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SMD4300SNL500T4C Chip Quik Inc.
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Description: SOLDER PASTE SAC305 T4 500G
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
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Технічний опис SMD4300SNL500T4C Chip Quik Inc.
Description: SOLDER PASTE SAC305 T4 500G, Packaging: Bulk, Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Type: Solder Paste, Melting Point: 423 ~ 428°F (217 ~ 220°C), Form: Cartridge, 17.64 oz (500g), Mesh Type: 4, Process: Lead Free, Flux Type: No-Clean, Water Soluble, Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C), Shelf Life Start: Date of Manufacture, Shelf Life: 6 Months.