SM662PXC-BDSS Silicon Motion, Inc.
Виробник: Silicon Motion, Inc.
Description: IC FLASH 160GBIT EMMC 153BGA
Packaging: Tray
Package / Case: 153-TFBGA
Mounting Type: Surface Mount
Memory Size: 160Gbit
Memory Type: Non-Volatile
Operating Temperature: -25°C ~ 85°C
Technology: FLASH - NAND (SLC)
Memory Format: FLASH
Supplier Device Package: 153-BGA (11.5x13)
Memory Interface: eMMC
Memory Organization: 20G x 8
DigiKey Programmable: Not Verified
Description: IC FLASH 160GBIT EMMC 153BGA
Packaging: Tray
Package / Case: 153-TFBGA
Mounting Type: Surface Mount
Memory Size: 160Gbit
Memory Type: Non-Volatile
Operating Temperature: -25°C ~ 85°C
Technology: FLASH - NAND (SLC)
Memory Format: FLASH
Supplier Device Package: 153-BGA (11.5x13)
Memory Interface: eMMC
Memory Organization: 20G x 8
DigiKey Programmable: Not Verified
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Технічний опис SM662PXC-BDSS Silicon Motion, Inc.
Description: IC FLASH 160GBIT EMMC 153BGA, Packaging: Tray, Package / Case: 153-TFBGA, Mounting Type: Surface Mount, Memory Size: 160Gbit, Memory Type: Non-Volatile, Operating Temperature: -25°C ~ 85°C, Technology: FLASH - NAND (SLC), Memory Format: FLASH, Supplier Device Package: 153-BGA (11.5x13), Memory Interface: eMMC, Memory Organization: 20G x 8, DigiKey Programmable: Not Verified.