S32M242CCABMKHST NXP USA Inc.
Виробник: NXP USA Inc.Description: IC
Packaging: Bulk
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 6x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
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Технічний опис S32M242CCABMKHST NXP USA Inc.
Description: IC, Packaging: Bulk, Package / Case: 64-LQFP Exposed Pad, Mounting Type: Surface Mount, Speed: 80MHz, Program Memory Size: 256KB (256K x 8), RAM Size: 32K x 8, Operating Temperature: -40°C ~ 125°C (TA), Oscillator Type: External, Internal, Program Memory Type: FLASH, EEPROM Size: 64K x 8, Core Processor: ARM® Cortex®-M4F, Data Converters: A/D 6x12b SAR; D/A 1x8b, Core Size: 32-Bit, Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V, Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART, Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT, Supplier Device Package: 64-LQFP (10x10), Grade: Automotive, Qualification: AEC-Q100.