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50-9518-11 Aries Electronics 12016-open-frame-dip-collet-solder-tail-socket.pdf Description: CONN IC DIP SOCKET 50POS GOLD
товар відсутній
50-9518-11H Aries Electronics 12016-open-frame-dip-collet-solder-tail-socket.pdf Description: CONN IC DIP SOCKET 50POS GOLD
товар відсутній
64-9518-10E Aries Electronics 12016-open-frame-dip-collet-solder-tail-socket.pdf Description: CONN IC DIP SOCKET 64POS GOLD
товар відсутній
64-9518-10H Aries Electronics 12016-open-frame-dip-collet-solder-tail-socket.pdf Description: CONN IC DIP SOCKET 64POS GOLD
товар відсутній
64-9518-10M Aries Electronics 12016-open-frame-dip-collet-solder-tail-socket.pdf Description: CONN IC DIP SOCKET 64POS GOLD
товар відсутній
64-9518-10T Aries Electronics 12016-open-frame-dip-collet-solder-tail-socket.pdf Description: CONN IC DIP SOCKET 64POS GOLD
товар відсутній
64-9518-10TE Aries Electronics 12016-open-frame-dip-collet-solder-tail-socket.pdf Description: CONN IC DIP SOCKET 64POS GOLD
товар відсутній
64-9518-11 Aries Electronics 12016-open-frame-dip-collet-solder-tail-socket.pdf Description: CONN IC DIP SOCKET 64POS GOLD
товар відсутній
64-9518-11H Aries Electronics 12016-open-frame-dip-collet-solder-tail-socket.pdf Description: CONN IC DIP SOCKET 64POS GOLD
товар відсутній
1107425 Aries Electronics Description: 508 OPN FRM COLLET SCKT WIRE WRP
товар відсутній
1108594 Aries Electronics 12017-open-frame-dip-collet-wire-wrap-socket.pdf Description: 508 OPN FRM COLLET SCKT WIRE WRP
Part Status: Active
товар відсутній
06-3508-20 Aries Electronics 12017-open-frame-dip-collet-wire-wrap-socket.pdf Description: CONN IC DIP SOCKET 6POS GOLD
товар відсутній
06-3508-21 Aries Electronics 12017-open-frame-dip-collet-wire-wrap-socket.pdf Description: CONN IC DIP SOCKET 6POS GOLD
товар відсутній
06-3508-30 Aries Electronics 12017-open-frame-dip-collet-wire-wrap-socket.pdf Description: CONN IC DIP SOCKET 6POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
товар відсутній
06-3508-31 Aries Electronics 12017-open-frame-dip-collet-wire-wrap-socket.pdf Description: CONN IC DIP SOCKET 6POS GOLD
товар відсутній
08-3508-20 Aries Electronics 12017-open-frame-dip-collet-wire-wrap-socket.pdf Description: CONN IC DIP SOCKET 8POS GOLD
товар відсутній
08-3508-21 Aries Electronics 12017-open-frame-dip-collet-wire-wrap-socket.pdf Description: CONN IC DIP SOCKET 8POS GOLD
товар відсутній
08-3508-30 Aries Electronics 12017-open-frame-dip-collet-wire-wrap-socket.pdf Description: CONN IC DIP SOCKET 8POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
товар відсутній
08-3508-31 Aries Electronics 12017-open-frame-dip-collet-wire-wrap-socket.pdf Description: CONN IC DIP SOCKET 8POS GOLD
товар відсутній
14-3508-20 Aries Electronics 12017-open-frame-dip-collet-wire-wrap-socket.pdf Description: CONN IC DIP SOCKET 14POS GOLD
товар відсутній
14-3508-21 Aries Electronics 12017-open-frame-dip-collet-wire-wrap-socket.pdf Description: CONN IC DIP SOCKET 14POS GOLD
товар відсутній
14-3508-30 Aries Electronics 12017-open-frame-dip-collet-wire-wrap-socket.pdf Description: CONN IC DIP SOCKET 14POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
товар відсутній
14-3508-31 Aries Electronics 12017-open-frame-dip-collet-wire-wrap-socket.pdf Description: CONN IC DIP SOCKET 14POS GOLD
товар відсутній
16-3508-20 Aries Electronics 12017-open-frame-dip-collet-wire-wrap-socket.pdf Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
16-3508-21 Aries Electronics 12017-open-frame-dip-collet-wire-wrap-socket.pdf Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товар відсутній
16-3508-30 Aries Electronics 12017-open-frame-dip-collet-wire-wrap-socket.pdf Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
товар відсутній
16-3508-31 Aries Electronics 12017-open-frame-dip-collet-wire-wrap-socket.pdf Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товар відсутній
18-3508-20 Aries Electronics 12017-open-frame-dip-collet-wire-wrap-socket.pdf Description: CONN IC DIP SOCKET 18POS GOLD
товар відсутній
18-3508-21 Aries Electronics 12017-open-frame-dip-collet-wire-wrap-socket.pdf Description: CONN IC DIP SOCKET 18POS GOLD
товар відсутній
18-3508-30 Aries Electronics 12017-open-frame-dip-collet-wire-wrap-socket.pdf Description: CONN IC DIP SOCKET 18POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
товар відсутній
18-3508-31 Aries Electronics 12017-open-frame-dip-collet-wire-wrap-socket.pdf Description: CONN IC DIP SOCKET 18POS GOLD
товар відсутній
20-3508-20 Aries Electronics 12017-open-frame-dip-collet-wire-wrap-socket.pdf Description: CONN IC DIP SOCKET 20POS GOLD
товар відсутній
20-3508-21 Aries Electronics 12017-open-frame-dip-collet-wire-wrap-socket.pdf Description: CONN IC DIP SOCKET 20POS GOLD
товар відсутній
20-3508-30 Aries Electronics 12017-open-frame-dip-collet-wire-wrap-socket.pdf Description: CONN IC DIP SOCKET 20POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
товар відсутній
20-3508-31 Aries Electronics 12017-open-frame-dip-collet-wire-wrap-socket.pdf Description: CONN IC DIP SOCKET 20POS GOLD
товар відсутній
20-4508-20 Aries Electronics 12017-open-frame-dip-collet-wire-wrap-socket.pdf Description: CONN IC DIP SOCKET 20POS GOLD
товар відсутній
20-4508-21 Aries Electronics 12017-open-frame-dip-collet-wire-wrap-socket.pdf Description: CONN IC DIP SOCKET 20POS GOLD
товар відсутній
20-4508-30 Aries Electronics 12017-open-frame-dip-collet-wire-wrap-socket.pdf Description: CONN IC DIP SOCKET 20POS GOLD
товар відсутній
20-4508-31 Aries Electronics 12017-open-frame-dip-collet-wire-wrap-socket.pdf Description: CONN IC DIP SOCKET 20POS GOLD
товар відсутній
22-4508-20 Aries Electronics 12017-open-frame-dip-collet-wire-wrap-socket.pdf Description: CONN IC DIP SOCKET 22POS GOLD
товар відсутній
22-4508-21 Aries Electronics 12017-open-frame-dip-collet-wire-wrap-socket.pdf Description: CONN IC DIP SOCKET 22POS GOLD
товар відсутній
22-4508-30 Aries Electronics 12017-open-frame-dip-collet-wire-wrap-socket.pdf Description: CONN IC DIP SOCKET 22POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
22-4508-31 Aries Electronics 12017-open-frame-dip-collet-wire-wrap-socket.pdf Description: CONN IC DIP SOCKET 22POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товар відсутній
24-3508-20 Aries Electronics 12017-open-frame-dip-collet-wire-wrap-socket.pdf Description: CONN IC DIP SOCKET 24POS GOLD
товар відсутній
24-3508-21 Aries Electronics 12017-open-frame-dip-collet-wire-wrap-socket.pdf Description: CONN IC DIP SOCKET 24POS GOLD
товар відсутній
24-3508-30 Aries Electronics 12017-open-frame-dip-collet-wire-wrap-socket.pdf Description: CONN IC DIP SOCKET 24POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
товар відсутній
24-3508-31 Aries Electronics 12017-open-frame-dip-collet-wire-wrap-socket.pdf Description: CONN IC DIP SOCKET 24POS GOLD
товар відсутній
24-4508-20 Aries Electronics 12017-open-frame-dip-collet-wire-wrap-socket.pdf Description: CONN IC DIP SOCKET 24POS GOLD
товар відсутній
24-4508-21 Aries Electronics 12017-open-frame-dip-collet-wire-wrap-socket.pdf Description: CONN IC DIP SOCKET 24POS GOLD
товар відсутній
24-4508-30 Aries Electronics 12017-open-frame-dip-collet-wire-wrap-socket.pdf Description: CONN IC DIP SOCKET 24POS GOLD
товар відсутній
24-4508-31 Aries Electronics 12017-open-frame-dip-collet-wire-wrap-socket.pdf Description: CONN IC DIP SOCKET 24POS GOLD
товар відсутній
24-6508-20 Aries Electronics 12017-open-frame-dip-collet-wire-wrap-socket.pdf Description: CONN IC DIP SOCKET 24POS GOLD
товар відсутній
24-6508-21 Aries Electronics 12017-open-frame-dip-collet-wire-wrap-socket.pdf Description: CONN IC DIP SOCKET 24POS GOLD
товар відсутній
24-6508-30 Aries Electronics 12017-open-frame-dip-collet-wire-wrap-socket.pdf Description: CONN IC DIP SOCKET 24POS GOLD
товар відсутній
24-6508-31 Aries Electronics 12017-open-frame-dip-collet-wire-wrap-socket.pdf Description: CONN IC DIP SOCKET 24POS GOLD
товар відсутній
28-3508-20 Aries Electronics 12017-open-frame-dip-collet-wire-wrap-socket.pdf Description: CONN IC DIP SOCKET 28POS GOLD
товар відсутній
28-3508-21 Aries Electronics 12017-open-frame-dip-collet-wire-wrap-socket.pdf Description: CONN IC DIP SOCKET 28POS GOLD
товар відсутній
28-3508-30 Aries Electronics 12017-open-frame-dip-collet-wire-wrap-socket.pdf Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
товар відсутній
28-3508-31 Aries Electronics 12017-open-frame-dip-collet-wire-wrap-socket.pdf Description: CONN IC DIP SOCKET 28POS GOLD
товар відсутній
28-6508-20 Aries Electronics 12017-open-frame-dip-collet-wire-wrap-socket.pdf Description: CONN IC DIP SOCKET 28POS GOLD
товар відсутній
50-9518-11 12016-open-frame-dip-collet-solder-tail-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 50POS GOLD
товар відсутній
50-9518-11H 12016-open-frame-dip-collet-solder-tail-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 50POS GOLD
товар відсутній
64-9518-10E 12016-open-frame-dip-collet-solder-tail-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 64POS GOLD
товар відсутній
64-9518-10H 12016-open-frame-dip-collet-solder-tail-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 64POS GOLD
товар відсутній
64-9518-10M 12016-open-frame-dip-collet-solder-tail-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 64POS GOLD
товар відсутній
64-9518-10T 12016-open-frame-dip-collet-solder-tail-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 64POS GOLD
товар відсутній
64-9518-10TE 12016-open-frame-dip-collet-solder-tail-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 64POS GOLD
товар відсутній
64-9518-11 12016-open-frame-dip-collet-solder-tail-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 64POS GOLD
товар відсутній
64-9518-11H 12016-open-frame-dip-collet-solder-tail-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 64POS GOLD
товар відсутній
1107425
Виробник: Aries Electronics
Description: 508 OPN FRM COLLET SCKT WIRE WRP
товар відсутній
1108594 12017-open-frame-dip-collet-wire-wrap-socket.pdf
Виробник: Aries Electronics
Description: 508 OPN FRM COLLET SCKT WIRE WRP
Part Status: Active
товар відсутній
06-3508-20 12017-open-frame-dip-collet-wire-wrap-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 6POS GOLD
товар відсутній
06-3508-21 12017-open-frame-dip-collet-wire-wrap-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 6POS GOLD
товар відсутній
06-3508-30 12017-open-frame-dip-collet-wire-wrap-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 6POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
товар відсутній
06-3508-31 12017-open-frame-dip-collet-wire-wrap-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 6POS GOLD
товар відсутній
08-3508-20 12017-open-frame-dip-collet-wire-wrap-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
товар відсутній
08-3508-21 12017-open-frame-dip-collet-wire-wrap-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
товар відсутній
08-3508-30 12017-open-frame-dip-collet-wire-wrap-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
товар відсутній
08-3508-31 12017-open-frame-dip-collet-wire-wrap-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
товар відсутній
14-3508-20 12017-open-frame-dip-collet-wire-wrap-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 14POS GOLD
товар відсутній
14-3508-21 12017-open-frame-dip-collet-wire-wrap-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 14POS GOLD
товар відсутній
14-3508-30 12017-open-frame-dip-collet-wire-wrap-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 14POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
товар відсутній
14-3508-31 12017-open-frame-dip-collet-wire-wrap-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 14POS GOLD
товар відсутній
16-3508-20 12017-open-frame-dip-collet-wire-wrap-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
16-3508-21 12017-open-frame-dip-collet-wire-wrap-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товар відсутній
16-3508-30 12017-open-frame-dip-collet-wire-wrap-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
товар відсутній
16-3508-31 12017-open-frame-dip-collet-wire-wrap-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товар відсутній
18-3508-20 12017-open-frame-dip-collet-wire-wrap-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 18POS GOLD
товар відсутній
18-3508-21 12017-open-frame-dip-collet-wire-wrap-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 18POS GOLD
товар відсутній
18-3508-30 12017-open-frame-dip-collet-wire-wrap-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 18POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
товар відсутній
18-3508-31 12017-open-frame-dip-collet-wire-wrap-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 18POS GOLD
товар відсутній
20-3508-20 12017-open-frame-dip-collet-wire-wrap-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 20POS GOLD
товар відсутній
20-3508-21 12017-open-frame-dip-collet-wire-wrap-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 20POS GOLD
товар відсутній
20-3508-30 12017-open-frame-dip-collet-wire-wrap-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 20POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
товар відсутній
20-3508-31 12017-open-frame-dip-collet-wire-wrap-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 20POS GOLD
товар відсутній
20-4508-20 12017-open-frame-dip-collet-wire-wrap-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 20POS GOLD
товар відсутній
20-4508-21 12017-open-frame-dip-collet-wire-wrap-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 20POS GOLD
товар відсутній
20-4508-30 12017-open-frame-dip-collet-wire-wrap-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 20POS GOLD
товар відсутній
20-4508-31 12017-open-frame-dip-collet-wire-wrap-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 20POS GOLD
товар відсутній
22-4508-20 12017-open-frame-dip-collet-wire-wrap-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 22POS GOLD
товар відсутній
22-4508-21 12017-open-frame-dip-collet-wire-wrap-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 22POS GOLD
товар відсутній
22-4508-30 12017-open-frame-dip-collet-wire-wrap-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 22POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
22-4508-31 12017-open-frame-dip-collet-wire-wrap-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 22POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товар відсутній
24-3508-20 12017-open-frame-dip-collet-wire-wrap-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 24POS GOLD
товар відсутній
24-3508-21 12017-open-frame-dip-collet-wire-wrap-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 24POS GOLD
товар відсутній
24-3508-30 12017-open-frame-dip-collet-wire-wrap-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 24POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
товар відсутній
24-3508-31 12017-open-frame-dip-collet-wire-wrap-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 24POS GOLD
товар відсутній
24-4508-20 12017-open-frame-dip-collet-wire-wrap-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 24POS GOLD
товар відсутній
24-4508-21 12017-open-frame-dip-collet-wire-wrap-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 24POS GOLD
товар відсутній
24-4508-30 12017-open-frame-dip-collet-wire-wrap-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 24POS GOLD
товар відсутній
24-4508-31 12017-open-frame-dip-collet-wire-wrap-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 24POS GOLD
товар відсутній
24-6508-20 12017-open-frame-dip-collet-wire-wrap-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 24POS GOLD
товар відсутній
24-6508-21 12017-open-frame-dip-collet-wire-wrap-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 24POS GOLD
товар відсутній
24-6508-30 12017-open-frame-dip-collet-wire-wrap-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 24POS GOLD
товар відсутній
24-6508-31 12017-open-frame-dip-collet-wire-wrap-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 24POS GOLD
товар відсутній
28-3508-20 12017-open-frame-dip-collet-wire-wrap-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 28POS GOLD
товар відсутній
28-3508-21 12017-open-frame-dip-collet-wire-wrap-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 28POS GOLD
товар відсутній
28-3508-30 12017-open-frame-dip-collet-wire-wrap-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
товар відсутній
28-3508-31 12017-open-frame-dip-collet-wire-wrap-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 28POS GOLD
товар відсутній
28-6508-20 12017-open-frame-dip-collet-wire-wrap-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 28POS GOLD
товар відсутній
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