NAND16GW3B6DPA6F TR Micron Technology Inc.
Виробник: Micron Technology Inc.
Description: IC FLSH 16GBIT PARALLEL 114LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 114-LFBGA
Mounting Type: Surface Mount
Memory Size: 16Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NAND
Memory Format: FLASH
Supplier Device Package: 114-LFBGA (12x16)
Write Cycle Time - Word, Page: 25ns
Memory Interface: Parallel
Access Time: 25 ns
Memory Organization: 2G x 8
DigiKey Programmable: Not Verified
Description: IC FLSH 16GBIT PARALLEL 114LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 114-LFBGA
Mounting Type: Surface Mount
Memory Size: 16Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NAND
Memory Format: FLASH
Supplier Device Package: 114-LFBGA (12x16)
Write Cycle Time - Word, Page: 25ns
Memory Interface: Parallel
Access Time: 25 ns
Memory Organization: 2G x 8
DigiKey Programmable: Not Verified
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Технічний опис NAND16GW3B6DPA6F TR Micron Technology Inc.
Description: IC FLSH 16GBIT PARALLEL 114LFBGA, Packaging: Tape & Reel (TR), Package / Case: 114-LFBGA, Mounting Type: Surface Mount, Memory Size: 16Gbit, Memory Type: Non-Volatile, Operating Temperature: -40°C ~ 85°C (TA), Voltage - Supply: 2.7V ~ 3.6V, Technology: FLASH - NAND, Memory Format: FLASH, Supplier Device Package: 114-LFBGA (12x16), Write Cycle Time - Word, Page: 25ns, Memory Interface: Parallel, Access Time: 25 ns, Memory Organization: 2G x 8, DigiKey Programmable: Not Verified.