SMDLTLFP250T3 Chip Quik Inc.
Виробник: Chip Quik Inc.
Description: SOLDER PASTE SN42/BI58 250G
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 281°F (138°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SOLDER PASTE SN42/BI58 250G
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 281°F (138°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
на замовлення 5 шт:
термін постачання 21-31 дні (днів)
Кількість | Ціна без ПДВ |
---|---|
1+ | 4788.27 грн |
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Технічний опис SMDLTLFP250T3 Chip Quik Inc.
Description: SOLDER PASTE SN42/BI58 250G, Packaging: Bulk, Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4), Type: Solder Paste, Melting Point: 281°F (138°C), Form: Jar, 8.8 oz (250g), Mesh Type: 3, Process: Lead Free, Flux Type: No-Clean, Part Status: Active, Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C), Shelf Life Start: Date of Manufacture, Shelf Life: 6 Months.