TE0813-02-2AE81-A Trenz Electronic GmbH
Виробник: Trenz Electronic GmbH
Description: MPSOC MODULE WITH AMD ZYNQ ULTRA
Packaging: Bulk
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
RAM Size: 4GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Flash Size: 128MB
Connector Type: Board-to-Board (BTB) Socket - 4 x 240
Core Processor: Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784E
Description: MPSOC MODULE WITH AMD ZYNQ ULTRA
Packaging: Bulk
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
RAM Size: 4GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Flash Size: 128MB
Connector Type: Board-to-Board (BTB) Socket - 4 x 240
Core Processor: Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784E
на замовлення 10 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 25166.95 грн |
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Технічний опис TE0813-02-2AE81-A Trenz Electronic GmbH
Description: MPSOC MODULE WITH AMD ZYNQ ULTRA, Packaging: Bulk, Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm), RAM Size: 4GB, Operating Temperature: 0°C ~ 85°C, Module/Board Type: MPU Core, Flash Size: 128MB, Connector Type: Board-to-Board (BTB) Socket - 4 x 240, Core Processor: Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784E.