Продукція > ARIES ELECTRONICS > Всі товари виробника ARIES ELECTRONICS (15936) > Сторінка 85 з 266
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 04-1518-00 | Aries Electronics |
 Description: CONN IC DIP SOCKET 4POS GOLD |
товар відсутній |
||||||||||||||
| 05-0518-00 | Aries Electronics |
Description: CONN SOCKET SIP 5POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Surface Mount Type: SIP Number of Positions or Pins (Grid): 5 (1 x 5) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Part Status: Active |
на замовлення 376 шт: термін постачання 21-31 дні (днів) |
|
|||||||||||||
| 06-0518-00 | Aries Electronics |
Description: CONN SOCKET SIP 6POS GOLD |
товар відсутній |
||||||||||||||
| 06-1518-00 | Aries Electronics |
Description: CONN IC DIP SOCKET 6POS GOLD |
товар відсутній |
||||||||||||||
| 07-0518-00 | Aries Electronics |
Description: CONN SOCKET SIP 7POS GOLD |
товар відсутній |
||||||||||||||
| 08-0518-00 | Aries Electronics |
Description: CONN SOCKET SIP 8POS GOLD |
товар відсутній |
||||||||||||||
| 08-1518-00 | Aries Electronics |
Description: CONN IC DIP SOCKET 8POS GOLD |
товар відсутній |
||||||||||||||
| 09-0518-00 | Aries Electronics |
Description: CONN SOCKET SIP 9POS GOLD |
товар відсутній |
||||||||||||||
| 10-0518-00 | Aries Electronics |
Description: CONN SOCKET SIP 10POS GOLD |
товар відсутній |
||||||||||||||
| 10-1518-00 | Aries Electronics |
Description: CONN IC DIP SOCKET 10POS GOLD |
товар відсутній |
||||||||||||||
| 11-0518-00 | Aries Electronics |
Description: CONN SOCKET SIP 11POS GOLD |
товар відсутній |
||||||||||||||
| 12-0518-00 | Aries Electronics |
Description: CONN SOCKET SIP 12POS GOLD |
товар відсутній |
||||||||||||||
| 12-1518-00 | Aries Electronics |
Description: CONN IC DIP SOCKET 12POS GOLD |
товар відсутній |
||||||||||||||
| 13-0518-00 | Aries Electronics |
Description: CONN SOCKET SIP 13POS GOLD |
товар відсутній |
||||||||||||||
| 14-0518-00 | Aries Electronics |
Description: CONN SOCKET SIP 14POS GOLD |
товар відсутній |
||||||||||||||
| 14-1518-00 | Aries Electronics |
Description: CONN IC DIP SOCKET 14POS GOLD |
товар відсутній |
||||||||||||||
| 15-0518-00 | Aries Electronics |
Description: CONN SOCKET SIP 15POS GOLD |
товар відсутній |
||||||||||||||
 |
16-0518-00 | Aries Electronics |
Description: CONN SOCKET SIP 16POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Surface Mount Type: SIP Number of Positions or Pins (Grid): 16 (1 x 16) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Part Status: Active |
на замовлення 40 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||
 |
16-1518-00 | Aries Electronics |
Description: CONN IC DIP SOCKET 16POS GOLD |
товар відсутній |
|||||||||||||
| 17-0518-00 | Aries Electronics |
Description: CONN SOCKET SIP 17POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Surface Mount Type: SIP Number of Positions or Pins (Grid): 17 (1 x 17) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
товар відсутній |
||||||||||||||
| 18-0518-00 | Aries Electronics |
Description: CONN SOCKET SIP 18POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Surface Mount Type: SIP Number of Positions or Pins (Grid): 18 (1 x 18) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
товар відсутній |
||||||||||||||
| 18-1518-00 | Aries Electronics |
Description: CONN IC DIP SOCKET 18POS GOLD |
товар відсутній |
||||||||||||||
| 19-0518-00 | Aries Electronics |
Description: CONN SOCKET SIP 19POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Surface Mount Type: SIP Number of Positions or Pins (Grid): 19 (1 x 19) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Part Status: Active |
товар відсутній |
||||||||||||||
 |
20-0518-00 | Aries Electronics |
Description: CONN SOCKET SIP 20POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Surface Mount Type: SIP Number of Positions or Pins (Grid): 20 (1 x 20) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Part Status: Active |
на замовлення 173 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||
| 20-1518-00 | Aries Electronics |
Description: CONN IC DIP SOCKET 20POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Surface Mount Type: DIP, 0.2" (5.08mm) Row Spacing Number of Positions or Pins (Grid): 20 (2 x 10) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
товар відсутній |
||||||||||||||
| 21-0518-00 | Aries Electronics |
Description: CONN SOCKET SIP 21POS GOLD |
товар відсутній |
||||||||||||||
| 22-0518-00 | Aries Electronics |
Description: CONN SOCKET SIP 22POS GOLD |
товар відсутній |
||||||||||||||
| 22-1518-00 | Aries Electronics |
Description: CONN IC DIP SOCKET 22POS GOLD |
товар відсутній |
||||||||||||||
| 23-0518-00 | Aries Electronics |
Description: CONN SOCKET SIP 23POS GOLD |
товар відсутній |
||||||||||||||
| 24-0518-00 | Aries Electronics |
Description: CONN SOCKET SIP 24POS GOLD |
товар відсутній |
||||||||||||||
| 24-1518-00 | Aries Electronics |
Description: CONN IC DIP SOCKET 24POS GOLD |
товар відсутній |
||||||||||||||
| 25-0518-00 | Aries Electronics |
Description: CONN SOCKET SIP 25POS GOLD |
товар відсутній |
||||||||||||||
| 26-0518-00 | Aries Electronics |
Description: CONN SOCKET SIP 26POS GOLD |
товар відсутній |
||||||||||||||
| 26-1518-00 | Aries Electronics |
Description: CONN IC DIP SOCKET 26POS GOLD |
товар відсутній |
||||||||||||||
| 27-0518-00 | Aries Electronics |
Description: CONN SOCKET SIP 27POS GOLD |
товар відсутній |
||||||||||||||
| 28-0518-00 | Aries Electronics |
Description: CONN SOCKET SIP 28POS GOLD |
товар відсутній |
||||||||||||||
| 28-1518-00 | Aries Electronics |
Description: CONN IC DIP SOCKET 28POS GOLD |
товар відсутній |
||||||||||||||
| 29-0518-00 | Aries Electronics |
Description: CONN SOCKET SIP 29POS GOLD |
товар відсутній |
||||||||||||||
| 30-0518-00 | Aries Electronics |
Description: CONN SOCKET SIP 30POS GOLD |
товар відсутній |
||||||||||||||
| 30-1518-00 | Aries Electronics |
Description: CONN IC DIP SOCKET 30POS GOLD |
товар відсутній |
||||||||||||||
| 31-0518-00 | Aries Electronics |
Description: CONN SOCKET SIP 31POS GOLD |
товар відсутній |
||||||||||||||
| 32-0518-00 | Aries Electronics |
Description: CONN SOCKET SIP 32POS GOLD |
товар відсутній |
||||||||||||||
| 32-1518-00 | Aries Electronics |
Description: CONN IC DIP SOCKET 32POS GOLD |
товар відсутній |
||||||||||||||
| 33-0518-00 | Aries Electronics |
Description: CONN SOCKET SIP 33POS GOLD |
товар відсутній |
||||||||||||||
| 34-0518-00 | Aries Electronics |
Description: CONN SOCKET SIP 34POS GOLD |
товар відсутній |
||||||||||||||
| 34-1518-00 | Aries Electronics |
Description: CONN IC DIP SOCKET 34POS GOLD |
товар відсутній |
||||||||||||||
| 35-0518-00 | Aries Electronics |
Description: CONN SOCKET SIP 35POS GOLD |
товар відсутній |
||||||||||||||
| 36-0518-00 | Aries Electronics |
Description: CONN SOCKET SIP 36POS GOLD |
товар відсутній |
||||||||||||||
| 36-1518-00 | Aries Electronics |
Description: CONN IC DIP SOCKET 36POS GOLD |
товар відсутній |
||||||||||||||
| 37-0518-00 | Aries Electronics |
Description: CONN SOCKET SIP 37POS GOLD |
товар відсутній |
||||||||||||||
| 38-0518-00 | Aries Electronics |
Description: CONN SOCKET SIP 38POS GOLD |
товар відсутній |
||||||||||||||
| 38-1518-00 | Aries Electronics |
Description: CONN IC DIP SOCKET 38POS GOLD |
товар відсутній |
||||||||||||||
| 39-0518-00 | Aries Electronics |
Description: CONN SOCKET SIP 39POS GOLD |
товар відсутній |
||||||||||||||
| 40-0518-00 | Aries Electronics |
Description: CONN SOCKET SIP 40POS GOLD |
товар відсутній |
||||||||||||||
| 40-1518-00 | Aries Electronics |
Description: CONN IC DIP SOCKET 40POS GOLD |
товар відсутній |
||||||||||||||
| 58-1518-00 | Aries Electronics |
Description: CONN IC DIP SOCKET 58POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.2" (5.08mm) Row Spacing Number of Positions or Pins (Grid): 58 (2 x 29) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
товар відсутній |
||||||||||||||
| 01-0518-10 | Aries Electronics |
Description: CONN SOCKET SIP 1POS GOLD |
товар відсутній |
||||||||||||||
| 01-0518-10H | Aries Electronics |
Description: CONN SOCKET SIP 1POS GOLD |
товар відсутній |
||||||||||||||
| 01-0518-10T | Aries Electronics |
Description: CONN SOCKET SIP 1POS GOLD |
товар відсутній |
||||||||||||||
| 01-0518-11 | Aries Electronics |
Description: CONN SOCKET SIP 1POS GOLD |
товар відсутній |
| 05-0518-00 |
|
Виробник: Aries Electronics
Description: CONN SOCKET SIP 5POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: SIP
Number of Positions or Pins (Grid): 5 (1 x 5)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
Description: CONN SOCKET SIP 5POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: SIP
Number of Positions or Pins (Grid): 5 (1 x 5)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
на замовлення 376 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 4+ | 82.72 грн |
| 10+ | 67.64 грн |
| 25+ | 64.83 грн |
| 50+ | 59.55 грн |
| 100+ | 56.96 грн |
| 250+ | 51.78 грн |
| 16-0518-00 |
|
Виробник: Aries Electronics
Description: CONN SOCKET SIP 16POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: SIP
Number of Positions or Pins (Grid): 16 (1 x 16)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
Description: CONN SOCKET SIP 16POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: SIP
Number of Positions or Pins (Grid): 16 (1 x 16)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
на замовлення 40 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 263.97 грн |
| 10+ | 230.8 грн |
| 25+ | 218.59 грн |
| 17-0518-00 |
|
Виробник: Aries Electronics
Description: CONN SOCKET SIP 17POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: SIP
Number of Positions or Pins (Grid): 17 (1 x 17)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: CONN SOCKET SIP 17POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: SIP
Number of Positions or Pins (Grid): 17 (1 x 17)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
| 18-0518-00 |
|
Виробник: Aries Electronics
Description: CONN SOCKET SIP 18POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: SIP
Number of Positions or Pins (Grid): 18 (1 x 18)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: CONN SOCKET SIP 18POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: SIP
Number of Positions or Pins (Grid): 18 (1 x 18)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
| 19-0518-00 |
|
Виробник: Aries Electronics
Description: CONN SOCKET SIP 19POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: SIP
Number of Positions or Pins (Grid): 19 (1 x 19)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
Description: CONN SOCKET SIP 19POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: SIP
Number of Positions or Pins (Grid): 19 (1 x 19)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
товар відсутній
| 20-0518-00 |
|
Виробник: Aries Electronics
Description: CONN SOCKET SIP 20POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: SIP
Number of Positions or Pins (Grid): 20 (1 x 20)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
Description: CONN SOCKET SIP 20POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: SIP
Number of Positions or Pins (Grid): 20 (1 x 20)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
на замовлення 173 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 332.4 грн |
| 10+ | 290.25 грн |
| 25+ | 274.9 грн |
| 50+ | 251.98 грн |
| 100+ | 239.97 грн |
| 20-1518-00 |
|
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 20POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 20POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
| 58-1518-00 |
|
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 58POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid): 58 (2 x 29)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 58POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid): 58 (2 x 29)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній