
|
Виробник: Harimatec Inc.
Description: 96S ARAX 4C 1.6MM 0.5KG AM
Packaging: Bulk
Diameter: 0.063" (1.60mm)
Wire Gauge: 14 AWG, 16 SWG
Composition: Sn96.5Ag3.5 (96.5/3.5)
Type: Wire Solder
Melting Point: 430°F (221°C)
Form: Spool, 17.64 oz (500g)
Process: Lead Free
Part Status: Active
Description: 96S ARAX 4C 1.6MM 0.5KG AM
Packaging: Bulk
Diameter: 0.063" (1.60mm)
Wire Gauge: 14 AWG, 16 SWG
Composition: Sn96.5Ag3.5 (96.5/3.5)
Type: Wire Solder
Melting Point: 430°F (221°C)
Form: Spool, 17.64 oz (500g)
Process: Lead Free
Part Status: Active
на замовлення 390 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 5020.76 грн |
| 5+ | 4601.02 грн |
| 1042100 |
|
Виробник: Harimatec Inc.
Description: 60/40C511 3C 1.63MM AF 2.5KG AM
Packaging: Bulk
Diameter: 0.064" (1.63mm)
Wire Gauge: 14 AWG, 16 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 374°F (183 ~ 190°C)
Form: Spool, 5.51 lbs (2.5kg)
Process: Leaded
Flux Type: No-Clean
Description: 60/40C511 3C 1.63MM AF 2.5KG AM
Packaging: Bulk
Diameter: 0.064" (1.63mm)
Wire Gauge: 14 AWG, 16 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 374°F (183 ~ 190°C)
Form: Spool, 5.51 lbs (2.5kg)
Process: Leaded
Flux Type: No-Clean
товар відсутній
| 1124309 |
Виробник: Harimatec Inc.
Description: LOCTITE MF300 1GAL BTL
Packaging: Bulk
Type: Flux - No Clean
Form: Container, 1 gal
Part Status: Obsolete
Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: LOCTITE MF300 1GAL BTL
Packaging: Bulk
Type: Flux - No Clean
Form: Container, 1 gal
Part Status: Obsolete
Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
товар відсутній
| 1124342 |
Виробник: Harimatec Inc.
Description: LOCTITE MF300 5GAL BOX
Packaging: Bulk
Type: Flux - No Clean
Form: Container, 5 gal
Part Status: Obsolete
Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: LOCTITE MF300 5GAL BOX
Packaging: Bulk
Type: Flux - No Clean
Form: Container, 5 gal
Part Status: Obsolete
Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
товар відсутній
| 1124343 |
Виробник: Harimatec Inc.
Description: LOCTITE MF300 55GAL DRUM
Packaging: Bulk
Type: Flux - No Clean
Form: Container, 55 gal
Part Status: Obsolete
Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: LOCTITE MF300 55GAL DRUM
Packaging: Bulk
Type: Flux - No Clean
Form: Container, 55 gal
Part Status: Obsolete
Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
товар відсутній
| 1179441 |
|
Виробник: Harimatec Inc.
Description: 63/37 381 5C 0.81MM 0.5KG AM
Packaging: Bulk
Diameter: 0.032" (0.81mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 17.64 oz (500g)
Process: Leaded
Flux Type: Rosin Mildly Activated (RMA)
Description: 63/37 381 5C 0.81MM 0.5KG AM
Packaging: Bulk
Diameter: 0.032" (0.81mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 17.64 oz (500g)
Process: Leaded
Flux Type: Rosin Mildly Activated (RMA)
товар відсутній
| 1179443 |
|
Виробник: Harimatec Inc.
Description: 63/37 381 5C 0.56MM 0.25KG AM
Packaging: Bulk
Diameter: 0.022" (0.56mm)
Wire Gauge: 23 AWG, 24 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 8.8 oz (250g)
Process: Leaded
Flux Type: Rosin Mildly Activated (RMA)
Description: 63/37 381 5C 0.56MM 0.25KG AM
Packaging: Bulk
Diameter: 0.022" (0.56mm)
Wire Gauge: 23 AWG, 24 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 8.8 oz (250g)
Process: Leaded
Flux Type: Rosin Mildly Activated (RMA)
товар відсутній
| 1210679 |
Виробник: Harimatec Inc.
Description: LOCTITE MCF 800 5GAL PAIL
Packaging: Bulk
Type: Flux - No Clean, Water-Soluble
Form: Container, 5 gal
Description: LOCTITE MCF 800 5GAL PAIL
Packaging: Bulk
Type: Flux - No Clean, Water-Soluble
Form: Container, 5 gal
товар відсутній
| 1334251 |
|
Виробник: Harimatec Inc.
Description: FLUX - NO CLEAN
Packaging: Bulk
Type: Flux - No Clean, Tacky Solder
Part Status: Obsolete
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: FLUX - NO CLEAN
Packaging: Bulk
Type: Flux - No Clean, Tacky Solder
Part Status: Obsolete
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
товар відсутній
| 1354225 |
Виробник: Harimatec Inc.
Description: LOCTITE WS 300 97SCT3V 75G SYRIN
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423°F (217°C)
Form: Syringe, 2.65 oz (75g)
Process: Lead Free
Flux Type: Water Soluble
Storage/Refrigeration Temperature: 35.6°F ~ 46.4°F (2°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: LOCTITE WS 300 97SCT3V 75G SYRIN
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423°F (217°C)
Form: Syringe, 2.65 oz (75g)
Process: Lead Free
Flux Type: Water Soluble
Storage/Refrigeration Temperature: 35.6°F ~ 46.4°F (2°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
товар відсутній
| 1354250 |
Виробник: Harimatec Inc.
Description: LOCTITE WS 300 97SCT3V 500G SEMC
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423°F (217°C)
Form: Syringe, 2.65 oz (75g)
Process: Lead Free
Flux Type: Water Soluble
Storage/Refrigeration Temperature: 35.6°F ~ 46.4°F (2°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: LOCTITE WS 300 97SCT3V 500G SEMC
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423°F (217°C)
Form: Syringe, 2.65 oz (75g)
Process: Lead Free
Flux Type: Water Soluble
Storage/Refrigeration Temperature: 35.6°F ~ 46.4°F (2°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
товар відсутній
| 1354291 |
Виробник: Harimatec Inc.
Description: LOCTITE WS 300 97SCT3V 500G JAR
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423°F (217°C)
Form: Jar, 17.64 oz (500g)
Process: Lead Free
Flux Type: Water Soluble
Storage/Refrigeration Temperature: 35.6°F ~ 46.4°F (2°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: LOCTITE WS 300 97SCT3V 500G JAR
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423°F (217°C)
Form: Jar, 17.64 oz (500g)
Process: Lead Free
Flux Type: Water Soluble
Storage/Refrigeration Temperature: 35.6°F ~ 46.4°F (2°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
товар відсутній
| 1354296 |
|
Виробник: Harimatec Inc.
Description: 63S4 WS200 ACP PASTE 600G SEMCO
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Cartridge, 21.16 oz (600g)
Mesh Type: 3
Process: Leaded
Flux Type: Water Soluble
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: 63S4 WS200 ACP PASTE 600G SEMCO
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Cartridge, 21.16 oz (600g)
Mesh Type: 3
Process: Leaded
Flux Type: Water Soluble
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
товар відсутній
| 1394819 |
|
Виробник: Harimatec Inc.
Description: 92A DA100 DAP85V
Packaging: Bulk
Type: Solder Paste
Melting Point: 546 ~ 567°F (286 ~ 297°C)
Form: Syringe, 1.06 oz (30g)
Mesh Type: 4
Part Status: Obsolete
Storage/Refrigeration Temperature: -0.4°F (-18°C), 41°F ~ 50°F (5°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: 92A DA100 DAP85V
Packaging: Bulk
Type: Solder Paste
Melting Point: 546 ~ 567°F (286 ~ 297°C)
Form: Syringe, 1.06 oz (30g)
Mesh Type: 4
Part Status: Obsolete
Storage/Refrigeration Temperature: -0.4°F (-18°C), 41°F ~ 50°F (5°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
товар відсутній
| 1405650 |
Виробник: Harimatec Inc.
Description: LOCTITE WS 300 97SCDAP88V 500G J
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423°F (217°C)
Form: Jar, 17.64 oz (500g)
Process: Lead Free
Flux Type: Water Soluble
Part Status: Not For New Designs
Storage/Refrigeration Temperature: 35.6°F ~ 46.4°F (2°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: LOCTITE WS 300 97SCDAP88V 500G J
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423°F (217°C)
Form: Jar, 17.64 oz (500g)
Process: Lead Free
Flux Type: Water Soluble
Part Status: Not For New Designs
Storage/Refrigeration Temperature: 35.6°F ~ 46.4°F (2°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
товар відсутній
| 1405673 |
Виробник: Harimatec Inc.
Description: LOCTITE WS 300 97SCDAP88V 500G S
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423°F (217°C)
Form: Cartridge, 17.64 oz (500g)
Process: Lead Free
Flux Type: Water Soluble
Part Status: Not For New Designs
Storage/Refrigeration Temperature: 35.6°F ~ 46.4°F (2°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: LOCTITE WS 300 97SCDAP88V 500G S
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423°F (217°C)
Form: Cartridge, 17.64 oz (500g)
Process: Lead Free
Flux Type: Water Soluble
Part Status: Not For New Designs
Storage/Refrigeration Temperature: 35.6°F ~ 46.4°F (2°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
товар відсутній
| 1405711 |
|
Виробник: Harimatec Inc.
Description: LOCTITE MP 218 SN63DAP89.5V RU
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Cartridge, 24.69 oz (700g)
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean
Part Status: Obsolete
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: LOCTITE MP 218 SN63DAP89.5V RU
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Cartridge, 24.69 oz (700g)
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean
Part Status: Obsolete
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
товар відсутній
| 1434501 |
Виробник: Harimatec Inc.
Description: LOCTITE LF 318M 97SCAGS88.5V 600
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 350°F (177°C)
Form: Cartridge, 21.16 oz (600g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: LOCTITE LF 318M 97SCAGS88.5V 600
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 350°F (177°C)
Form: Cartridge, 21.16 oz (600g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
товар відсутній
| 1434504 |
Виробник: Harimatec Inc.
Description: LOCTITE LF 318M 97SCAGS88.5V 500
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423°F (217°C)
Form: Jar, 17.64 oz (500g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: LOCTITE LF 318M 97SCAGS88.5V 500
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423°F (217°C)
Form: Jar, 17.64 oz (500g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
товар відсутній
| 1434537 |
Виробник: Harimatec Inc.
Description: LOCTITE LF 318M 97SCDAP88.5V 600
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423°F (217°C)
Form: Cartridge, 21.16 oz (600g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Obsolete
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: LOCTITE LF 318M 97SCDAP88.5V 600
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423°F (217°C)
Form: Cartridge, 21.16 oz (600g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Obsolete
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
товар відсутній
| 1728117 |
|
Виробник: Harimatec Inc.
Description: LOCTITE LF 318 97SCAGS885V 25G S
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423°F (217°C)
Form: Syringe, 0.88 oz (25g)
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: LOCTITE LF 318 97SCAGS885V 25G S
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423°F (217°C)
Form: Syringe, 0.88 oz (25g)
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
товар відсутній
| 1747469 |
Виробник: Harimatec Inc.
Description: LOCTITE HF 250DP 96SCKBP84V 25G
Packaging: Bulk
Composition: Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7)
Type: Solder Paste
Melting Point: 423°F (217°C)
Form: Cartridge, 0.88 oz (25g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Obsolete
Description: LOCTITE HF 250DP 96SCKBP84V 25G
Packaging: Bulk
Composition: Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7)
Type: Solder Paste
Melting Point: 423°F (217°C)
Form: Cartridge, 0.88 oz (25g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Obsolete
товар відсутній
| 1817250 |
|
Виробник: Harimatec Inc.
Description: SAC0307 HF212AGS88.5
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423°F (217°C)
Form: Cartridge, 21.16 oz (600g)
Process: Lead Free
Part Status: Obsolete
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life: 6 Months
Description: SAC0307 HF212AGS88.5
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423°F (217°C)
Form: Cartridge, 21.16 oz (600g)
Process: Lead Free
Part Status: Obsolete
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life: 6 Months
товар відсутній
| 1844641 |
Виробник: Harimatec Inc.
Description: LOCTITE HF 212 90ISCAGS88.5 500G
Packaging: Bulk
Composition: SnAg3.8Cu0.7Bi3Sb1.4Ni0.15
Type: Solder Paste
Melting Point: 408 ~ 424°F (209 ~ 218°C)
Form: Jar, 17.64 oz (500g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Obsolete
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: LOCTITE HF 212 90ISCAGS88.5 500G
Packaging: Bulk
Composition: SnAg3.8Cu0.7Bi3Sb1.4Ni0.15
Type: Solder Paste
Melting Point: 408 ~ 424°F (209 ~ 218°C)
Form: Jar, 17.64 oz (500g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Obsolete
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
товар відсутній
| 1844644 |
Виробник: Harimatec Inc.
Description: LOCTITE HF 212 90ISCDAP88.5 500G
Packaging: Bulk
Composition: SnAg3.8Cu0.7Bi3Sb1.4Ni0.15
Type: Solder Paste
Melting Point: 409 ~ 424°F (209 ~ 218°C)
Form: Jar, 17.64 oz (500g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Obsolete
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: LOCTITE HF 212 90ISCDAP88.5 500G
Packaging: Bulk
Composition: SnAg3.8Cu0.7Bi3Sb1.4Ni0.15
Type: Solder Paste
Melting Point: 409 ~ 424°F (209 ~ 218°C)
Form: Jar, 17.64 oz (500g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Obsolete
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
товар відсутній
| 1844657 |
Виробник: Harimatec Inc.
Description: LOCTITE HF 212 90ISCDAP88.5 600G
Packaging: Bulk
Composition: SnAg3.8Cu0.7Bi3Sb1.4Ni0.15
Type: Solder Paste
Melting Point: 410 ~ 424°F (209 ~ 218°C)
Form: Jar, 21.16 oz (600g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Obsolete
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: LOCTITE HF 212 90ISCDAP88.5 600G
Packaging: Bulk
Composition: SnAg3.8Cu0.7Bi3Sb1.4Ni0.15
Type: Solder Paste
Melting Point: 410 ~ 424°F (209 ~ 218°C)
Form: Jar, 21.16 oz (600g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Obsolete
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
товар відсутній
| 1844674 |
Виробник: Harimatec Inc.
Description: LOCTITE HF 212 90ISCAGS88.5 600G
Packaging: Bulk
Composition: SnAg3.8Cu0.7Bi3Sb1.4Ni0.15
Type: Solder Paste
Melting Point: 411 ~ 424°F (209 ~ 218°C)
Form: Jar, 21.16 oz (600g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Obsolete
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: LOCTITE HF 212 90ISCAGS88.5 600G
Packaging: Bulk
Composition: SnAg3.8Cu0.7Bi3Sb1.4Ni0.15
Type: Solder Paste
Melting Point: 411 ~ 424°F (209 ~ 218°C)
Form: Jar, 21.16 oz (600g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Obsolete
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
товар відсутній
| 1844685 |
Виробник: Harimatec Inc.
Description: LOCTITE HF 212 97SCAGS88.5 600G
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 401 ~ 424°F (205 ~ 218°C)
Form: Cartridge, 6 oz (170.10g)
Process: Lead Free
Flux Type: No-Clean
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: LOCTITE HF 212 97SCAGS88.5 600G
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 401 ~ 424°F (205 ~ 218°C)
Form: Cartridge, 6 oz (170.10g)
Process: Lead Free
Flux Type: No-Clean
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
товар відсутній
| 1846154 |
Виробник: Harimatec Inc.
Description: LOCTITE HF 212 97SCAGS88.5 500G
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423°F (217°C)
Form: Jar, 17.64 oz (500g)
Process: Lead Free
Flux Type: No-Clean
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: LOCTITE HF 212 97SCAGS88.5 500G
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423°F (217°C)
Form: Jar, 17.64 oz (500g)
Process: Lead Free
Flux Type: No-Clean
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
товар відсутній
| 1893165 |
товар відсутній
| 1910690 |
Виробник: Harimatec Inc.
Description: LOCTITE MSC 1000CUS CLEANER
Packaging: Bulk
Accessory Type: Cleaner
Part Status: Obsolete
Description: LOCTITE MSC 1000CUS CLEANER
Packaging: Bulk
Accessory Type: Cleaner
Part Status: Obsolete
товар відсутній
| 1993881 |
|
Виробник: Harimatec Inc.
Description: LOCTITE GC 10 SAC305T4 885 52U
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423°F (217°C)
Form: Jar, 17.64 oz (500g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 41°F ~ 77°F (5°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: LOCTITE GC 10 SAC305T4 885 52U
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423°F (217°C)
Form: Jar, 17.64 oz (500g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 41°F ~ 77°F (5°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
на замовлення 11 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 9941.34 грн |
| 5+ | 8796.73 грн |
| 10+ | 8279.31 грн |
| 2003721 |
|
Виробник: Harimatec Inc.
Description: LOCTITE GC 10 SAC305T4 885 53U
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423°F (217°C)
Form: Cartridge, 21.16 oz (600g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 41°F ~ 77°F (5°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: LOCTITE GC 10 SAC305T4 885 53U
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423°F (217°C)
Form: Cartridge, 21.16 oz (600g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 41°F ~ 77°F (5°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
на замовлення 16 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 12009.32 грн |
| 5+ | 10626.58 грн |
| 10+ | 10001.56 грн |
| 2023628 |
|
Виробник: Harimatec Inc.
Description: LOCTITE GC 10 SAC305T3 885 52U
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423°F (217°C)
Form: Jar, 17.64 oz (500g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 41°F ~ 77°F (5°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: LOCTITE GC 10 SAC305T3 885 52U
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423°F (217°C)
Form: Jar, 17.64 oz (500g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 41°F ~ 77°F (5°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
товар відсутній
| 2023641 |
|
Виробник: Harimatec Inc.
Description: LOCTITE GC 10 SAC305T3 885 53U
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423°F (217°C)
Form: Cartridge, 21.16 oz (600g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 41°F ~ 77°F (5°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: LOCTITE GC 10 SAC305T3 885 53U
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423°F (217°C)
Form: Cartridge, 21.16 oz (600g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 41°F ~ 77°F (5°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
товар відсутній
| 2040987 |
Виробник: Harimatec Inc.
Description: LOCTITE GC 3W SAC305T4 895V 53U
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423°F (217°C)
Form: Cartridge, 21.16 oz (600g)
Process: Lead Free
Flux Type: Water Soluble
Storage/Refrigeration Temperature: 32°F ~ 77°F (0°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: LOCTITE GC 3W SAC305T4 895V 53U
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423°F (217°C)
Form: Cartridge, 21.16 oz (600g)
Process: Lead Free
Flux Type: Water Soluble
Storage/Refrigeration Temperature: 32°F ~ 77°F (0°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
товар відсутній
| 2040989 |
Виробник: Harimatec Inc.
Description: LOCTITE GC 3W SAC305T4 895V 52U
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423°F (217°C)
Form: Jar, 17.64 oz (500g)
Process: Lead Free
Flux Type: Water Soluble
Storage/Refrigeration Temperature: 32°F ~ 77°F (0°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: LOCTITE GC 3W SAC305T4 895V 52U
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423°F (217°C)
Form: Jar, 17.64 oz (500g)
Process: Lead Free
Flux Type: Water Soluble
Storage/Refrigeration Temperature: 32°F ~ 77°F (0°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
товар відсутній
| 2041005 |
|
Виробник: Harimatec Inc.
Description: LOCTITE GC 3W SAC305T3 895V 52U
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423°F (217°C)
Form: Jar, 17.64 oz (500g)
Process: Lead Free
Flux Type: Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 77°F (0°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: LOCTITE GC 3W SAC305T3 895V 52U
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423°F (217°C)
Form: Jar, 17.64 oz (500g)
Process: Lead Free
Flux Type: Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 77°F (0°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
на замовлення 9 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 10387.41 грн |
| 5+ | 9191.63 грн |
| 2041006 |
|
Виробник: Harimatec Inc.
Description: LOCTITE GC 3W SAC305T3 895V 53U
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423°F (217°C)
Form: Cartridge, 21.16 oz (600g)
Process: Lead Free
Flux Type: Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 77°F (0°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: LOCTITE GC 3W SAC305T3 895V 53U
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423°F (217°C)
Form: Cartridge, 21.16 oz (600g)
Process: Lead Free
Flux Type: Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 77°F (0°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
на замовлення 2 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 12110.96 грн |
| 2064239 |
Виробник: Harimatec Inc.
Description: LOCTITE GC 10 SAC305T3 885V 2U P
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423°F (217°C)
Form: Cartridge, 29.98 oz (850g)
Process: Lead Free
Flux Type: No-Clean
Storage/Refrigeration Temperature: 41°F ~ 77°F (5°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: LOCTITE GC 10 SAC305T3 885V 2U P
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423°F (217°C)
Form: Cartridge, 29.98 oz (850g)
Process: Lead Free
Flux Type: No-Clean
Storage/Refrigeration Temperature: 41°F ~ 77°F (5°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
товар відсутній
| 2064242 |
Виробник: Harimatec Inc.
Description: LOCTITE GC 10 SAC305T4 885V 2U P
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423°F (217°C)
Form: Cartridge, 29.98 oz (850g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Obsolete
Storage/Refrigeration Temperature: 41°F ~ 77°F (5°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: LOCTITE GC 10 SAC305T4 885V 2U P
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423°F (217°C)
Form: Cartridge, 29.98 oz (850g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Obsolete
Storage/Refrigeration Temperature: 41°F ~ 77°F (5°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
товар відсутній
| 2323877 |
|
Виробник: Harimatec Inc.
Description: SOLDER MASK MSC 1000S 250 ML
Packaging: Bulk
For Use With/Related Products: Printed Circuit Boards
Accessory Type: Solder Mask
Part Status: Obsolete
Description: SOLDER MASK MSC 1000S 250 ML
Packaging: Bulk
For Use With/Related Products: Printed Circuit Boards
Accessory Type: Solder Mask
Part Status: Obsolete
товар відсутній
| 2327449 |
Виробник: Harimatec Inc.
Description: LOCTITE X33-08I 1 GALLON
Packaging: Bulk
Type: Flux - No Clean, Lead Free, Liquid
Form: Container, 1 gal
Description: LOCTITE X33-08I 1 GALLON
Packaging: Bulk
Type: Flux - No Clean, Lead Free, Liquid
Form: Container, 1 gal
товар відсутній
| 2370856 |
|
Виробник: Harimatec Inc.
Description: LOCTITE GC 50 SAC305T5 84V 62K
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423°F (217°C)
Form: Cartridge
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 41°F ~ 77°F (5°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: LOCTITE GC 50 SAC305T5 84V 62K
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423°F (217°C)
Form: Cartridge
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 41°F ~ 77°F (5°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
товар відсутній
| 2472657 |
|
Виробник: Harimatec Inc.
Description: LOCTITE GC 18 SAC305T3 885V 53U
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423°F (217°C)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 41°F ~ 77°F (5°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: LOCTITE GC 18 SAC305T3 885V 53U
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423°F (217°C)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 41°F ~ 77°F (5°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
товар відсутній
| 2472658 |
|
Виробник: Harimatec Inc.
Description: LOCTITE GC 18 SAC305T4 885V 53U
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423°F (217°C)
Process: Lead Free
Flux Type: No-Clean
Part Status: Obsolete
Storage/Refrigeration Temperature: 41°F ~ 77°F (5°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: LOCTITE GC 18 SAC305T4 885V 53U
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423°F (217°C)
Process: Lead Free
Flux Type: No-Clean
Part Status: Obsolete
Storage/Refrigeration Temperature: 41°F ~ 77°F (5°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
товар відсутній
| 2472659 |
|
Виробник: Harimatec Inc.
Description: LOCTITE GC 18 SAC305T3 885V 52U
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423°F (217°C)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 41°F ~ 77°F (5°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: LOCTITE GC 18 SAC305T3 885V 52U
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423°F (217°C)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 41°F ~ 77°F (5°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
товар відсутній
| 2591111 |
|
Виробник: Harimatec Inc.
Description: LOCTITE GC 50 SAC305T5 84V 12K
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423°F (217°C)
Form: Cartridge
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 41°F ~ 77°F (5°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: LOCTITE GC 50 SAC305T5 84V 12K
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423°F (217°C)
Form: Cartridge
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 41°F ~ 77°F (5°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
товар відсутній
| 2591112 |
|
Виробник: Harimatec Inc.
Description: LOCTITE GC 50 SAC305T5 84V 74K
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423°F (217°C)
Form: Cartridge
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 41°F ~ 77°F (5°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: LOCTITE GC 50 SAC305T5 84V 74K
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423°F (217°C)
Form: Cartridge
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 41°F ~ 77°F (5°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
на замовлення 10 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 3639.43 грн |
| 5+ | 3212.27 грн |
| 10+ | 2774.14 грн |
| 291007 |
|
Виробник: Harimatec Inc.
Description: DESOLDER BRAID NO-CLN 0.1" 100'
Packaging: Bulk
Length: 100' (30.5m)
Type: No Clean
Width: 0.100" (2.54mm)
ESD Protection: Static Dissipative (SD)
Product Type: Braid/Wick
Description: DESOLDER BRAID NO-CLN 0.1" 100'
Packaging: Bulk
Length: 100' (30.5m)
Type: No Clean
Width: 0.100" (2.54mm)
ESD Protection: Static Dissipative (SD)
Product Type: Braid/Wick
товар відсутній
| 386818 |
|
Виробник: Harimatec Inc.
Description: 63/37 HYDRO-X 2% .032DIA 20AWG
Packaging: Bulk
Diameter: 0.032" (0.81mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 70°F ~ 85°F (20°C ~ 30°C)
Description: 63/37 HYDRO-X 2% .032DIA 20AWG
Packaging: Bulk
Diameter: 0.032" (0.81mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 70°F ~ 85°F (20°C ~ 30°C)
на замовлення 25 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 4087.69 грн |
| 5+ | 3608.43 грн |
| 10+ | 3116.29 грн |
| 386820 |
|
Виробник: Harimatec Inc.
Description: 63/37 HYDRO-X 2% .022DIA 23AWG
Packaging: Bulk
Diameter: 0.022" (0.56mm)
Wire Gauge: 23 AWG, 24 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 8.8 oz (250g)
Process: Leaded
Flux Type: Water Soluble
Part Status: Active
Description: 63/37 HYDRO-X 2% .022DIA 23AWG
Packaging: Bulk
Diameter: 0.022" (0.56mm)
Wire Gauge: 23 AWG, 24 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 8.8 oz (250g)
Process: Leaded
Flux Type: Water Soluble
Part Status: Active
товар відсутній
| 386824 |
|
Виробник: Harimatec Inc.
Description: 60/40 370 3% .024DIA 22AWG
Packaging: Bulk
Diameter: 0.024" (0.61mm)
Wire Gauge: 22 AWG, 23 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 374°F (183 ~ 190°C)
Form: Spool, 17.64 oz (500g)
Process: Leaded
Flux Type: Rosin Activated (RA)
Part Status: Active
Description: 60/40 370 3% .024DIA 22AWG
Packaging: Bulk
Diameter: 0.024" (0.61mm)
Wire Gauge: 22 AWG, 23 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 374°F (183 ~ 190°C)
Form: Spool, 17.64 oz (500g)
Process: Leaded
Flux Type: Rosin Activated (RA)
Part Status: Active
на замовлення 52 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 4108.89 грн |
| 5+ | 3627.16 грн |
| 10+ | 3132.56 грн |
| 40+ | 2475.61 грн |
| 386827 |
|
Виробник: Harimatec Inc.
Description: 60/40 370 3% .032DIA 20AWG
Packaging: Bulk
Diameter: 0.032" (0.81mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 374°F (183 ~ 190°C)
Form: Spool, 17.64 oz (500g)
Process: Leaded
Flux Type: Rosin Activated (RA)
Part Status: Active
Description: 60/40 370 3% .032DIA 20AWG
Packaging: Bulk
Diameter: 0.032" (0.81mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 374°F (183 ~ 190°C)
Form: Spool, 17.64 oz (500g)
Process: Leaded
Flux Type: Rosin Activated (RA)
Part Status: Active
товар відсутній
| 386832 |
|
Виробник: Harimatec Inc.
Description: 60/40 370 3% .064DIA. 14AWG
Packaging: Bulk
Diameter: 0.064" (1.63mm)
Wire Gauge: 14 AWG, 16 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 374°F (183 ~ 190°C)
Form: Spool, 17.64 oz (500g)
Process: Leaded
Flux Type: Rosin Activated (RA)
Part Status: Active
Description: 60/40 370 3% .064DIA. 14AWG
Packaging: Bulk
Diameter: 0.064" (1.63mm)
Wire Gauge: 14 AWG, 16 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 374°F (183 ~ 190°C)
Form: Spool, 17.64 oz (500g)
Process: Leaded
Flux Type: Rosin Activated (RA)
Part Status: Active
на замовлення 16 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 3841.26 грн |
| 5+ | 3390.84 грн |
| 10+ | 2928.49 грн |
| 386838 |
|
Виробник: Harimatec Inc.
Description: 60/40 C511 5C 1.22MM 0.5KG.048"
Packaging: Bulk
Diameter: 0.048" (1.22mm)
Wire Gauge: 16 AWG, 18 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 374°F (183 ~ 190°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Obsolete
Description: 60/40 C511 5C 1.22MM 0.5KG.048"
Packaging: Bulk
Diameter: 0.048" (1.22mm)
Wire Gauge: 16 AWG, 18 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 374°F (183 ~ 190°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Obsolete
товар відсутній
| 386839 |
|
Виробник: Harimatec Inc.
Description: 63/37 370 3% .032DIA 20AWG
Packaging: Spool
Diameter: 0.032" (0.81mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 17.64 oz (500g)
Process: Leaded
Flux Type: Rosin Activated (RA)
Description: 63/37 370 3% .032DIA 20AWG
Packaging: Spool
Diameter: 0.032" (0.81mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 17.64 oz (500g)
Process: Leaded
Flux Type: Rosin Activated (RA)
товар відсутній
Обрати Сторінку:
1
2
[ Наступна Сторінка >> ]