TE0783-02-92I33MA Trenz Electronic GmbH
Виробник: Trenz Electronic GmbH
Description: HIGH-PERFORMANCE SOM WITH XILINX
Packaging: Bulk
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 3.350" L x 3.350" W (85.00mm x 85.00mm)
RAM Size: 1GB
Operating Temperature: -40°C ~ 85°C
Module/Board Type: MPU Core
Co-Processor: ARM Cortex-A9
Flash Size: 32MB
Part Status: Active
Core Processor: Zynq™ 7000 XC7Z045-2FFG900I
Description: HIGH-PERFORMANCE SOM WITH XILINX
Packaging: Bulk
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 3.350" L x 3.350" W (85.00mm x 85.00mm)
RAM Size: 1GB
Operating Temperature: -40°C ~ 85°C
Module/Board Type: MPU Core
Co-Processor: ARM Cortex-A9
Flash Size: 32MB
Part Status: Active
Core Processor: Zynq™ 7000 XC7Z045-2FFG900I
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Технічний опис TE0783-02-92I33MA Trenz Electronic GmbH
Description: HIGH-PERFORMANCE SOM WITH XILINX, Packaging: Bulk, Connector Type: Board-to-Board (BTB) Socket, Size / Dimension: 3.350" L x 3.350" W (85.00mm x 85.00mm), RAM Size: 1GB, Operating Temperature: -40°C ~ 85°C, Module/Board Type: MPU Core, Co-Processor: ARM Cortex-A9, Flash Size: 32MB, Part Status: Active, Core Processor: Zynq™ 7000 XC7Z045-2FFG900I.
Інші пропозиції TE0783-02-92I33MA
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
|---|---|---|---|---|---|
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TE0783-02-92I33MA | Виробник : Trenz Electronic | System-On-Modules - SOM High-Performance SoM with Xilinx Zynq Z-7045, Memory on both PS+PL, 8.5 x 8.5 |
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