![SMDSWLF.059 3.3 1LB SMDSWLF.059 3.3 1LB](https://media.digikey.com/Photos/Chip%20Quik%20Photos/MFG_SMDSWLF.059%25203.3%25201LB.jpg)
SMDSWLF.059 3.3 1LB Chip Quik Inc.
![SMDSWLF.059 3.3 1LB.pdf](/images/adobe-acrobat.png)
Description: SOLDER WIRE SN96.5/AG3.0/CU0.5
Packaging: Bulk
Diameter: 0.059" (1.50mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 1 lb (453.59g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 17 шт:
термін постачання 21-31 дні (днів)
Кількість | Ціна без ПДВ |
---|---|
1+ | 8149.68 грн |
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Технічний опис SMDSWLF.059 3.3 1LB Chip Quik Inc.
Description: SOLDER WIRE SN96.5/AG3.0/CU0.5, Packaging: Bulk, Diameter: 0.059" (1.50mm), Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Type: Wire Solder, Melting Point: 423 ~ 428°F (217 ~ 220°C), Form: Spool, 1 lb (453.59g), Process: Lead Free, Flux Type: No-Clean, Water Soluble, Part Status: Active.