SPC5602BAVLH4R NXP USA Inc.
Виробник: NXP USA Inc.
Description: NXP 32-BIT MCU, POWER ARCH CORE,
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0
Data Converters: A/D 36x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, FlexRay, LINbus, SCI, SPI
Peripherals: POR, LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 45
Description: NXP 32-BIT MCU, POWER ARCH CORE,
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0
Data Converters: A/D 36x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, FlexRay, LINbus, SCI, SPI
Peripherals: POR, LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 45
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Технічний опис SPC5602BAVLH4R NXP USA Inc.
Description: NXP 32-BIT MCU, POWER ARCH CORE,, Packaging: Tape & Reel (TR), Package / Case: 64-LQFP, Mounting Type: Surface Mount, Speed: 64MHz, Program Memory Size: 256KB (256K x 8), RAM Size: 24K x 8, Operating Temperature: -40°C ~ 125°C (TA), Oscillator Type: Internal, Program Memory Type: FLASH, EEPROM Size: 64K x 8, Core Processor: e200z0, Data Converters: A/D 36x10b SAR, Core Size: 32-Bit, Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V, Connectivity: CANbus, FlexRay, LINbus, SCI, SPI, Peripherals: POR, LVD, PWM, WDT, Supplier Device Package: 64-LQFP (10x10), Number of I/O: 45.