S912ZVML32AVKHR NXP USA Inc.
Виробник: NXP USA Inc.
Description: S12Z CORE, 32K FLASH, LIN, 64LQF
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Number of I/O: 24
Description: S12Z CORE, 32K FLASH, LIN, 64LQF
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Number of I/O: 24
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Технічний опис S912ZVML32AVKHR NXP USA Inc.
Description: S12Z CORE, 32K FLASH, LIN, 64LQF, Packaging: Tape & Reel (TR), Package / Case: 64-LQFP Exposed Pad, Mounting Type: Surface Mount, Speed: 50MHz, Program Memory Size: 32KB (32K x 8), RAM Size: 4K x 8, Operating Temperature: -40°C ~ 105°C (TA), Oscillator Type: External, Internal, Program Memory Type: FLASH, EEPROM Size: 512 x 8, Core Processor: S12Z, Data Converters: A/D 9x12b SAR, Core Size: 16-Bit, Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V, Connectivity: CANbus, SCI, SPI, Peripherals: DMA, POR, PWM, WDT, Supplier Device Package: 64-HLQFP (10x10), Number of I/O: 24.