SMDLTLFP500T3C Chip Quik Inc.
![SMDLTLFP500T3C.pdf](/images/adobe-acrobat.png)
Description: SOLDER PASTE LOW TEMP T3 500G
Packaging: Cartridge
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 281°F (138°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
на замовлення 2 шт:
термін постачання 21-31 дні (днів)
Кількість | Ціна без ПДВ |
---|---|
1+ | 9728.07 грн |
Відгуки про товар
Написати відгук
Технічний опис SMDLTLFP500T3C Chip Quik Inc.
Description: SOLDER PASTE LOW TEMP T3 500G, Packaging: Cartridge, Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4), Type: Solder Paste, Melting Point: 281°F (138°C), Form: Cartridge, 17.64 oz (500g), Mesh Type: 3, Process: Lead Free, Flux Type: No-Clean, Part Status: Active, Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C), Shelf Life Start: Date of Manufacture, Shelf Life: 6 Months.